Patents
More topics under "H01L - Semiconductor devices; Electric solid state devices not otherwise provided for" (1,780,774)
H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
H01L 23 - Details of semiconductor or other solid state devices (226,155)
H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
H01L 27 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate (229,248)
H01L 29 - Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier; Capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. pn-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof (218,143)
H01L 31 - Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (138,256)
H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
H01L 35 - Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting seebeck or peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (11,417)
H01L 37 - Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using nernst-ettinghausen effect; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (2,013)
H01L 39 - Devices using superconductivity or hyperconductivity; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (12,014)
H01L 41 - Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (34,459)
H01L 43 - Devices using galvano-magnetic or similar magnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (12,001)
H01L 45 - Solid state devices specially adapted for rectifying, amplifying, oscillating, or switching without a potential-jump barrier or surface barrier, e.g. dielectric triodes; Ovshinsky-effect devices; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (8,424)
H01L 47 - Bulk negative resistance effect devices, e.g. gunn-effect devices; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (2,062)
H01L 49 - Solid state devices not provided for in groups and and not provided for in any other subclass; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (3,461)
H01L 51 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof (83,948)
Patents for H01L - Semiconductor devices; Electric solid state devices not otherwise provided for (4,363)
12/2006
12/27/2006CN1886641A Methods and apparatus for in situ substrate temperature monitoring
12/26/2006US7153726 Semiconductor device with magnetically permeable heat sink
12/21/2006WO2005057622A3 Structure and method for iii-nitride device isolation
12/21/2006WO2005055281A3 Flexible electronics using ion implantation to adhere polymer substrate to single crystal silicon substrate
12/21/2006WO2005031803A3 Thermal processing system with cross flow injection system with rotatable injectors
12/21/2006WO2005017969A3 Optical detector for a particle sorting system
12/21/2006US20060286788 Method for making a wire nanostructure in a semiconductor film
12/21/2006US20060284308 Power converter and semiconductor device mounting structure
12/21/2006US20060284230 Vertical organic field effect transistor
12/21/2006US20060284058 System and method for integrated sensing and control of industrial processes
12/20/2006EP1685514A4 Bootstrap diode emulator with dynamic back-gate biasing
12/20/2006CN1883039A Method of forming a low voltage gate oxide layer and tunnel oxide layer in an EEPROM cell
12/20/2006CN1883033A Protecting thin semiconductor wafers during back-grinding in high-volume production
12/20/2006CN1882714A Cleaning process and apparatus for silicate materials
12/14/2006WO2005034193A3 Single scan irradiation for crystallization of thin films
12/14/2006WO2004109761A3 Gas distribution system
12/14/2006US20060279302 Probe card and method for using probe card, wafer prober utilizing same
12/14/2006US20060278956 Semiconductor wafer with non-rectangular shaped dice
12/14/2006DE112004002310T5 Trench-Metalloxid-Halbleiter-Feldeffekttransisstor mit geschlossenen Zellen Trench metal-oxide-semiconductor Feldeffekttransisstor closed cell
12/13/2006EP1613970A4 Method of restoring encapsulated integrated circuit devices
12/13/2006CN1879111A Bootstrap diode emulator with dynamic back-gate biasing
12/13/2006CN1878713A Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices
12/13/2006CN1878707A Shipper with tooth design for improved loading
12/13/2006CN1290164C Ruthenium silicide wet etch
12/13/2006CN1289720C Silicon wafer with controlled defect distribution and making method thereof
12/12/2006US7148465 Semiconductor photodetector with internal reflector
12/07/2006WO2005050714A3 High temperature electronic devices
12/07/2006WO2005038878A3 Developer-soluble materials and methods of using the same in via-first dual damascene applications
12/07/2006US20060275962 Three-dimensional integrated circuit structure and method of making same
12/07/2006US20060274313 Optical detector for a particle sorting system
12/07/2006US20060273462 System and method based on field-effect transistors for addressing nanometer-scale devices
12/06/2006EP1728286A1 An organic electronic device and methods for manufacturing a device of this kind
12/06/2006EP1547150A4 Photoconductor on active pixel image sensor
12/06/2006CN1875468A Method of making nonvolatile transistor pairs with shared control gate
12/06/2006CN1875466A Methods and apparatus for optimizing a substrate in a plasma processing system
12/06/2006CN1875364A Method of optimizing glass strain
12/06/2006CN1875298A Method of manufacturing optical film
12/06/2006CN1875244A Azimuthal scanning of a structure formed on a semiconductor wafer
12/05/2006US7145552 Electric field proximity keyboards and detection systems
11/2006
11/30/2006US20060270136 High performance strained cmos devices
11/30/2006US20060268545 Light emitting panel assemblies
11/30/2006US20060267558 Electronic components comprising adjustable-capacitance micro-electro-mechanical capacitors
11/30/2006US20060267148 Solid-state high power device and method
11/29/2006CN1871712A Bifet including a fet having increased linearity and manufacturability
11/29/2006CN1871691A Monitoring system comprising infrared thermopile detetor
11/29/2006CN1871664A Zener-zap memory
11/29/2006CN1871592A Method and system for enhancing the endurance of memory cells
11/29/2006CN1871522A Method for forming photo-defined micro electrical contacts
11/28/2006US7141933 Systems and methods for a transformer configuration for driving multiple gas discharge tubes in parallel
11/28/2006US7141489 Fabrication of p-type group II-VI semiconductors
11/28/2006US7141440 Apparatus and method for measuring a property of a layer in a multilayered structure
11/23/2006WO2005024908A3 Laser transfer articles and method of making
11/23/2006WO2005008725A3 Nested voltage island architecture
11/23/2006US20060263953 Method of fabricating substrateless thin film field-effect devices and an organic thin film transistor obtainable by the method
11/23/2006US20060263177 Linear semiconductor processing facilities
11/23/2006DE10304777B4 Verfahren zur Herstellung eines Chipnutzens mittels eines Hitze- und Druckprozesses unter Verwendung eines thermoplastischen Materials und Vorrichtung zur Durchführung des Verfahrens A process for producing a chip by means of a utility heat and pressure process using a thermoplastic material and apparatus for carrying out the method
11/22/2006EP1723682A1 Thin film solar cell and manufacturing method
11/22/2006CN1868082A Connection assembly for promoting electrical isolation
11/22/2006CN1868065A Integrated circuit package having an inductance loop formed from a multi-loop configuration
11/22/2006CN1867896A System and method for on-tool semiconductor simulation
11/16/2006WO2006120291A1 Method for producing a superconductive element
11/16/2006WO2006120290A1 Coupling and method for a transition-edge bolometer
11/16/2006WO2005045884A3 Optical amplification in semiconductors
11/16/2006WO2004084277A3 Retiming circuits using a cut-based approach
11/16/2006US20060258078 Atomic layer deposition of high-k metal oxides
11/16/2006US20060258056 Method for producing a chip panel by means of a heating and pressing process using a thermoplastic material
11/16/2006US20060256490 Zener-Zap Memory
11/16/2006US20060255832 Non-volatile memory architecture for programmable-logic-based system on a chip
11/16/2006US20060255425 Low crosstalk substrate for mixed-signal integrated circuits
11/15/2006EP1721339A1 Method and apparatus for in-line process control of the cigs process
11/15/2006EP1668682A4 Growth of high-k dielectrics by atomic layer deposition
11/15/2006EP1665363A4 Wafer-level moat structures
11/15/2006CN1864275A Split poly-SiGe/poly-Si alloy gate stack
11/15/2006CN1864253A 非易失性存储装置 Nonvolatile memory device
11/09/2006WO2006056643A3 Method for manufacturing an electronics module
11/09/2006WO2005048302A3 Method for integrating pre-fabricated chip structures into functional electronic systems
11/08/2006CN1860829A Light emitting component and method for manufacturing same
11/08/2006CN1860606A Electromagnetic noise shielding in semiconductor packages using caged interconnect structures
11/08/2006CN1860602A High performance strained cmos devices
11/08/2006CN1860591A Precision polysilicon resistor process
11/08/2006CN1860487A System and method for using first-principles simulation to analyze a process performed by a semiconductor processing tool
11/08/2006CN1860440A System and method for using first-principles simulation in a semiconductor manufacturing process
11/07/2006US7132700 SiGe layer having small poly grains
11/07/2006US7132678 Electronic device including a self-assembled monolayer, and a method of fabricating the same
11/02/2006WO2005022599A3 Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure
11/02/2006WO2004023528A3 A thinned semiconductor wafer and die and corresponding method
11/02/2006US20060246276 Conformable interface materials for improving thermal contacts
11/02/2006US20060245709 Photonic band gap micro-resonator device and method
11/02/2006DE112004002304T5 Entkoppelschaltung für mitmontierte Halbleitervorrichtungen Decoupling circuit for co-packaged semiconductor devices
11/01/2006CN1857044A Method and apparatus for efficient temperature control using a contact volume
10/2006
10/31/2006US7131074 Nested voltage island architecture
10/31/2006US7129746 System-on-a-chip integrated circuit including dual-function analog and digital inputs
10/31/2006US7129519 Monitoring system comprising infrared thermopile detector
10/31/2006US7128850 Spark plasma sintering of ceramic; high density, electroconductivity; hardness; aging resistance; toughness; corrosion resistance; reacting titanium dioxide, silicon carbide, silicon nitride; consolidation
10/26/2006WO2006111618A1 Source, an arrangement for installing a source, and a method for installing and removing a source
10/26/2006WO2006111617A1 Reactor
10/26/2006US20060239392 Asynchronous system-on-a-chip interconnect
10/26/2006US20060238955 Re-configurable mixed-mode integrated circuit architecture
10/25/2006CN1853279A PIN photodetector
10/25/2006CN1853261A Fabrication of single or multiple gate field plates
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