Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
08/2014
08/14/2014US20140225152 Wiring board and light emitting device using same, and manufacturing method for both
08/14/2014US20140225151 Light emitting device package and light unit
08/14/2014US20140225150 Light-emitting diode and method for manufacturing the same
08/14/2014US20140225149 Optoelectronic Semiconductor Component and Method for Fabricating an Optoelectronic Semiconductor Component
08/14/2014US20140225148 Optoelectronic Component Including an Adhesive Layer, Method for Producing an Adhesive Layer in an Optoelectronic Component, and use of an Adhesive to Form Adhesive Layers in Optoelectronic Components
08/14/2014US20140225147 Method for Producing a Plurality of Opto-Electronic Components and Opto-Electronic Component
08/14/2014US20140225146 Semiconductor light-emitting element
08/14/2014US20140225145 Light emitting device and fabricating method thereof
08/14/2014US20140225144 Light-reflective conductive particle, anisotropic conductive adhesive, and light-emitting device
08/14/2014US20140225143 Light emitting device
08/14/2014US20140225142 Semiconductor light emitting device
08/14/2014US20140225141 Semiconductor light emitting device
08/14/2014US20140225140 Light-emitting device
08/14/2014US20140225139 Light emitting device package and method of manufacturing the same
08/14/2014US20140225138 Light-emitting device
08/14/2014US20140225137 System and method for providing color light sources in proximity to predetermined wavelength conversion structures
08/14/2014US20140225136 Light emitting diode, display device including the same, and method of manufacturing display device
08/14/2014US20140225135 Optical Device Array Substrate Having a Heat Dissipating Structure Integrated with a Substrate, and Method for Manufacturing Same
08/14/2014US20140225133 Light-emitting device having transparent package and manufacturing method
08/14/2014US20140225132 Lightweight solid state light source with common light emitting and heat dissipating surface
08/14/2014US20140225123 REO/ALO/AlN TEMPLATE FOR III-N MATERIAL GROWTH ON SILICON
08/14/2014US20140225102 Light-emitting device
08/14/2014US20140225062 Nitride semiconductor light emitting element and method for manufacturing nitride semiconductor light emitting element
08/14/2014US20140225061 Semiconductor light emitting device and method for manufacturing the same
08/14/2014US20140225060 Group III Nitride Semiconductor Light-Emitting Device and Method for Producing the Same
08/14/2014US20140225059 LED with Improved Injection Efficiency
08/14/2014DE102014202264A1 Belichtungsvorrichtungen Exposure devices
08/14/2014DE102013202220A1 Strahlungsquelle und Verfahren zu deren Betrieb Radiation source and method for its operation
08/14/2014DE102013101367A1 Halbleiterchip Semiconductor chip
08/14/2014DE102013101262A1 Optoelektronisches Leuchtmodul, optoelektronische Leuchtvorrichtung und Kfz-Scheinwerfer Optoelectronic light module, optoelectronic lighting device and vehicle headlights
08/14/2014DE102013101260A1 Vorrichtung mit zumindest einem optoelektronischen Halbleiterbauelement A device with at least one optoelectronic semiconductor component
08/13/2014EP2765620A1 Light-emitting diode package
08/13/2014EP2765619A2 Semiconductor light emitting device
08/13/2014EP2765618A2 Semiconductor light emitting device
08/13/2014EP2765175A2 Phosphor compositions for highly reliable white light-emitting diode devices
08/13/2014EP2765173A1 Anisotropic conductive adhesive and method for producing same, and light-emitting device and method for producing same
08/13/2014EP2764554A1 Opto-electronic semi-conductor component and module with a plurality of such components
08/13/2014EP2764397A1 Radiation generating apparatus and a method of generating radiation
08/13/2014CN203774375U 一种高显色指数贴片式led A high-CRI SMD led
08/13/2014CN203774374U 一种基板导热膏涂抹装置 An applicator device substrate thermal paste
08/13/2014CN203774373U 一种led贴片结构 One kind of structure led SMD
08/13/2014CN203774372U 一种led端子料带的封胶结构 Sealed plastic structure for a terminal strip led the
08/13/2014CN203774371U 一种荧光透镜应用于大功率led的封装结构 A fluorescent lens is applied to the package structure of power led
08/13/2014CN203774370U 一种无围坝镶嵌式cob封装结构 A non-dam mosaic cob package
08/13/2014CN203774369U 发光二极管封装结构 Light emitting diode package structure
08/13/2014CN203774368U 倒装封装主散热通道偏置型全金属复合基板 Flip the main cooling channel package type all-metal composite substrate bias
08/13/2014CN203774367U 倒装封装主散热通道中凸型全金属复合基板 Flip-chip package in the main cooling channels convex all-metal composite substrate
08/13/2014CN203774366U 一种立体发光led芯片灯丝及led灯泡 A stereoscopic light led chip and led bulb filament
08/13/2014CN203774365U 一种立体led发光体 A stereoscopic led emitters
08/13/2014CN203774364U 一种高效角度可调的cob光源 An efficient light angle adjustable cob
08/13/2014CN203774363U 半导体发光装置 Semiconductor light emitting device
08/13/2014CN203774362U 一种能够回收再利用的衬底 A substrate can be recovered for reuse
08/13/2014CN203774361U 一种能够回收再利用的衬底 A substrate can be recovered for reuse
08/13/2014CN203774360U 一种覆胶固晶系统 One kind of solid crystal plastic cover system
08/13/2014CN203774359U Led支架喷墨设备 Led bracket inkjet devices
08/13/2014CN203774325U 一种led灯组件 One kind of led lamp assembly
08/13/2014CN203774324U 一种磨砂表面装贴型led One kind of matte surface mount type led
08/13/2014CN203774323U Led组件的芯片电极连接结构 Chip connection structure of the electrode assembly Led
08/13/2014CN203774322U 多晶片发光二极管封装结构 Multi-chip light emitting diode package structure
08/13/2014CN103988326A 光束整形发光模块 Beam shaping emitting module
08/13/2014CN103988325A 用于光致发光材料的涂层 For coating of photoluminescent material
08/13/2014CN103988324A 尺寸减小并且光输出提高的光发射器装置和方法 Reduced in size to increase the light output and the light emitting device and method
08/13/2014CN103988323A 发光二极管封装件 Light emitting diode package
08/13/2014CN103988322A 半导体发光器件 The semiconductor light emitting device
08/13/2014CN103988321A 制造具有平坦表面的三维氮化镓结构的方法和使用具有平坦表面的三维氮化镓（GaN）柱状物结构的发光二极管（LED） The method of manufacturing a flat surface and having a three-dimensional structure having a flat surface GaN dimensional gallium nitride (GaN) light-emitting diode structure of pillars (LED)
08/13/2014CN103987785A 可固化组合物 The curable composition
08/13/2014CN103987657A 表面修饰金属氧化物粒子材料及光半导体元件密封组合物以及光半导体装置 Surface modification of metal oxide particles and the material of the composition for sealing an optical semiconductor element and an optical semiconductor device
08/13/2014CN103985810A Led玻璃及其制造工艺 Led glass and its manufacturing process
08/13/2014CN103985809A Led照明大芯片 Led lighting big chip
08/13/2014CN103985808A 具透明封装体的发光二极管元件及其制造方法 The method of manufacturing the light emitting diode element having a transparent package body
08/13/2014CN103985807A 无机基板及其制造方法 An inorganic substrate and a method of manufacturing
08/13/2014CN103985806A 一种led芯片p面电极、制备p面电极用刻蚀液及p面电极制备方法 One kind of led chip p-plane electrodes were prepared by etching liquid p-plane electrodes and electrode surface preparation method p
08/13/2014CN103985805A 一种led芯片p面厚铝电极、制备厚铝电极用刻蚀液及厚铝电极制备方法 One kind of led chip p thick aluminum electrode surface, thick aluminum electrode was prepared by etching liquid and thick aluminum electrode preparation method
08/13/2014CN103985804A Led芯片及其制造方法 Led chip and its manufacturing method
08/13/2014CN103985803A 氮化物发光二极管组件 Nitride light-emitting diode assembly
08/13/2014CN103985802A 发光二极管及其制作方法 Light-emitting diode and manufacturing method thereof
08/13/2014CN103985801A 发光装置 Light-emitting device
08/13/2014CN103985800A 半导体发光器件 The semiconductor light emitting device
08/13/2014CN103985799A 发光二极管及其制作方法 Light-emitting diode and manufacturing method thereof
08/13/2014CN103985798A 一种具有新型量子阱结构的led及其制作方法 A new production methods have led their quantum well structure
08/13/2014CN103985797A 多量子阱结构、生长方法及具有该结构的led芯片 A multiple quantum well structure, the growth method and having a chip of this structure led
08/13/2014CN103985796A 电子器件 Electronic devices
08/13/2014CN103985795A 一种led芯片的卸料机构 One kind of led chip unloading mechanism
08/13/2014CN103985794A 一种用于制备led的退火炉管腔体 Annealing furnace for the preparation of the body lumen led the
08/13/2014CN103985793A 一种用于放置led芯片的治具 A fixture placement led chip
08/13/2014CN103985792A 制造第iii族氮化物半导体的方法 The first method of manufacturing a nitride semiconductor iii
08/13/2014CN103985628A 用于晶片转移的方法 Methods for wafer transfer
08/13/2014CN103982785A 照明装置 Lighting device
08/13/2014CN103980899A 一种基于多金属氧酸盐的发光颜色可调及白光发射薄膜及其制备方法 A tunable and white light-emitting film and preparation method is based on the emission color of POMs
08/13/2014CN103980891A 荧光粉组成及发光二极管元件 Phosphor composition and light-emitting diode element
08/13/2014CN103980890A 一种Ⅰ-Ⅲ-Ⅵ族三元半导体纳米晶发光薄膜制备方法 One kind of Ⅰ-Ⅲ-Ⅵ family three yuan semiconductor nanocrystals thin film manufacturing method
08/13/2014CN103980880A 一种含水溶性量子点的复合材料的制备方法及其应用 Method for preparing water-soluble quantum dots containing composites and its application
08/13/2014CN103980714A 一种高折射率led有机硅封装材料及其制备方法 Led a high-refractive index silicone encapsulating material and preparation method
08/13/2014CN102792472B 脉冲电流驱动的白光led照明装置 White led lighting device pulse current drive
08/13/2014CN102730980B 一种高可靠高效率的led封装用荧光玻璃及其制备方法 A highly reliable and efficient led package with fluorescent glass and its preparation method
08/13/2014CN102730974B 一种用于制备led封装用玻璃荧光层的浆料 A process for preparing the slurry with a glass encapsulation led to a phosphor layer
08/13/2014CN102728507B 即时于制作过程中侦测白光色温的萤光粉涂布设备及方法 Immediate detection of white color temperature in the production process of phosphor coating apparatus and method
08/13/2014CN102655203B Led支架及其制造方法 Led stent and its manufacturing method
08/13/2014CN102623589B 一种垂直结构的半导体发光器件制造方法 The semiconductor light emitting device manufacturing method of a vertical structure
08/13/2014CN102610735B 一种具有电热分离结构的发光器件及其制造方法 A light emitting device and a method of manufacturing an electric separation structure having
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