H01L - Semiconductor devices; Electric solid state devices not otherwise provided for

More topics under "H01L - Semiconductor devices; Electric solid state devices not otherwise provided for" (1,780,774)
H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
H01L 23 - Details of semiconductor or other solid state devices (226,155)
H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
H01L 27 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate (229,248)
H01L 29 - Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier; Capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. pn-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof (218,143)
H01L 31 - Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (138,256)
H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
H01L 35 - Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting seebeck or peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (11,417)
H01L 37 - Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using nernst-ettinghausen effect; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (2,013)
H01L 39 - Devices using superconductivity or hyperconductivity; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (12,014)
H01L 41 - Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (34,459)
H01L 43 - Devices using galvano-magnetic or similar magnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (12,001)
H01L 45 - Solid state devices specially adapted for rectifying, amplifying, oscillating, or switching without a potential-jump barrier or surface barrier, e.g. dielectric triodes; Ovshinsky-effect devices; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (8,424)
H01L 47 - Bulk negative resistance effect devices, e.g. gunn-effect devices; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (2,062)
H01L 49 - Solid state devices not provided for in groups and and not provided for in any other subclass; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (3,461)
H01L 51 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof (83,948)

Patents for H01L - Semiconductor devices; Electric solid state devices not otherwise provided for (4,363)
04/2009
04/07/2009	US7514214 coating a nanostructure with a passivation layer and altering the passivation layer to form biosensors capable of detecting specific molecules and changes in (inter)molecular dynamics in combination with fluorescence detection
04/02/2009	WO2005059970A3 Controlling removal rate uniformity of an electropolishing process in integrated circuit fabrication
04/02/2009	WO2005050717A3 Micro-transducer and thermal switch for same
04/02/2009	WO2005041255A3 Coating composition optimization for via fill and photolithography applications and methods of preparation thereof
04/02/2009	WO2005038859A3 Liquid cooling system
04/02/2009	WO2005029548A3 System and process for providing multiple beam sequential lateral solidification
04/01/2009	EP1687844A4 Method of forming a low voltage gate oxide layer and tunnel oxide layer in an eeprom cell
04/01/2009	EP1652295A4 Temperature-insensitive bias circuit for high-power amplifiers
04/01/2009	EP1618599A4 Method of making a nanogap for variable capacitive elements and device having a nanogap
04/01/2009	CN100474634C Enhanced photodetector
03/2009
03/31/2009	US7510818 Reversible contrast enhancement layer (R-CEL) in optical lithography, lithography mask inspection and writing and optical storage
03/26/2009	WO2004109748A3 Supporting shelf for front opening unified pod
03/24/2009	US7508672 Cooling system
03/24/2009	US7508668 Electric power converter and mounting structure of semiconductor device
03/18/2009	CN100470675C Programmable interconnect cell switch circuit structure and method for field programmable gate array
03/18/2009	CN100470381C A method of patterning photoresist on a wafer using an attenuated phase shift mask
03/17/2009	US7506126 Detection circuit for mixed asynchronous and synchronous memory operation
03/17/2009	US7504704 Shallow trench isolation process
03/12/2009	US20090067958 Stacked process modules for a semiconductor handling system
03/11/2009	CN101385141A Semiconductor alignment aid
03/11/2009	CN100468648C Atomic layer deposition of high k metal oxide
03/05/2009	US20090057660 Method of fabricating substrateless thin film field-effect devices and an organic thin film transistor obtainable by the method
03/04/2009	CN100466175C Method of forming freestanding semiconductor layer
02/2009
02/26/2009	WO2005057617A3 Bond wireless package
02/25/2009	EP1685597A4 High-temperature devices on insulator substrates
02/25/2009	CN101375382A Semiconductor device package and method for manufacturing same
02/25/2009	CN101373713A Semiconductor wafer processing to increase the usable planar surface area
02/24/2009	US7495882 Electronic components comprising adjustable-capacitance micro-electro-mechanical capacitors
02/24/2009	US7495341 Methods and apparatus for packaging integrated circuit devices
02/24/2009	US7495291 Strained dislocation-free channels for CMOS and method of manufacture
02/19/2009	US20090045181 Systems and methods for processing thin films
02/18/2009	CN100463125C Lead frame routed chip pads for semiconductor packages and manufacturing method thereof
02/17/2009	US7493506 Programmable system on a chip for power-supply voltage and current monitoring and control
02/17/2009	US7492522 Optical detector for a particle sorting system
02/17/2009	US7492183 Programmable system on a chip for power-supply voltage and current monitoring and control
02/17/2009	US7490637 Transportable container including an internal environment monitor
02/12/2009	US20090042330 Etching Of Solar Cell Materials
02/12/2009	US20090039457 Low crosstalk substrate for mixed-signal integrated circuits
02/12/2009	US20090039312 Etching Of Solar Cell Materials
02/11/2009	CN100461369C A method for depositing a metal layer on a semiconductor interconnect structure
02/11/2009	CN100461194C Method of optimizing glass strain
02/05/2009	US20090031947 Reactor
02/03/2009	US7487474 Designing an integrated circuit to improve yield using a variant design element
02/03/2009	US7487376 Programmable system on a chip
02/03/2009	US7486437 Apparatus and method for optical amplification in indirect-gap semiconductors
01/2009
01/29/2009	US20090027137 Tapered dielectric and conductor structures and applications thereof
01/29/2009	DE10117880B4 Verfahren zum Vereinzeln von elektronischen Bauteilen aus einem Verbund A method of separating electronic components from a composite
01/27/2009	US7483196 Apparatus for multiple beam deflection and intensity stabilization
01/27/2009	US7482681 Semiconductor device package utilizing proud interconnect material
01/27/2009	US7482208 Thin film transistor array panel and method of manufacturing the same
01/22/2009	US20090021293 Low-Power Integrated-Circuit Signal Processor With Wide Dynamic Range
01/22/2009	US20090019796 Low Profile Mounting System
01/21/2009	EP1654753A4 Semiconductor device package and method for manufacturing same
01/20/2009	US7480760 Rotational use of memory to minimize write cycles
01/20/2009	US7479686 Backside imaging through a doped layer
01/20/2009	US7479462 Thin films and methods for the preparation thereof
01/20/2009	US7479398 Methods and apparatus for packaging integrated circuit devices
01/20/2009	CA2505065C Rear interconnect blade for rack mounted systems
01/15/2009	US20090014655 Coupling and Method for a Transition-Edge Bolometer
01/14/2009	EP1680805A4 Wafer carrier door
01/14/2009	EP1647028B1 1t1c sram
01/13/2009	US7476893 Vertical organic field effect transistor
01/08/2009	US20090011535 Apparatus and Method of Manufacturing Solar Cells
01/06/2009	US7474933 System and method for automating integration of semiconductor work in process updates
01/06/2009	US7473500 Binary half tone photomasks and microscopic three-dimensional devices and method of fabricating the same
01/01/2009	US20090001493 Electronic imaging device
12/2008
12/31/2008	EP1636831A4 Three-dimensional integrated circuit structure and method of making same
12/30/2008	US7470597 Method of fabricating a multilayered dielectric diffusion barrier layer
12/25/2008	US20080318793 Method For Producing a Superconductive Element
12/25/2008	US20080318030 Laser transfer articles and method of making
12/25/2008	US20080315170 Quantum coherent switch utilizing commensurate nanoelectrode and charge density periodicities
12/24/2008	EP1665389A4 Method of filling structures for forming via-first dual damascene interconnects
12/24/2008	CN101330086A Noise suppression for open bit line DRAM architectures
12/24/2008	CN101329904A Noise suppression for open bit line DRAM architectures
12/23/2008	US7468503 Pin photodetector with mini-mesa contact layer
12/18/2008	WO2005048314A3 Tapered dielectric and conductor structures and applications thereof
12/18/2008	US20080309393 Clock-generator architecture for a programmable-logic-based system on a chip
12/18/2008	US20080308841 Semiconductor Substrate, Semiconductor Device and Method of Manufacturing a Semiconductor Substrate
12/17/2008	CN100444462C Ferroelectric devices and method relating thereto
12/17/2008	CN100444413C Split poly-SiGe/poly-Si alloy gate stack
12/17/2008	CN100444387C Dynamic memory based on single electron stroage
12/16/2008	US7465649 Method of forming a split poly-SiGe/poly-Si alloy gate stack
12/11/2008	US20080303547 Programmable system on a chip for temperature monitoring and control
12/11/2008	US20080302676 For detecting biological and chemical species in liquid and gaseous phase; utilizes carbon nanotubes to enhance sensitivity and selectivity towards the reacting species by decreasing interference and detecting a wide range of concentrations; polymer and sensing element immobilized to the carbon nanotube
12/10/2008	EP1579495A4 Method for fabrication of semiconductor device
12/10/2008	EP1563572A4 Rear interconnect blade for rack mounted systems
12/10/2008	CN101322127A Clocktree tuning shims and shim tuning method
12/09/2008	US7464351 Method enabling a standard CMOS fab to produce an IC to sense three-dimensional information using augmented rules creating mask patterns not otherwise expressible with existing fab rules
12/09/2008	US7464192 Programmable serial interface for a semiconductor circuit
12/04/2008	WO2005059956A3 Polymorphic automatic test systems and methods
12/04/2008	US20080296690 Metal interconnect System and Method for Direct Die Attachment
12/03/2008	EP1697968A4 Two-component, rectifying-junction memory element
12/03/2008	CN100440422C Substrate support having dynamic temperature control
12/02/2008	US7459067 Semi-permanent reference electrode
11/2008
11/26/2008	CN100437970C Shallow trench isolation process
11/26/2008	CN100436284C Shipper with tooth design for improved loading
11/25/2008	US7458056 Effective proximity effect correction methodology
11/25/2008	US7455787 Etching of solar cell materials
11/18/2008	US7453123 Self-aligned planar double-gate transistor structure
11/18/2008	US7452475 Cleaning process and apparatus for silicate materials

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 ... 44