Patents
Patents for H05K 13 - Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components (22,634)
02/2007
02/20/2007US7181089 Method and apparatus for searching for fiducial marks, and method of detecting positions of the fiducial marks
02/20/2007US7181058 Method and system for inspecting electronic components mounted on printed circuit boards
02/20/2007US7178225 Component pressing device
02/16/2007CA2556133A1 Rfid inlays and methods of their manufacture
02/15/2007WO2007017938A1 Chip part mounting member
02/15/2007US20070035938 Printed circuit board assembly
02/15/2007US20070034695 Method of determining at least one marking element on a substrate
02/15/2007US20070034314 Component feeder having a high density cover tape reservoir
02/15/2007DE102005021100B4 Verfahren und Vorrichtung zur Bestückung eines Schaltungsträgers mit zumindest einem neigungssensitiven Element Method and device for mounting of a circuit carrier with at least a tilt sensitive element
02/14/2007EP1753284A1 Part feeding head device and part mounting head device
02/14/2007EP1123525B2 Device and method for the optical inspection of concealed soldered connections
02/14/2007CN2870413Y Device for preprocessing electronic element of electric-power automation apparatus
02/14/2007CN2870412Y Carriage automatic foot-cutting machine
02/14/2007CN2870389Y Fully-automatic circuit-board clinch-bolt connector machine
02/14/2007CN1914969A Device for automatically mounting electronic part and part stock management device
02/14/2007CN1913769A Method and device for obtaining image for electronic component
02/14/2007CN1301052C Filtration of flux contaminants device and method
02/14/2007CN1300572C Detecting device of printed circuit board for mounting electronic element and figure poorness identification method
02/14/2007CN1300546C Illumination device, recognizing device with the illumination device, and part mounting device
02/14/2007CN1299875C Part mounting machine
02/13/2007US7174633 Method of connecting terminal and electric wire
02/08/2007WO2007015568A2 Bulk component feeder
02/08/2007WO2007015561A1 Electronic component mounter and mounting method
02/08/2007WO2007014880A1 Method for transferring and device for handling electronic components
02/08/2007WO2006078000A3 Electronic component mounting system, electronic component mounting device, and electronic component mounting method
02/08/2007DE10314462B4 Anordnung zum Prüfen von elektrischen Leiterplatten Arrangement for testing electrical circuit boards
02/08/2007DE102005038522A1 Laser cutting machine is used to separate electronic circuit boards that are moved by linear motors
02/08/2007DE10008648B4 Dispenservorrichtung Dispensing mechanism
02/07/2007EP1046127A4 Method and apparatus for three-dimensional inspection of electronic components
02/07/2007CN2867813Y Swing-type electronic element paster
02/07/2007CN2867812Y Device for adjusting pressure of paster pick head using by digital pressure
02/07/2007CN2867811Y Material releasing device used by printing circuit board make-up machine
02/07/2007CN1910973A Screen printer
02/07/2007CN1909775A Connector unit, circuit assembly, and electronic device
02/07/2007CN1908636A Film-carried appearance detection method and device for mounting electronic elements
02/07/2007CN1299556C Pick and place equipment with component placement inspection function
02/07/2007CN1299555C Method of and device for packaging electronic components thus packaged
02/07/2007CN1299545C Electronic device
02/06/2007US7171742 Method and system for assembling a printed circuit board using a land grid array
02/01/2007WO2007013341A1 Electronic component device testing apparatus
02/01/2007WO2007012525A1 Device of a modular construction for loading substrates
02/01/2007WO2006125102A8 Method and apparatus for evaluating a component pick action in an electronics assembly machine
02/01/2007WO2006078068A3 Electronic component mounting system and electronic component mounting method
02/01/2007US20070023931 Carrier tape for electronic components
02/01/2007US20070023138 Gluing method and device
02/01/2007DE102005033979A1 Bestücksystem und Verfahren zum Bestücken von Substraten mit elektrischen Bauteilen Assembling system and method for populating substrates with electrical components
01/2007
01/31/2007EP1748381A1 Installation for production of electronic modules or circuit boards comprising RFID-chips
01/31/2007EP1747706A2 Support with solder globule elements and a method for assembly of substrates with globule contacts
01/31/2007EP1747430A2 Method for weighing a product, weighing system and loading device
01/31/2007CN2865215Y Extracting two-way flatform for tablet sticking machine
01/31/2007CN2865214Y Surface mounting machine
01/31/2007CN2865192Y Positioning device for circuit board temporary storage shelf
01/31/2007CN1906983A Micro-electromechanical sub-assembly having an on-chip transfer mechanism
01/31/2007CN1906526A Method for gravure printing transparent electrodes, and ink composition therefor
01/31/2007CN1298205C Work piece holding apparatus, work piece illumination apparatus and work piece inspection system
01/30/2007US7170045 Apparatus having at least two image recording devices and its method for placing at least one component in a desired position on a substrate
01/25/2007WO2007009848A1 Loading system and method for loading substrates with electrical components
01/25/2007DE19752176B4 Herstellungssystem für bestückte Leiterplatten und zugehöriges Verfahren Production system for printed circuit board assemblies and associated method
01/25/2007DE112004002098T5 Gerät und Verfahren zur Verteilung von in Balken eingeführten Komponenten durch einen Modulriemen Apparatus and method for distribution of imported components into bars by a module belt
01/24/2007EP1746874A2 Electronic component feeder and electronic component feeding method
01/24/2007EP1671525B1 Component mounting method and apparatus
01/24/2007EP1277382B1 Feeder for electric compounds which are taken up in a belt
01/24/2007EP1266550B1 Device for conveying printed boards
01/24/2007CN2862593Y Terminal bench assembling apparatus
01/24/2007CN1901794A Solder joint determination method, solder inspection method, and solder inspection device
01/24/2007CN1901780A Board cleaning apparatus and board transporting apparatus
01/24/2007CN1296984C Substrate alignment method and apparatus
01/23/2007US7167768 Board work system having provision for establishing operating environment suitable for operator, and process of establishing the suitable operating environment
01/23/2007US7166252 Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board
01/23/2007US7165318 Components placing apparatus
01/18/2007WO2007007912A1 Tape feeder
01/18/2007WO2007006598A1 Method for soldering a printed circuit board with the aid of a lead-free soldering paste in a reflow soldering furnace, a printed circuit board for carrying out said method and a reflow soldering furnace
01/18/2007WO2007006404A1 Method and device for loading and unloading elements into/from a carrier element
01/18/2007WO2006084852A3 Method for feeding components, and pick-and-place machine
01/18/2007WO2006079577A3 Wafer table for preparing electrical components and device for equipping substrates with the components
01/18/2007WO2005015972A3 Device for equipping flat substrates with electrical components
01/18/2007DE112004002140T5 Bestückungsmaschine mit Bildaufnahmevorrichtung Pick and place machine with imaging device
01/18/2007DE10305370B4 Bestückkopf, Bestückvorrichtung und Verfahren zum Bestücken von Bauelementen auf einen Bauelementeträger Placement, placement device and method for placing components on a component support
01/17/2007EP1623614B1 Dry cabinets for use in moisture sensitive device management in electronics manufacturing
01/17/2007CN2859998Y Strain gage pasting tool
01/17/2007CN1899007A Positioning device
01/17/2007CN1897807A Component mounting apparatus
01/17/2007CN1897806A Method for arranging solid tin on circuit board
01/17/2007CN1897790A Separation of printing circuit board component
01/17/2007CN1295947C Electronic component, component mounting equipment, and component mounting method
01/16/2007US7164281 Circuit board component ambient moisture exposure monitoring
01/16/2007US7163137 Method of manufacturing mounting boards
01/11/2007WO2007002995A1 Fabrication of electronic components in plastic
01/11/2007WO2006099832A3 Linear transport system and method for the highly precise transport of small components
01/11/2007WO2006076995A3 Pick-and-place machine comprising a locking device for coupling a feeding unit to it
01/11/2007WO2006057776A3 Apparatus for packaging electronic components
01/11/2007US20070010969 Pick and place machine with improved setup and operation procedure
01/10/2007EP1742294A2 A method and a device for manufacturing a roll of items
01/10/2007CN1895013A Dual stage pre-heater
01/10/2007CN1895012A A method and device for exposing electronic components
01/10/2007CN1894787A Apparatus and method for removing semiconductor chip
01/10/2007CN1894078A Part mounting head, pick-up nozzle, pick-up nozzle manufacturing method
01/10/2007CN1893813A Interference detection method, interference detection arrangement, surface mounting machine having the device and mounting system
01/10/2007CN1893812A Board supporting mechanism, board supporting method, and component mounting apparatus and component mounting method using the same mechanism and method
01/10/2007CN1893811A 电子部件安装装置 The electronic component mounting apparatus