| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 06/26/2014 | US20140175505 Sealing agent for optical semiconductor devices, and optical semiconductor device |
| 06/26/2014 | US20140175504 Curable silicone resin composition, cured product thereof and photosemiconductor apparatus |
| 06/26/2014 | US20140175503 Semiconductor light emitting device |
| 06/26/2014 | US20140175502 Led package structure, dam structure thereof, and method of manufacturing led package thereof |
| 06/26/2014 | US20140175501 Light emitting device |
| 06/26/2014 | US20140175500 Optoelectronic semiconductor component |
| 06/26/2014 | US20140175499 Light emitting diode |
| 06/26/2014 | US20140175498 Led chip unit with current baffle |
| 06/26/2014 | US20140175497 Led chip with groove and method for manufacturing the same |
| 06/26/2014 | US20140175496 Chip unit and method for manufacturing the same |
| 06/26/2014 | US20140175495 Die bonding method and die bonding structure of light emitting diode package |
| 06/26/2014 | US20140175494 Silicone resin composition, encapsulating layer, reflector, and optical semiconductor device |
| 06/26/2014 | US20140175493 Light-Emitting Device |
| 06/26/2014 | US20140175492 Dense-luminescent-materials-coated violet leds |
| 06/26/2014 | US20140175491 Light emitting device |
| 06/26/2014 | US20140175490 Silicon-germanium light-emitting element |
| 06/26/2014 | US20140175489 Semiconductor light emitting element |
| 06/26/2014 | US20140175488 Heat-curable silicone resin sheet having phosphor-containing layer and white pigment-containing layer, method of producing light emitting device using same and encapsulated light emitting semiconductor device produced thereby |
| 06/26/2014 | US20140175487 Light emitting device package |
| 06/26/2014 | US20140175486 Narrow viewing angle plastic leaded chip carrier |
| 06/26/2014 | US20140175485 Light emitting diode with enhanced light extraction |
| 06/26/2014 | US20140175484 Light emitting diode package |
| 06/26/2014 | US20140175483 Light emitting diode package |
| 06/26/2014 | US20140175482 Light emitting diode package with light reflecting cup internally slanted |
| 06/26/2014 | US20140175481 Wafer-level flip chip device packages and related methods |
| 06/26/2014 | US20140175480 Led die and method for manufacturing led incorporating the same |
| 06/26/2014 | US20140175479 Led unit with light mixing element |
| 06/26/2014 | US20140175478 Optoelectronic semiconductor component and scattering body |
| 06/26/2014 | US20140175477 Edge coupling alignment using embedded features |
| 06/26/2014 | US20140175476 Method of Manufacturing a Light Emitting Diode Comprising a Layer of AIGaN Heterogeneous |
| 06/26/2014 | US20140175475 Light emitting device and method for manufacturing same |
| 06/26/2014 | US20140175474 Semiconductor light emitting device and method of manufacturing the same |
| 06/26/2014 | US20140175473 Light emitting diodes including light emitting surface barrier layers, and methods of fabricating same |
| 06/26/2014 | US20140175472 Semiconductor Light Emitting Unit Connected Body |
| 06/26/2014 | US20140175470 Light-Emitting Device and Method for Manufacturing the Same |
| 06/26/2014 | US20140175469 Light-Emitting Device and Manufacturing Method Thereof |
| 06/26/2014 | US20140175468 Multi-lens solid state lighting devices |
| 06/26/2014 | US20140175466 Led mixing chamber with reflective walls formed in slots |
| 06/26/2014 | US20140175465 Light emitting diode and method of fabricating the same |
| 06/26/2014 | US20140175464 Light emitting diode device |
| 06/26/2014 | US20140175452 Successive ionic layer adsorption and reaction process for depositing epitaxial zno on iii-nitride-based light emitting diode and light emitting diode including epitaxial zno |
| 06/26/2014 | US20140175440 Non-crystalline inorganic light emitting diode |
| 06/26/2014 | US20140175424 Thin film transistor array panel and method of manufacturing the same |
| 06/26/2014 | US20140175377 Polarized white light devices using non-polar or semipolar gallium containing materials and transparent phosphors |
| 06/26/2014 | US20140175372 Recessed Contact to Semiconductor Nanowires |
| 06/26/2014 | US20140175340 Glass frit, composition for solar cell electrodes including the same, and electrode fabricated using the same |
| 06/26/2014 | US20140175333 Curable composition |
| 06/26/2014 | US20140175158 Method for manufacturing light emitting diode package |
| 06/26/2014 | DE102013114723A1 Mit lumineszierendem Material bedeckte violette LEDs With luminescent material covered violet LEDs |
| 06/26/2014 | DE102012113018A1 Verfahren zur Herstellung eines Mehrschichtträgerkörpers A process for producing a multi-layer support body |
| 06/26/2014 | DE102012113014A1 Bauelementträger und Bauelementträgeranordnung Component carrier and the component carrier assembly |
| 06/26/2014 | DE102012112771A1 Verfahren zur Herstellung eines optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip A method for producing an optoelectronic semiconductor chip and optoelectronic semiconductor chip |
| 06/26/2014 | DE102012112149A1 Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements An optoelectronic semiconductor device and method for producing an optoelectronic semiconductor component, |
| 06/26/2014 | DE102012025088A1 Massenfertigungstaugliche Einzelphotonenquelle und Herstellungsverfahren Mass production-grade single-photon source and manufacturing processes |
| 06/26/2014 | DE102011085645B4 Leuchtdiodenmodul und Verfahren zum Betreiben eines Leuchtdiodenmoduls Light emitting diode module and method of operating a light-emitting diode module |
| 06/25/2014 | EP2747157A2 Light-emitting module and lighting source including the same |
| 06/25/2014 | EP2747156A2 High efficiency light emitting diode |
| 06/25/2014 | EP2747155A1 Manufacturing process of an MIS structure, in particular for a light-emitting diode |
| 06/25/2014 | EP2746642A2 LED illumination device and LED light-emission module |
| 06/25/2014 | EP2745333A1 Improved p-contact with more uniform injection and lower optical loss |
| 06/25/2014 | EP2745320A1 Led mixing chamber with reflective walls formed in slots |
| 06/25/2014 | EP2744846A1 Improved polyamide compositions for led applications |
| 06/25/2014 | EP2744845A1 Improved polyamide compositions for led applications |
| 06/25/2014 | CN203674267U 可折弯式led发光元件 Led light-emitting element can be bent style |
| 06/25/2014 | CN203674266U Led封装结构 Led package structure |
| 06/25/2014 | CN203674265U 一种双层结构的led封装 A two-layer structure led package |
| 06/25/2014 | CN203674264U 低热阻led指甲灯结构 Low thermal resistance led nail lamp structure |
| 06/25/2014 | CN203674263U 一种集成式led光源 An integrated led light |
| 06/25/2014 | CN203674262U 一种提高倒装led侧面出光的结构 A flip-led side of the structure to improve light |
| 06/25/2014 | CN203674261U 一种led散热封装结构 A heat sink package structure led |
| 06/25/2014 | CN203674260U 一种esd保护的led封装结构 One kind of led esd protection package |
| 06/25/2014 | CN203674259U 一种集成led支架 An integrated led bracket |
| 06/25/2014 | CN203674258U 一种集成led支架 An integrated led bracket |
| 06/25/2014 | CN203674257U 一种集成led支架 An integrated led bracket |
| 06/25/2014 | CN203674256U Led支架及其端子料带 Led bracket and terminal strip |
| 06/25/2014 | CN203674255U 一种led基板 One kind of led board |
| 06/25/2014 | CN203674254U 一种led封装结构 One kind of led package structure |
| 06/25/2014 | CN203674253U 一种led封装结构 One kind of led package structure |
| 06/25/2014 | CN203674252U 一种提高电极颜色一致性的结构设计 An electrode structure design improves color consistency |
| 06/25/2014 | CN203674251U Led 结构 Led structure |
| 06/25/2014 | CN203674250U 一种提高led侧面出光的结构 A light structure led the side to improve |
| 06/25/2014 | CN203674249U 一种提高倒装薄膜led侧面出光的结构 Method for improving the flip side of the film led light structure |
| 06/25/2014 | CN203674248U 一种提高电极焊线稳定性的结构设计 A structure designed to improve the stability of the electrode wire bonders |
| 06/25/2014 | CN203674247U 具有倒装结构的led芯片 Flip-chip structure has led |
| 06/25/2014 | CN203674246U 提高发光二极管电流扩展层均匀性的结构 Improve the uniformity of the structure of a current spreading layer, a light emitting diode |
| 06/25/2014 | CN203674245U Led 结构 Led structure |
| 06/25/2014 | CN203674215U 发光二极管 Led |
| 06/25/2014 | CN203674209U 集成驱动led光源 Integrated drive led light |
| 06/25/2014 | CN203674208U 发光组件及具有发光组件的背光装置 Light emitting module and the backlight device having a light emitting component |
| 06/25/2014 | CN103890983A 光电子器件和用于制造光电子器件的方法 Optoelectronic devices and methods for producing optoelectronic devices |
| 06/25/2014 | CN103890982A 发光元件、发光元件的制造方法以及发光装置 The method of manufacturing a light emitting device, a light emitting element and a light emitting means |
| 06/25/2014 | CN103890981A 发光二极管、发光二极管的制造方法、发光二极管灯和照明装置 Light-emitting diodes, a method of manufacturing a light emitting diode, LED lamps and lighting fixtures |
| 06/25/2014 | CN103890980A 半导体发光元件以及包含该半导体发光元件的叠层体 The semiconductor light emitting element, and a laminated body comprising the semiconductor light emitting element |
| 06/25/2014 | CN103890979A Led灯点灯控制电路以及led灯点灯控制方法 Led lamp lighting control circuit and led lamp lighting control method |
| 06/25/2014 | CN103890937A 块体无定形合金散热器 Bulk amorphous alloy radiator |
| 06/25/2014 | CN103890914A 半导体元件及其制造方法 Semiconductor device and manufacturing method |
| 06/25/2014 | CN103890488A 发光模块 The light emitting module |
| 06/25/2014 | CN103890134A 具有量子点的光源 Light quantum dots |
| 06/25/2014 | CN103890040A 用于led应用的改进的聚酰胺组合物 Led to improved applications polyamide composition |
| 06/25/2014 | CN103890039A 用于led应用的改进的聚酰胺组合物 Led to improved applications polyamide composition |