Patents
Patents for H05K 13 - Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components (22,634)
09/2007
09/05/2007CN101032200A Pick and place machine with improved component pick up inspection
09/05/2007CN101032199A Maintenance method and component mounter
09/05/2007CN101031967A Components positioning device
09/05/2007CN101031808A Device for inspecting electronic component package
09/05/2007CN101031200A Mounted substrate inspection method/system and component mount board manufacturing method
09/05/2007CN101031199A Linear form and position adapting method based on pin
09/05/2007CN101031198A Parts supply device
09/05/2007CN101031186A Method for producing automatic-system inputting-outputting circuit board in hydroelectric power station
09/05/2007CN101031179A Method and device for digital CT detector module
09/05/2007CN100336430C Processing unit for chip type electronic component
09/04/2007US7266065 Apparatus for discriminating optical recording medium and method for discriminating optical recording medium
09/04/2007US7263890 Vacuum clamping detection method and vacuum clamping detector
08/2007
08/30/2007WO2007096220A1 Method for applying electronic components to a substrate strip and bringing the same into electrical contact
08/29/2007EP1827073A1 Action time shortening method, action time shortening device, program, and parts mounting machine
08/29/2007EP1827072A1 Method for guiding a tape as well as flexible strip background
08/29/2007EP1825731A1 Thermal attach and detach methods and systems for surface-mounted components
08/29/2007EP1683405B1 Chip remover
08/29/2007CN200941733Y Welding apparatus
08/29/2007CN200941732Y Welder
08/29/2007CN200941478Y Electrical connector assembly
08/29/2007CN101027953A Method for packaging radiation elements and a package
08/29/2007CN101026953A Pressure mounting device and pressure mounting method
08/29/2007CN101026952A Electronic component mounting method and device
08/29/2007CN101026951A Method for guiding a tape as well as flexible strip
08/29/2007CN101025398A Hollow-bulge analyzing method for micro-pore after filled by copper
08/29/2007CN100334932C Part mounting recognition mark recognition device and method
08/29/2007CN100334592C Visual contraposition method of not corresponding basis material
08/28/2007US7262480 Semiconductor device, and method and apparatus for manufacturing semiconductor device
08/28/2007US7261350 Negative pressure attraction device and attraction confirming sensor
08/28/2007US7261207 Method for carrying a semiconductor device
08/23/2007WO2007093709A1 Method for producing an electronic module by sequential fixation of the components
08/23/2007US20070196719 Device for assembling a banded fuel cell stack
08/23/2007DE19901623B4 Verfahren und Vorrichtung zur thermischen Verbindung von Anschlußflächen zweier Substrate Method and apparatus for the thermal connection of connecting surfaces of two substrates
08/23/2007DE10236004B4 Vorrichtung zum Bestücken von Substraten mit elektrischen Bauelementen Device for fitting substrates with electrical components
08/23/2007DE102006005941A1 Halter für eine flexible Leiterplatte Holder for a flexible printed circuit board
08/22/2007EP1821589A1 Electronic component mounting apparatus
08/22/2007CN2938734Y Image collection device for reference measuring and tin paste printing detection
08/22/2007CN2938733Y Hole aligning positioning device
08/22/2007CN2938732Y Conveying device of circuit board
08/22/2007CN2938731Y Assembling tool for contact screen
08/22/2007CN101023523A Gripper unit, mounting head, and method for fitting substrates with electrical components
08/21/2007US7259483 Linear driving mechanism of electronic components mounting apparatus
08/16/2007WO2007091499A1 Component mounter control method and component mounter
08/16/2007WO2007091498A1 Method of determining pickup order of components
08/16/2007WO2007091196A2 A semiconductor process system having an optical instrument comprising an apparatus for aligning an optical device with an object
08/16/2007WO2007090483A1 Positioning arm for an automatic placement machine for fitting electrical components to substrates
08/16/2007WO2007001179A3 Method and device for supplying and discharging carriers with electronic components
08/16/2007US20070190693 Semiconductor chip package having an adhesive tape attached on bonding wires
08/16/2007DE10313255B4 Transfer-Kopf für eine Vorrichtung zum Transportieren von Bauelementen sowie Vorrichtung mit einem solchen Transferkopf Transfer head for a device for transporting devices and device with such a transfer head
08/15/2007CN2935735Y Maintaining device for circuit board
08/15/2007CN2935734Y Assembled type production line control console
08/15/2007CN1332594C Belt controlled disk supporting device for electronic parts feeding box
08/15/2007CN101019478A Loading system and method for loading substrates with electrical components
08/15/2007CN101019477A Wafer table for preparing electrical components and device for equipping substrates with the components
08/15/2007CN101019009A Method for weighing a product, weighing system and loading device
08/15/2007CN101018478A System for handling components at a component mounting machine
08/15/2007CN101018477A 表面安装机 Surface mounting machine
08/15/2007CN101018476A Parts supplying device
08/14/2007US7254886 Interface device with a releasable mount
08/09/2007US20070181644 Component mounting method and component mounting apparatus
08/09/2007DE19608121B4 Zuführeinrichtung und Verfahren zum Zuführen eines durchgehenden Streifens von an einer Oberfläche anzubringenden Kontakten zu einer Einrichtung zum Anbringen auf einer Oberfläche And feeding method for feeding a continuous strip of a surface to be attached to contacts to a device for mounting on a surface
08/09/2007DE102006003735A1 Anordnung zum Befestigen von elektronischen Bauelementen auf einem Träger Arrangement for mounting of electronic components on a carrier
08/08/2007EP1816906A1 Component mounting method and component mounting apparatus
08/08/2007EP1815729A2 Apparatus for packaging electronic components
08/08/2007EP1510118B1 Method for measuring the deformation of a surface positioning device
08/08/2007CN2932935Y Full-automatic surface mounting machine
08/08/2007CN2931407Y Bearing shelf tilt angle adjusting device for inclined stand type retraction plate machine
08/08/2007CN1331228C Mixed type module
08/08/2007CN1330549C Carrier tape connecting method using this connecting
08/08/2007CN1330435C Electronic component conveying device
08/08/2007CN101013674A Apparatus and method for manufacturing semiconductor device
08/02/2007WO2007085075A1 Electrostatic discharge monitoring and manufacturing process control system
08/02/2007DE102006019847B3 Verlegemodul für ein elektronisches Jigboard Installation module for an electronic Jigboard
08/02/2007DE102005058282B3 Bestückkopf zum Bestücken von Substraten mit elektrischen Bauteilen Placement head for populating substrates with electrical components
08/02/2007DE102005033979B4 Bestücksystem und Verfahren zum Bestücken von Substraten mit elektrischen Bauteilen Assembling system and method for populating substrates with electrical components
08/01/2007EP1814375A2 Electronic component mounting apparatus
08/01/2007EP1813138A1 Device for fitting component supports with components
08/01/2007EP1559304A4 Vision inspection apparatus using a full reflection mirror
08/01/2007CN1329969C Chip pick-up device and producing method thereof and production apparatus of semiconductor
08/01/2007CN1329130C Microdeposition control system and method
08/01/2007CN101010994A Method for manufacturing an electronics module
08/01/2007CN101009999A Electronic device mounting apparatus
08/01/2007CN101009998A Electronic device mounting apparatus
08/01/2007CN101009997A Component suction method
08/01/2007CN101009996A Supporting unit and pick-up apparatus having the same
08/01/2007CN101009968A Electronic carrier board
07/2007
07/31/2007US7251541 Substrate-related-operation performing system including operation-performing-program judging device, and operation-performing-program judging program
07/31/2007US7250785 Method and apparatus for inspecting printed circuit boards
07/26/2007WO2007082933A2 Micromechanical placement system, and corresponding device
07/26/2007WO2007082611A1 Apparatus and method for transferring a plurality of chips from a wafer to a substrate
07/25/2007EP1811829A1 Method and device for extracting electronic components from tubes and device for supplying electronic components
07/25/2007EP1811828A1 Micromechanical placement system, and corresponding device
07/25/2007CN1328939C Component placing head and component placing method
07/25/2007CN1328938C Driving apparatus for high acceleration revolution axis and application method thereof
07/25/2007CN101005757A Device for digital pneumatic regulating sheet adhesive machine pick-up head pressure
07/25/2007CN101005735A Alignment plate
07/25/2007CN101005734A Alignment plate
07/25/2007CN101005733A Method for producing thin semiconductor lighting plane integrated optic source module
07/25/2007CN101004980A 外部电极形成方法 The external electrode forming method
07/25/2007CN101003040A Two direction grasping platform of adhering pieces machine