Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
07/2014
07/23/2014CN203733792U Led灯丝 Led filament
07/23/2014CN203731112U 灯 Light
07/23/2014CN103946995A Led模块 Led Module
07/23/2014CN103946994A 半导体发光器件 The semiconductor light emitting device
07/23/2014CN103946960A 蚀刻方法 Etching method
07/23/2014CN103946147A 基于半导体纳米粒子的发光材料 Based on the light emitting material of the semiconductor nanoparticles
07/23/2014CN103945634A 柔性电路板和具有该柔性电路板的照明装置 A flexible circuit board and an illumination device having the flexible circuit board
07/23/2014CN103943769A 一种使用陶瓷散热的高功率led灯具 A method of using ceramic heat high power led lamps
07/23/2014CN103943768A 发光二极管装置及散热基板的制造方法 The method of manufacturing a light emitting diode device and the heat radiation substrate
07/23/2014CN103943767A 集成led芯片 Integrated led chip
07/23/2014CN103943766A 一种带有配光装置的led光源 Led light device with a light of
07/23/2014CN103943765A 发光装置、超辐射发光二极管及投影器 Light-emitting device, super luminescent diode and projectors
07/23/2014CN103943764A 模压一体化封装led光源的成型模具及成型方法 Molded integrated package mold and molding method led light
07/23/2014CN103943763A 一种倒装led芯片的封装结构及方法 A package structure and method for flip chip led
07/23/2014CN103943762A 具有多层结构的led照明用远程荧光粉配光薄膜及其制备方法 Led lighting with multi-layered structure with an optical film and preparation method with remote phosphor
07/23/2014CN103943761A 一种远程荧光粉配光薄膜及其制备方法 One kind of remote phosphor light film and preparation method
07/23/2014CN103943760A 远程荧光粉器件的制备方法、远程荧光粉器件以及led灯具 Preparation remote phosphor devices, remote phosphor components and led lighting
07/23/2014CN103943759A 包括发光含钆材料的物件及其形成工艺 Including items luminescent material containing gadolinium and its formation process
07/23/2014CN103943758A 一种高效散热的大功率led灯珠 An efficient cooling of high power led lamp beads
07/23/2014CN103943757A 基于注塑工艺的led照明用远程荧光粉配光薄膜及其制备方法 Led lighting light film based on the injection molding process and preparation method equipped with remote phosphor
07/23/2014CN103943756A 一种led模块cob封装工艺及结构 One kind cob led module packaging technology and structure
07/23/2014CN103943755A 一种白光led封装结构及封装方法 One kind of white led package and packaging method
07/23/2014CN103943754A 一种电致发光器件及其制备方法和显示装置 An electroluminescent display device and its preparation method and apparatus
07/23/2014CN103943753A 发光二极管光源及其制作方法、背光源及显示装置 LED light source and its production method, backlight and display device
07/23/2014CN103943752A 发光单元与具有发光单元的发光灯条 Light-emitting light-emitting unit and a light-emitting unit
07/23/2014CN103943751A 发光装置、发光二极管承载座及其模具 Light-emitting device, the light emitting diode bearing seat and Die
07/23/2014CN103943750A 发光二极管模组及其制造方法 The method of manufacturing a light emitting diode module and
07/23/2014CN103943749A 一种用于发光二极管的透明导电薄膜 A light emitting diode is used for the transparent conductive thin film
07/23/2014CN103943748A 发光元件 Light-emitting element
07/23/2014CN103943747A 一种使用陶瓷散热的高功率led灯具 A method of using ceramic heat high power led lamps
07/23/2014CN103943746A 一种GaN基发光二极管外延片及其制作方法 One kind of GaN-based light emitting diode epitaxial wafer and manufacturing method thereof
07/23/2014CN103943745A 一种使用陶瓷散热的高功率led灯具 A method of using ceramic heat high power led lamps
07/23/2014CN103943744A 一种能提高led光效的芯片加工方法 A chip can improve the efficiency of processing methods led light
07/23/2014CN103943743A 半导体发光器件及其制造方法 The semiconductor light emitting device and its manufacturing method
07/23/2014CN103943742A 蓝宝石衬底的制造方法 The method of manufacturing a sapphire substrate
07/23/2014CN103943741A 一种基于激光剥离的半导体发光器件的制备方法 A process for laser lift-off of the semiconductor light emitting device based on
07/23/2014CN103943740A 增加发光效率的led外延层生长方法及led外延层 Increased luminous efficiency led epitaxial layer growth method and led epitaxial layer
07/23/2014CN103943739A 提高光提取效率发光二极管的制备方法 A light emitting diode to increase the light extraction efficiency of the preparation method
07/23/2014CN103943738A 抑制电极光吸收的发光二极管的制备方法 Electrode of the optical absorption of the preparation method of suppressing a light emitting diode
07/23/2014CN103943737A 紫外发光二极管器件的制备方法 Preparation of ultraviolet light emitting diode device
07/23/2014CN103943736A 一种提高外延片亮度的三角锥图形衬底的制备方法 Preparation method of improving the brightness of the wafer substrate triangular pyramid graphic
07/23/2014CN103943735A 一种led日光灯管的制作方法 The method of making a fluorescent tube led
07/23/2014CN103943734A 光半导体装置及其制造方法 An optical semiconductor device and its manufacturing method
07/23/2014CN103943733A 一种基于垂直纳米线的led超平行光源的制备方法 A method for preparing ultra-parallel light led vertical nanowire-based
07/23/2014CN103943732A Led支架喷墨设备及其喷墨方法 Led bracket inkjet devices and ink-jet method
07/23/2014CN103943731A 一种提高氮化物led外延片发射波长均匀性的生长方法 An enhanced nitride led wafer uniformity of the emission wavelength of the growth method
07/23/2014CN103943730A 一种适用于发光二极管的剥离方法 A suitable method of peeling the light emitting diode
07/23/2014CN103943619A 一种车用照明的大功率led cob倒装封装结构 A vehicle lighting, power led cob flip package
07/23/2014CN103943618A 可调色温和显指的led光源模块 Adjustable color temperature and CRI led light module
07/23/2014CN103943617A 发光装置及其制造方法 A light emitting device and manufacturing method thereof
07/23/2014CN103943616A 一种led发光装置 One kind of led light-emitting device
07/23/2014CN103939850A Led灯白光产生方法 Led lamps produce white light method
07/23/2014CN103939758A 一种led照明装置 One kind of led lighting device
07/23/2014CN103937501A 荧光物质和使用其的光发射器件 A fluorescent substance and a light emitting device using the same
07/23/2014CN103937500A 发光装置及其耐温碳化物荧光材料 Fluorescent light emitting device and temperature carbide material
07/23/2014CN103937445A 高亮度、大功率cob-led封装用高折透明有机硅胶的制备方法 High brightness, high power cob-led package with high refractive transparent silicone preparation
07/23/2014CN103937405A 底层涂料组合物及使用该底层涂料组合物的光半导体装置 The priming composition and the use of an optical semiconductor device of the primer composition
07/23/2014CN103937159A 一种led封装用高性能耐热环氧树脂复合物 One kind of led package with high-performance heat-resistant epoxy composites
07/23/2014CN103937158A 一种高透明性、高荧光效率的量子点/环氧树脂纳米复合材料、制备及应用 Kind of high transparency, high fluorescence efficiency of quantum dot / epoxy nanocomposites, preparation and application
07/23/2014CN103936287A 玻璃粉混合物、玻璃粉浆料和光电封装件 A mixture of glass frit, the glass frit paste and optoelectronic packages
07/23/2014CN103935095A 硅酮/有机树脂复合层叠板及其制造方法、以及使用此复合层叠板的发光半导体装置 The silicone / organic resin composite laminated board and its manufacturing method, and a light-emitting semiconductor device using the composite laminated board
07/23/2014CN102863952B 铕镝共掺杂硫酸钙发光材料、制备方法及其应用 Eu, Dy co-doped calcium sulfate luminescent materials, preparation method and its application
07/23/2014CN102838985B 钛掺杂硫代铝酸锶发光薄膜、其制备方法及有机电致发光器件 Titanium-doped strontium aluminate luminescent film thiosulfate, its preparation method and organic electroluminescent devices
07/23/2014CN102544280B 一种无机量子点近红外光致发光器件及制备方法 An inorganic quantum dot near-infrared photoluminescence device and preparation method
07/23/2014CN102386320B 半导体装置及其检测方法和电子设备 Semiconductor device and detection method and electronic equipment
07/23/2014CN102315350B 半导体发光二极管及其制造方法 The method of manufacturing a semiconductor light emitting diode and
07/23/2014CN102257647B 光半导体装置用引线框及其制造方法 The optical semiconductor device and manufacturing method lead frame
07/23/2014CN102194847B 发光器件、发光器件封装、发光器件的制造方法及照明系统 The method of manufacturing a light emitting device, a light emitting device package, the light emitting device and a lighting system
07/23/2014CN102163664B 处理碳化硅衬底改善外延沉积的方法与形成的结构和器件 Improved method for processing a silicon carbide substrate with an epitaxial deposition device forming the structure and
07/23/2014CN102148318B 发光器件封装及其制造方法、以及照明系统 The method of manufacturing the light emitting device package, and a lighting system
07/23/2014CN102148317B 发光器件封装和照明系统 Light emitting device package and lighting system
07/23/2014CN101681973B 具有生长基底的发光二极管上的透明欧姆接触 A transparent substrate having a light emitting diode grown on the ohmic contact
07/23/2014CA2838641A1 Led light
07/22/2014US8786793 Display device and manufacturing method thereof
07/22/2014US8786646 Light-emitting chip, light-emitting device, print head and image forming apparatus
07/22/2014US8786175 Lighting device, a lamp and a luminaire
07/22/2014US8786174 Organic light emitting display device and method of manufacturing the same
07/22/2014US8786065 Substrate, light emitting device and method for manufacturing substrate
07/22/2014US8785965 Nitride-based semiconductor light-emitting device and method for fabricating the same
07/22/2014US8785963 Method of manufacturing semiconductor light emitting device
07/22/2014US8785962 Semiconductor light emitting device having current blocking layer
07/22/2014US8785961 Heat spreading substrate
07/22/2014US8785960 Light-emitting dies incorporating wavelength-conversion materials and related methods
07/22/2014US8785958 Light emitting element
07/22/2014US8785957 Light-emitting device
07/22/2014US8785956 Chip package having optical-electronic device with plurality of light shielding layers and substrate through-hole with void, and method for forming the same
07/22/2014US8785955 Light emitting diode
07/22/2014US8785954 Organic light-emitting device
07/22/2014US8785953 Light emitting diode, manufacturing method thereof, light emitting diode module, and manufacturing method thereof
07/22/2014US8785952 Light emitting device and light emitting device package including the same
07/22/2014US8785951 Optoelectric component
07/22/2014US8785950 Chip with semiconductor electricity conversion structure
07/22/2014US8785947 Semiconductor substrate for growth of an epitaxial semiconductor device
07/22/2014US8785932 IR sensing transistor and manufacturing method of display device including the same
07/22/2014US8785906 Lamp with controllable spectrum
07/22/2014US8785905 Amber light-emitting diode comprising a group III-nitride nanowire active region
07/22/2014US8785525 Thermosetting light-reflecting resin composition, optical semiconductor element mounting board produced therewith, method for manufacture thereof, and optical semiconductor device
07/22/2014US8785240 Light-emitting apparatus and production method thereof
07/22/2014US8785221 Method for making light emitting diode
07/22/2014US8785219 Optoelectronic semiconductor device and the manufacturing method thereof
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