Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
07/2014
07/10/2014US20140191271 Light emitting module
07/10/2014US20140191270 Light emitting device and light emitting device package
07/10/2014US20140191269 Semiconductor light emitting device
07/10/2014US20140191268 Light emitting element and light emitting element package
07/10/2014US20140191267 Light emitting device
07/10/2014US20140191266 Light emitting device and method of manufacturing the light emitting device
07/10/2014US20140191265 Light emitting devices with improved light extraction efficiency
07/10/2014US20140191264 Semiconductor light-emitting device
07/10/2014US20140191263 Compositions for an led reflector and articles thereof
07/10/2014US20140191262 Material with tunable index of refraction
07/10/2014US20140191261 Light Emitting Heterostructure with Partially Relaxed Semiconductor Layer
07/10/2014US20140191260 Light emitting semiconductor structure
07/10/2014US20140191259 Molded chip fabrication method and apparatus
07/10/2014US20140191258 Semiconductor light emitting device and method for manufacturing same
07/10/2014US20140191257 Electronic devices with yielding substrates
07/10/2014US20140191256 Thin film trannsistor array panel and manufacturing method thereof
07/10/2014US20140191254 Hybrid combination of substrate and carrier mounted light emitting devices
07/10/2014US20140191253 Optoelectronic device and method for producing optoelectronic devices
07/10/2014US20140191246 Bonding transistor wafer to led wafer to form active led modules
07/10/2014US20140191245 Light emitting device
07/10/2014US20140191243 Patterned articles and light emitting devices therefrom
07/10/2014US20140191211 Electrode substrate and planar optoelectronic device
07/10/2014US20140191194 Nitride semiconductor light-emitting element
07/10/2014US20140191193 Nitride semiconductor light-emitting element having superior current spreading effect and method for manufacturing same
07/10/2014US20140191192 Semiconductor light-emitting device
07/10/2014US20140191191 Light Emitting Devices with Textured Active Layer
07/10/2014US20140191190 Semiconductor light emitting device and method for manufacturing the same
07/10/2014US20140191189 Staggered composition quantum well method and device
07/10/2014US20140191188 Terahertz modulator
07/10/2014US20140191187 Submicro-facet light-emitting device and method for fabricating the same
07/10/2014DE112012003848T5 System und Verfahren zur Herstellung lichtemittierender Elemente und System und Verfahren zur Herstellung von LED-Packages System and method for manufacturing light emitting elements and a system and method for the production of LED packages
07/10/2014DE10392313B4 Auf Galliumnitrid basierende Vorrichtungen und Herstellungsverfahren Gallium nitride-based devices and manufacturing processes
07/10/2014DE102014100226A1 Lichtemittierende Vorrichtung A light emitting device
07/10/2014DE102013100121A1 Optoelektronisches Halbleiterbauteil An optoelectronic semiconductor device
07/10/2014DE102012223945A1 LED-Modul mit LED-Chip Gruppen LED module with LED chip groups
07/10/2014DE102012112988A1 Optoelektronisches Bauelement, Verfahren zur Herstellung eines optoelektronischen Bauelements und Scheinwerfer Optoelectronic component, process for the preparation of an optoelectronic device and headlamp
07/10/2014DE102004010250B4 Fluoreszierendes Material aus Terbium-aluminium-Granat und Verfahren zu seiner Herstellung Fluorescent material of terbium-aluminum-garnet and process for its preparation
07/09/2014EP2753151A1 Lighting method and light-emitting device
07/09/2014EP2752898A1 Phosphor dispersion liquid, and production method for led device using same
07/09/2014EP2752897A1 Led device manufacturing method and fluorescent material-dispersed solution used in same
07/09/2014EP2752896A2 Light emitting device package
07/09/2014EP2752895A1 Optical substrate and semiconductor light-emitting element
07/09/2014EP2752894A2 Semiconductor light-emitting device and light source device including the same
07/09/2014EP2752615A1 Automotive headlamp apparatus
07/09/2014EP2751852A1 Method of bonding a substrate to a semiconductor light emitting device
07/09/2014EP2751839A2 Solid state transducers with state detection, and associated systems and methods
07/09/2014EP2751838A2 Solid state transducer devices, including devices having integrated electrostatic discharge protection, and associated systems and methods
07/09/2014EP2751831A2 Discontinuous patterned bonds for semiconductor devices and associated systems and methods
07/09/2014EP2751221A1 Phosphor based on a lanthanum cerium terbium phosphate with stabilized brightness, preparation process and use in a luminescent device
07/09/2014DE202013101431U1 Leuchtvorrichtung zur Erzeugung von Weißlicht A lighting device for the generation of white light
07/09/2014CN203707188U 一种提高光源光效的镜面铝基板 A way to improve efficiency of the light source mirror aluminum plate
07/09/2014CN203707187U 一种圆片级led芯片封装结构 One kind of led chip wafer level package structure
07/09/2014CN203707186U Led封装结构 Led package structure
07/09/2014CN203707185U 一种平面led晶片焊线支架 A flat led wafer bonding wire stent
07/09/2014CN203707184U 发光二极管薄膜电路板及装饰材 Light-emitting diodes and thin-film circuit board decorative material
07/09/2014CN203707183U 一种白光led器件 One kind of white led devices
07/09/2014CN203707182U 一种背光源模组及其光源 A backlight module and light
07/09/2014CN203707181U 发光二极管封装体 Light emitting diode package
07/09/2014CN203707180U 具有温感功能的陶瓷基板 Ceramic substrate having a temperature sense function
07/09/2014CN203707179U 液晶显示屏幕背光板封装模组 LCD screen backlight package module
07/09/2014CN203707178U 发光二极体料带结构 Light-emitting diode strip structure
07/09/2014CN203707177U 可感测温度的led陶瓷封装基板 Can sense temperature led ceramic package substrate
07/09/2014CN203707176U 一种全彩表面贴装元件 An all-color surface mount components
07/09/2014CN203707175U 全彩表面贴装元件 Full-color surface mount components
07/09/2014CN203707174U 一种大功率led照明用的电镀银铝基板 One kind of power led lighting aluminum plate with silver plating
07/09/2014CN203707173U 一种cob面光源 One kind cob surface light source
07/09/2014CN203707172U 一种大功率铝基板cob封装结构 One kind of high-power aluminum plate cob package
07/09/2014CN203707171U 一种超薄高效能Flash LED 元件 An ultra-thin high-performance Flash LED element
07/09/2014CN203707170U 线型led透明支架 Linear led transparent bracket
07/09/2014CN203707169U 一种cob-led封装用的镜面铝基板 One kind of cob-led package with specular aluminum plate
07/09/2014CN203707168U 一种cob-led封装用的电镀银铝基板 One kind of cob-led package aluminum plate with silver plating
07/09/2014CN203707167U 一种采用内槽和微槽错位设计的led平面封装装置 A dislocation of the slot and micro-groove design led flat pack device uses
07/09/2014CN203707166U 一种全金属一体化led灯珠封装结构 An all-metal integrated package structure led lamp beads
07/09/2014CN203707165U 一种强粘结性、高可靠性白光led芯片 A strongly bonded, high reliability white led chip
07/09/2014CN203707164U 一种用于扩晶机的压膜装置 An extended crystal machine for lamination device
07/09/2014CN203707129U 一种二极管组件的底板排布结构 Backplane arrangement structure for a diode assembly
07/09/2014CN203707128U 一种组合式的cob封装结构 Cob a combined package of
07/09/2014CN203707127U 一种低热阻高光效的cob封装结构 A low thermal resistance package structure cob high light efficiency
07/09/2014CN203707126U 一种新型陶瓷cob封装结构 A new ceramic cob package
07/09/2014CN203707125U 一种新型大功率集成封装 A new high-power integrated package
07/09/2014CN203707124U 贴片型硅胶透镜封装光源 SMD silicone lens package source
07/09/2014CN203707123U 一种全彩led封装结构 An all-color led package
07/09/2014CN203707122U 一种led封装结构 One kind of led package structure
07/09/2014CN203707121U 彩色led灯封装结构 Color led light package
07/09/2014CN203707120U 固态发射器封装及多像素发射封装 Solid-state transmitter package and multi-pixel launch package
07/09/2014CN203703780U 一种便于led灯散热的车灯结构 An easy-led headlight lamp cooling structure
07/09/2014CN203703728U 一种自带电路的全金属灯条结构的户外灯具 One kind of comes with the all-metal light bar circuit structure of outdoor lighting
07/09/2014CN203695339U 一种荧光粉防沉降装置 One phosphor anti-settlement system
07/09/2014CN203694424U 一种量子点美容仪 A quantum dot beauty instrument
07/09/2014CN103918094A 布线板和使用它的发光装置及它们的制造方法 Wiring board and the light emitting device using it, and their manufacturing method
07/09/2014CN103918093A 半导体发光装置 Semiconductor light emitting device
07/09/2014CN103918092A 具有更均匀注入和更低光学损耗的改进的p接触 With a more uniform and lower optical loss injecting an improved p-contact
07/09/2014CN103918061A 结晶层叠结构体及其制造方法以及半导体元件 Crystalline laminated structure and manufacturing method and a semiconductor element
07/09/2014CN103918060A 膜形成方法、真空处理设备、半导体发光元件制造方法、半导体发光元件和照明装置 Film-forming method, a vacuum processing apparatus, a semiconductor light emitting device manufacturing method, the semiconductor light emitting element and a lighting device
07/09/2014CN103917597A 光半导体密封材料用树脂组合物 Optical semiconductor sealing resin composition material
07/09/2014CN103915558A 一种led模组 One kind of led module
07/09/2014CN103915557A 一种使用陶瓷散热的高功率led灯具 A method of using ceramic heat lamps high power led
07/09/2014CN103915556A 一种使用陶瓷散热的高功率led灯具 A method of using ceramic heat lamps high power led
07/09/2014CN103915555A 发光二极管封装结构的制造方法 The method of manufacturing a light emitting diode package structure
07/09/2014CN103915554A 封装层被覆光半导体元件、其制造方法和光半导体装置 Encapsulation layer covering the optical semiconductor element, its manufacturing method and an optical semiconductor device
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