Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
07/2014
07/02/2014EP2748867A2 Nanostructured transparent conducting oxide electrochromic device
07/02/2014EP2748866A1 Semiconductor light emitting device with thick metal layers
07/02/2014EP2748865A1 Semiconductor light emitting device with thick metal layers
07/02/2014EP2748864A1 Method of processing a semiconductor structure
07/02/2014EP2748863A1 White leds with emission wavelength correction
07/02/2014EP2748840A2 A semiconductor substrate and method of manufacturing
07/02/2014CN203690346U 一种高效率低衰减大功率的白光led封装结构 An efficient low attenuation high power white led package
07/02/2014CN203690345U 一种通用型led平头支架 A general-led flat head bracket
07/02/2014CN203690344U 一种超高功率陶瓷基板led封装结构 An ultra-high-power ceramic substrate led package
07/02/2014CN203690343U 一种功率型led封装 A power type led package
07/02/2014CN203690342U 户外smd全彩led灯珠 Smd outdoor full color led lamp beads
07/02/2014CN203690341U 一种高光效led支架及led A high-efficiency led light stand and led
07/02/2014CN203690340U 一种wfcob光源 One kind of light source wfcob
07/02/2014CN203690339U Led支架及采用该led支架的电子装置 Led stents and the use of electronic devices that led bracket
07/02/2014CN203690338U 一种混色双闪led灯 One kind of blending double flash led light
07/02/2014CN203690337U 一种发光二极管灯条 A light emitting diode light bar
07/02/2014CN203690336U 一种贴片支架 A patch bracket
07/02/2014CN203690325U 基于标准cmos工艺的新型光互连结构 New technology based on standard cmos optical interconnection structure
07/02/2014CN203690301U Led光源 Led light
07/02/2014CN203690300U 一种具有强化出光结构的多led芯片封装器件 An enhanced multi-light structure has led chip package devices
07/02/2014CN203690299U 插接式led荧光晶体片与led灯泡 Plug-led fluorescent crystal film and led bulb
07/02/2014CN203690297U 一种大功率多色cob集成封装结构 A multicolor cob integrated package of high-power
07/02/2014CN203690296U 一种大功率rgbw交叉混色cob集成封装结构 One kind of power rgbw cross mixing cob integrated package
07/02/2014CN203690295U 一种led灯及其支架底座 One kind of led lights and stand base
07/02/2014CN203690267U 一种特殊的物料系统 A special material systems
07/02/2014CN203686726U 一种具有邦定式led的柔性条形灯 Flexible strip lights led a kind of bonding formula
07/02/2014CN203679579U 一种规格可调式焊压夹具 One size adjustable pressure welding jig
07/02/2014CN103907216A 对包含银纳米线的基质的选择性蚀刻 Of selective etching comprises a matrix of silver nanowires
07/02/2014CN103907211A 发光装置、照明装置以及发光装置的制造方法 The method of manufacturing a light emitting device, a lighting device and a light emitting device
07/02/2014CN103907210A 光电子半导体芯片和用于制造光电子半导体芯片的方法 Method of fabricating an optoelectronic semiconductor chip optoelectronic semiconductor chip and for
07/02/2014CN103907209A Led灯、包括该led灯的照明装置、以及led灯的电流控制方法 Led lights, lighting device includes the led lights, as well as current control method led lights
07/02/2014CN103904208A 一种基板结构 A substrate structure
07/02/2014CN103904207A 晶片电路 Chip circuit
07/02/2014CN103904206A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
07/02/2014CN103904205A 防止发光二极管芯片的电路断线的封装方法及结构 Method and structure for preventing a light emitting diode chip circuit is disconnected
07/02/2014CN103904204A 发光二极管灯条 Light-emitting diode
07/02/2014CN103904203A 发光二极管 Led
07/02/2014CN103904202A 一种用于制作led多芯片封装基板的方法及滚压刀具 A method for making a multi-chip package substrate led method and rolling tool
07/02/2014CN103904201A 发光二极管组合 Light-emitting diode combination
07/02/2014CN103904200A 封装片 Encapsulation sheet
07/02/2014CN103904199A 色温可自由调节的白光led Freely adjustable color temperature white led
07/02/2014CN103904198A 一种led封装结构 One kind of led package
07/02/2014CN103904197A 一种led灯丝片及其制造方法以及led灯丝片灯泡 One kind led filament sheet and manufacturing method thereof, and led lamp heater tabs
07/02/2014CN103904196A 一种发光二极管基座及使用其的光源 A light emitting diode base and using the same light source
07/02/2014CN103904195A 容器式led荧光封装结构 Container-type package structure led fluorescent
07/02/2014CN103904194A 发光二极管的制造方法 The method of manufacturing a light emitting diode
07/02/2014CN103904193A 发光二极管封装结构的制造方法 The method of manufacturing a light emitting diode package structure
07/02/2014CN103904192A 半导体二极管封装结构及其制造方法 Semiconductor diode package structure and manufacturing method
07/02/2014CN103904191A 一种led封装基底及led封装结构 An encapsulation substrate and package structure led led
07/02/2014CN103904190A 发光二极管封装结构及其制造方法 LED package structure and manufacturing method
07/02/2014CN103904189A 发光芯片组合及其制造方法 Emitting chip portfolio and its manufacturing method
07/02/2014CN103904188A 发光二极管及其混光方法 Mixed light-emitting diode and method
07/02/2014CN103904187A 发光二极管及其制造方法 A light emitting diode and its manufacturing method
07/02/2014CN103904186A 基于石墨烯电极的半导体器件及其制备方法 Based semiconductor device and a method for preparing an electrode graphene
07/02/2014CN103904185A 一种柔性led发光器件 A flexible led light-emitting devices
07/02/2014CN103904184A 覆晶式led芯片 Flip-chip led chip
07/02/2014CN103904183A 一种ITO粗化的GaN基LED芯片及其制备方法 A heavy-oriented GaN-based LED chip and its preparation method ITO
07/02/2014CN103904182A 一种衬底图形化的倒装led芯片及其制备方法 Led a flip-chip graphical substrate and its preparation method
07/02/2014CN103904181A 发光元件 Emitting element
07/02/2014CN103904180A 一种led芯片结构及其制备方法 One kind of led chip architecture and its preparation method
07/02/2014CN103904179A 发光二极管晶粒及其制造方法 LED chip and its manufacturing method
07/02/2014CN103904178A 量子点发光器件 Quantum dot light emitting device
07/02/2014CN103904177A 发光二极管外延片及其制造方法 Light-emitting diode epitaxial wafer and its manufacturing method
07/02/2014CN103904176A 半导体发光元件 Semiconductor light emitting element
07/02/2014CN103904175A 具有波导结构光子晶体发光二极管的制作方法 Photonic crystal waveguide structure with a method of making a light-emitting diode
07/02/2014CN103904174A 发光二极管芯片的制作方法 Method of manufacturing the light emitting diode chip
07/02/2014CN103904173A 一种降低芯片正向工作电压的外延片生长方法 A method of reducing the forward voltage of the chip wafer growth method
07/02/2014CN103904172A 一种陶瓷体上常温超声波焊接led芯片的方法 At room temperature on a ceramic body of the ultrasonic welding method led chip
07/02/2014CN103904171A GaN基发光二极管的外延片的制备方法 Preparation of GaN-based light-emitting diode epitaxial wafer
07/02/2014CN103904170A 分离基板的方法和利用其制造半导体装置的方法 Separation of the substrate and by the method for manufacturing a semiconductor device
07/02/2014CN103904169A 一种led外延结构的生长方法及其设备 One kind led epitaxial growth method and apparatus structure
07/02/2014CN103904095A 发光器件 Light-emitting devices
07/02/2014CN103904075A 光遮断器 Photo-interrupter
07/02/2014CN103904072A 一种大功率led芯片集成封装结构 One kind of power led chip package structure
07/02/2014CN103904071A 一种透明基板led灯条的制造工艺 A transparent substrate manufacturing process led lights
07/02/2014CN103904070A 一种光棒及使用其的光源 An optical light source rods and use thereof
07/02/2014CN103904069A 一种固定于同一芯片上的双灯珠结构 A fixed structure Lamps beads on the same chip
07/02/2014CN103904068A 发光二极管发光装置 Light emitting diode device
07/02/2014CN103897697A 一种高显色性暖白光led用荧光粉 A high-color led warm white phosphors
07/02/2014CN103897644A 一种有机硅改性环氧树脂封装胶的制备方法 Preparation of a silicone-modified epoxy resin adhesive
07/02/2014CN102985750B 光束控制部件和照明装置 Light flux control member and a lighting device
07/02/2014CN102942928B 一种锆酸盐基红色荧光粉、制备方法及应用 One kind zirconate-based red phosphor, preparation method and application
07/02/2014CN102618276B α型赛隆、发光装置及其用途 α-SiAlON, light-emitting device and its use
07/02/2014CN102544342B 一种集散热器与电极于一体的散热器件及其制备方法 A set of electrodes in one of the radiator and radiator parts and preparation method
07/02/2014CN102544265B 一种窄带陷波滤光输出的发光二极管及其制备方法 Narrow-band notch filter output of light-emitting diode and its preparation method
07/02/2014CN102532957B 一种导热绝缘填料及其制备方法 One kind of thermal insulation packing and preparation method
07/02/2014CN102479890B 光学平台的形成方法 The method for forming an optical platform
07/02/2014CN102472867B 光电复合配线模块及其制造方法 Photoelectric composite wiring module and its manufacturing method
07/02/2014CN102420282B 发光二极管封装结构及其制造方法 Light emitting diode package structure and manufacturing method
07/02/2014CN102369605B 发光二极管元件及其制造方法 The method of manufacturing the light emitting diode element and
07/02/2014CN102300902B 发uv光芴基共聚物 Hair uv light butylfluorenyl copolymer
07/02/2014CN102244179B 发光二极管封装结构及其制造方法 Light emitting diode package structure and manufacturing method
07/02/2014CN102217065B 光电子半导体器件 Optoelectronic semiconductor device
07/02/2014CN102177594B 发光装置 Light-emitting device
07/02/2014CN102020853B 用于密封光半导体元件的组合物 Composition for sealing an optical semiconductor element
07/02/2014CN101855492B 照明装置 Lighting device
07/02/2014CN101836032B 面发光体和装入该面发光体而成的内照式广告牌 Surface-emitting body and mount the surface emitter made internally illuminated billboards
07/02/2014CN101792572B 热固性环氧树脂组合物和半导体器件 The thermosetting epoxy resin composition and a semiconductor device
07/01/2014US8766528 Phosphor and LEDs containing same
07/01/2014US8766526 Light-emitting device package providing improved luminous efficacy and uniform distribution
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