Patents
Patents for H05K 13 - Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components (22,634)
11/2008
11/19/2008CN100435611C Self-adaptive light-source illuminating system and method for paster
11/19/2008CN100435610C Method and device for deciding support portion position in a backup device
11/19/2008CN100435314C Adjustable tool holder
11/19/2008CN100435311C Apparatus and method for removing semiconductor chip
11/19/2008CN100435303C Method for aligning the bondhead of a die bonder
11/19/2008CN100434344C Method for connecting component delivery tapes, structure of the connection, and scissors for component delivery tape, used for the connection method
11/18/2008US7452732 Comparing identifying indicia formed using laser marking techniques to an identifying indicia model
11/18/2008US7452315 Tool exchange device and tool
11/18/2008US7452215 Ball grid array rework using a continuous belt furnace
11/13/2008WO2008135821A1 Method and device for aligning a test system and an electric member to be tested
11/13/2008WO2008135370A2 Automatic placement machine for placing electrical and/or optical components on substrates
11/13/2008WO2008089524A3 A modular feeding and transportation unit
11/13/2008US20080277469 Closed-Loop Reel Setup Verification and Traceability
11/13/2008DE202008011374U1 Thermodeneinheit zum Verbinden und/oder zum elektrischen Kontaktieren von elektrischen und/oder elektronischen Bauteilen sowie Vorrichtung zum Herstellen von mikroelektronischen Bauelementen und/oder Baugruppen Thermode unit for connecting and / or for the electrical contacting of electrical and / or electronic components, as well as apparatus for producing microelectronic components and / or subassemblies
11/13/2008DE202008011269U1 Inspektionskamerasystem Inspection Camera System
11/13/2008DE102007046432A1 Carrier foil fixing device for unpacked semiconductor chip, has tensioning device between outer regions of carrier foil for tightening foil, and tension unit angularly movable on surface of foil
11/13/2008DE102007046431A1 Electronic component e.g. semiconductor chip, separating device, has application device for attaching carrier foil at curved surface so that contact surface between foil and components is reduced due to mechanical rigidity of components
11/13/2008DE102007046282A1 Supporting pin for supporting substrate i.e. printed circuit board, has spring element and damper element cooperated with each other such that spring element and damper element form spring-damper system
11/13/2008DE102007044778A1 Connecting element for use in connecting tool, is made of ferromagnetic material such as ferromagnetic brass ferrous alloy, where component belts are connected with each other by splice zipper by plastic deformation of element
11/13/2008DE102007019535A1 Schneidvorrichtung zum Kürzen von Bauelementgurten, Zuführeinrichtung und Bestückautomat Cutting device for shortening component tapes, feeder and automatic placement
11/12/2008CN100433963C Method for handling boards in commponent mounting machine and oomponent mounting machine for performing the method
11/12/2008CN100433962C Method of generating image and illumination device for inspecting substrate
11/11/2008US7448130 Tape feeder for component mounter providing stable tape feeding
11/11/2008US7448129 Peel-off plate for an electronic-part delivery system
11/06/2008WO2008133324A1 Vacuum suction nozzle
11/06/2008WO2008132049A1 Pcb assembly machine and method for mounting components onto substrates
11/06/2008US20080271312 Ball grid array rework using a continuous belt furnace
11/06/2008DE19750605B4 Verfahren zum temporären Aufbringen von zusätzlichen Informationen auf Gegenstände bei deren Herstellung A method for temporary application of additional information on items during their preparation
11/06/2008DE102008019324A1 Verfahren zur Bauelementdetektion A method for detecting component
11/06/2008DE102007028723B3 Method for inspection of printed circuit board, involves testing reference image of proper printed circuit board and test image of printed circuit board, and reference printed circuit board and memory of image are digitally scanned
11/06/2008DE102007019073A1 Verfahren und Vorrichtung zum Aufbringen von Medien auf flächige Substrate Method and apparatus for applying media to flat substrates
11/06/2008DE102007018312A1 Printed circuit board transporting device for use during production of electronic device, has drive arranged in such manner that sensor is adjusted relative to transportation direction of transportation section below predetermined angle
11/05/2008EP1988540A2 Driver
11/05/2008CN201146668Y Jumper horizontal plug-in machine
11/05/2008CN201146667Y Lifting/lowering device for electronic private facilities worktable
11/05/2008CN201146666Y Machine for transplanting circuit board
11/05/2008CN201146665Y Fixed case for PCB plate
11/05/2008CN101299916A Component mounting apparatus
11/05/2008CN101299915A Electronic component mounting apparatus
11/05/2008CN100431399C Device for extracting electronic components
11/04/2008US7445688 Method and apparatus for picking up work piece and mounting machine
11/04/2008US7445647 Method for making a single unit fuel cell
10/2008
10/30/2008WO2008128300A1 Implant assembly
10/30/2008US20080266779 Drive carrier for computer systems
10/30/2008US20080266741 Conditioner With Coplanar Conductors
10/30/2008US20080263858 Method of mounting electronic component and electronic component mounting apparatus
10/30/2008US20080263856 Tape feeder for chip mounter
10/30/2008DE102007017258A1 Zuführung von Flächenmagazinen mittels einer Transportstrecke eines Leiterplatten-Transportsystems mit mehreren Transportstrecken Feeding box magazines by a transport path of a Printed circuit board conveying system with several transport paths
10/29/2008EP1986484A2 Electronic component mounting apparatus
10/29/2008EP1986483A2 Electronic component mounting method and electronic component mounting apparatus
10/29/2008EP1986204A2 Component detection method
10/29/2008EP1985164A1 Method for producing an electronic module by sequential fixation of the components
10/29/2008EP1984945A2 A semiconductor process system having an optical instrument comprising an apparatus for aligning an optical device with an object
10/29/2008EP1687114A4 Vertical removal of excess solder from a circuit substrate
10/29/2008EP1330151B1 Device and method for mounting parts
10/29/2008CN201142816Y Pin-leveling machine for pin planeness of electronic component
10/29/2008CN201142303Y Anti-impact element mounting structure
10/29/2008CN201140925Y Feeding machine
10/29/2008CN101296611A Camera position correction apparatus and method for surface installation machine
10/29/2008CN101296610A Tape feeder for chip mounter
10/29/2008CN101296609A Automatic positioning mechanism for surface labeling type electronic component
10/29/2008CN101296608A Removing device of transfer machine
10/29/2008CN101296607A Circuit board bearing device and circuit board fixing method
10/29/2008CN101296606A PCB real installing method
10/29/2008CN101296581A Laser processing bearing device of flexible circuit board
10/29/2008CN101296579A Station transplantation device of multi-gang circuit board
10/29/2008CN101296568A Method for soft and hard compound circuit board exerting electromagnetic shielding and system for implementing the same
10/29/2008CN101295626A Method and device for stripping chip from glue film
10/29/2008CN101293356A Cutting device for shortening component belts, supply device and automatic loader
10/29/2008CN101293355A Cutting device for shortening component belts, supply device and automatic loader
10/28/2008US7442000 Method and device for extracting electronic components from tubes and electronic component feeding device
10/23/2008WO2008125186A2 Device and method for processing flat substrates, as for printing circuit boards or the like
10/23/2008US20080262642 Component Mounting Order Deciding Method and Component Mounting Order Deciding Apparatus
10/23/2008US20080261338 Method For Manufacturing an Electronics Module Comprising a Component Electrically Connected to a Conductor-Pattern Layer
10/23/2008US20080260370 Optical System
10/23/2008US20080256791 Fixturing a head spindle assembly with an expanding collet
10/23/2008DE112006003019T5 Elektronikmontagevorrichtung mit eingebauter Lötpastenprüfung Electronics assembly device with built Lötpastenprüfung
10/23/2008DE102007018555A1 Kabelbearbeitungseinrichtung Wire-processing device
10/23/2008DE102007017120A1 Zuordnung zwischen Gebinde-Aufnahmefach und Bauelement-Zuführvorrichtung mittels Führungselement Association between container-receiving compartment and component supply device by means of guide element
10/22/2008CN201138915Y Sequence ordering machine
10/22/2008CN201138914Y Dismantling device for braiding electronic component
10/22/2008CN101288609A Instrument for the insertion of an intervertebral articular prosthesis
10/22/2008CN100428875C 基底保持器 Substrate holder
10/22/2008CN100428448C Circuit apparatus and method of manufacturing the same
10/21/2008US7440812 Component mounting apparatus, service providing device and servicing method
10/21/2008US7437818 Component mounting method
10/16/2008US20080253077 Storage device
10/16/2008US20080251900 Conductor Frame For an Electronic Component and Method For the Production Thereof
10/16/2008US20080250636 Component Mounting Method and Apparatus
10/16/2008US20080250635 Component placement machine
10/15/2008EP1981327A2 Determining the position of packages filled with electronic components in a package uptake device
10/15/2008EP1981326A2 Allocation between package uptake compartment and component by means of guide element
10/15/2008EP1981325A2 Supply of magazines via the conveyor of a circuit board transport system with multiple conveyor paths
10/15/2008CN201135014Y Golden finger bending test apparatus for flexible printed circuit board
10/15/2008CN201135013Y Clamp component for PCB
10/15/2008CN101288357A Viscous material dispensing systems with parameter monitoring and methods of operating such systems
10/15/2008CN101287362A Determining the position of packages filled with electronic components in a package uptake device
10/15/2008CN101287361A Back-up table for chip mounter
10/15/2008CN101287360A Manufacturing process of surface adhesive
10/15/2008CN101287359A Allocation between package uptake compartment and component by means of guide element
1 ... 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 ... 227