Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
06/2014
06/19/2014US20140166976 High efficiency light emitting diode
06/19/2014US20140166975 Semiconductor light emitting device
06/19/2014US20140166974 Nano-structured light-emitting devices
06/19/2014US20140166973 Composition having dispersion of nano-particles therein and methods of fabricating same
06/19/2014US20140166945 Ceramic composition having dispersion of nano-particles therein and methods of fabricating same
06/19/2014US20140166943 P-AlGAN LAYER AND GROUP III NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE
06/18/2014EP2744001A2 Light emitting device package
06/18/2014EP2744000A2 LED chip packaging structure and its manufacturing method
06/18/2014EP2743999A2 Light emitting device package including phosphor film, method of manufacturing the same, and lighting apparatus using the same
06/18/2014EP2743998A1 Light emitting device and method of manufacturing light emitting device and optical component used in the same
06/18/2014EP2743997A2 Light-emitting diode and method of fabricating the same
06/18/2014EP2743996A2 Nitride semiconductor light-emitting element having superior current spreading effect and method for manufacturing same
06/18/2014EP2743995A2 Nitride semiconductor light-emitting element having superior leakage current blocking effect and method for manufacturing same
06/18/2014EP2743994A1 Light emitting diode and method of manufacturing same
06/18/2014EP2743382A1 Method for peeling group 13 element nitride film
06/18/2014EP2743330A1 Phosphor, phosphor production method, and light-emitting device
06/18/2014EP2743328A1 Red phosphor and light-emitting element
06/18/2014EP2742540A1 Illumination devices including multiple light emitting elements
06/18/2014EP2742531A1 Semiconductor light emitting device and light emitting module
06/18/2014DE102012112316A1 Verfahren und Vorrichtung zur Herstellung eines Strahlung emittierenden Halbleiterbauelements und Strahlung emittierendes Halbleiterbauelement Method and apparatus for manufacturing a radiation-emitting semiconductor component and radiation-emitting semiconductor component
06/18/2014DE102012112307A1 Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements An optoelectronic semiconductor device and method for producing an optoelectronic semiconductor component,
06/18/2014DE102012112302A1 Anzeigevorrichtung und Verfahren zur Herstellung einer Anzeigevorrichtung Display device and method for manufacturing a display device
06/18/2014DE102012111564A1 Illumination device for lighting different materials e.g. newsprint, has white light comprising color rendering index and blue light portion, where peak wavelength of blue light portion is provided with specific nanometer
06/18/2014DE102012024459A1 Anordnung aus einem Kühlkörper und darauf aufgenommenen, Wärme erzeugenden elektronischen Bauteilen Assembly of a heat sink and recorded on heat-generating electronic components
06/18/2014CN203659936U 照明设备的led基板散热装置 Led heat sink substrate lighting equipment
06/18/2014CN203659935U 一种大功率led的液冷散热装置 Liquid cooling device for power led
06/18/2014CN203659934U 一种大功率led的微槽群散热装置 One kind of power led heat sink micro-groove group
06/18/2014CN203659933U 一种led灯散热装置 A lamp heat sink led
06/18/2014CN203659932U 免焊线的正装led芯片 Free dress led chip bonding wires
06/18/2014CN203659931U Led芯片及具有该结构的阵列式led芯片 Led chip and having this structure led chip array
06/18/2014CN203659930U 具有金属反射层的半导体发光器件 The semiconductor light emitting device having a metal reflective layer
06/18/2014CN203659929U 一种胶体表面粗化的led灯 Colloids surface roughening led lights
06/18/2014CN203659928U 发光二极管、背光源及显示装置 Light-emitting diodes, backlight and display device
06/18/2014CN203659927U 一种调光调色混色led封装结构 A light-toned color mixing led restructuring package
06/18/2014CN203659926U 强力结合式透明多角度发光led灯条 The powerful combination of style and transparent multi-angle light led light bar
06/18/2014CN203659925U 高亮度贴片发光二极管 High brightness SMD LEDs
06/18/2014CN203659924U 一种led封装基板 One kind of led package substrate
06/18/2014CN203659923U 一种cob集成光源 One kind cob integrated light source
06/18/2014CN203659922U 一种基于点胶成型透镜的led发光装置 A led light-emitting device based on the point plastic molding lenses
06/18/2014CN203659921U 适用于led支架emc封装的料片排料和投料装置 Blank nesting and feeding device for led bracket emc package
06/18/2014CN203659920U 一种led支架 One kind of led bracket
06/18/2014CN203659919U 太阳能电池组件封装结构 Solar module encapsulation structure
06/18/2014CN203659918U 一种散热led灯 A heat sink led lights
06/18/2014CN203659917U 一种散热型led封装结构 A heat sink type led package structure
06/18/2014CN203659916U Led封装的芯片角度校正装置 Led chip package angle correction means
06/18/2014CN203659915U Led封装基板 Led package substrate
06/18/2014CN203659914U 一种深紫外二极管外延片和芯片 One kind of deep ultraviolet diode epitaxial wafers and chips
06/18/2014CN203659913U 一种新型结构的发光二极管 A new structure of light-emitting diodes
06/18/2014CN203659912U GaN基发光二极管外延片及GaN基发光二极管 GaN-based light emitting diode epitaxial wafers and GaN-based light emitting diode
06/18/2014CN203659911U 一种led外延结构 One kind of led epitaxial structure
06/18/2014CN203659910U 芯片与蓝膜分离装置 Blue chip and membrane separation unit
06/18/2014CN203659856U 一种贴片led A patch led
06/18/2014CN203659855U Led制造模具 Led manufacture of molds
06/18/2014CN203659854U 一种螺旋形led封装灯丝 Filament in a spiral shape led package
06/18/2014CN203659853U 一种pcb支架插件型led指示灯 One kind of plug-type led light pcb brackets
06/18/2014CN203659825U Led封装的焊台传送机构 Led package soldering station transport mechanism
06/18/2014CN203659824U Led封装焊台中的芯片焊接搬送装置 Led chip package soldering station soldering conveying device
06/18/2014CN203659823U 芯片定位供给机构 Chip supply mechanism positioning
06/18/2014CN203659368U Led显示屏 Led Display
06/18/2014CN203656690U 一种具有多彩效果的灯串 A colorful string lights has the effect of
06/18/2014CN203656627U 一种螺旋形led灯丝的灯泡 In a spiral-shaped led light bulb filament
06/18/2014CN203649679U Led封装的共晶焊台 Led package eutectic soldering station
06/18/2014CN103875141A Semiconductor layer sequence, optoelectronic semiconductor chip and method for producing a semiconductor layer sequence
06/18/2014CN103875086A Wavelength converting element and arrangement comprising at least one light-emitting diode and a wavelength converting element
06/18/2014CN103875085A Light-emitting diode package
06/18/2014CN103875084A Method for manufacturing a can package-type optical device, and optical device manufactured thereby
06/18/2014CN103874883A Optical semiconductor lighting device
06/18/2014CN103872234A Light-emitting device, light-emitting device assembly, and electrode-bearing substrate
06/18/2014CN103872233A Light emitting diode
06/18/2014CN103872232A LED flip chip structure and manufacturing method thereof
06/18/2014CN103872231A Semiconductor LED (Light Emitting Diode) luminescent device
06/18/2014CN103872230A Light source and manufacturing method thereof
06/18/2014CN103872229A Light-emitting element
06/18/2014CN103872228A Light-emitting-diode combination
06/18/2014CN103872227A Method for manufacturing LED lamp filament light source capable of illuminating by 360 degrees
06/18/2014CN103872226A Light emitting diode package and manufacturing method thereof
06/18/2014CN103872225A Light-emitting film used for LED lighting and provided with micro-mirror structure and preparing method thereof
06/18/2014CN103872224A Novel LED (Light Emitting Diode) illuminating element
06/18/2014CN103872223A LED (light-emitting diode) chip scale packaging method
06/18/2014CN103872222A Phosphor cap for led die top and lateral surfaces
06/18/2014CN103872221A Light-emitting device
06/18/2014CN103872220A LED packaging method
06/18/2014CN103872219A LED packaging support and LED luminophor
06/18/2014CN103872218A LED support and LED luminous body
06/18/2014CN103872217A High-power LED (Light Emitting Diode) light source package body
06/18/2014CN103872216A High-power LED (Light Emitting Diode) light source module
06/18/2014CN103872215A Mounting structure for lighting device
06/18/2014CN103872214A Manufacturing method of automatic silk-screen paster LED (light emitting diode)
06/18/2014CN103872213A Manufacturing method of automatic needle beating paster LED (light emitting diode)
06/18/2014CN103872212A LED (light-emitting diode) packaging method
06/18/2014CN103872211A Light emitting device package
06/18/2014CN103872210A Packaging structure
06/18/2014CN103872209A LED support
06/18/2014CN103872208A Light emitting diode of vertical structure of reflector with high reflectivity
06/18/2014CN103872207A Strong-light LED (light emitting diode) light source module and production process thereof
06/18/2014CN103872206A Method for manufacturing light emitting device and light emitting device manufactured by method
06/18/2014CN103872205A LED uniform in light emitting
06/18/2014CN103872204A P (Positive) type insert layer with cycle structure and growing method
06/18/2014CN103872203A High-brightness LED with surface microstructure and manufacturing and screening method thereof
06/18/2014CN103872202A Optoelectronic device and method for manufacturing the same
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