Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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08/07/2014 | US20140217440 Light-emitting module and manufacturing method thereof |
08/07/2014 | US20140217439 Semiconductor Light Emitting Device |
08/07/2014 | US20140217438 Semiconductor light emitting device and method for manufacturing same |
08/07/2014 | US20140217437 Light emitting apparatus and manufacturing method thereof |
08/07/2014 | US20140217436 Submount-free light emitting diode (led) components and methods of fabricating same |
08/07/2014 | US20140217434 Light emitting devices and methods |
08/07/2014 | US20140217433 Light emitter devices and methods for light emitting diode (led) chips |
08/07/2014 | US20140217431 Display device, method for manufacturing the same, and electronic device |
08/07/2014 | US20140217430 Optoelectronic semiconductor unit and module comprising a plurality of such units |
08/07/2014 | US20140217428 Light-Emitting Device With Multi-Color Temperature And Multi-Loop Configuration |
08/07/2014 | US20140217427 Solid-state light emitting devices and signage with photoluminescence wavelength conversion |
08/07/2014 | US20140217423 Semiconductor light-emitting device, method for forming recesses of the same, and light source apparatus using the same |
08/07/2014 | US20140217418 Semiconductor light emitting device having roughness layer |
08/07/2014 | US20140217417 Illumination method and light-emitting device |
08/07/2014 | US20140217361 Group iii nitride nanorod light emitting device |
08/07/2014 | US20140217360 Semiconductor light-emitting element and method for producing the same |
08/07/2014 | US20140217359 Light-Emitting Apparatus |
08/07/2014 | US20140217358 Light-emitting diode and the manufacture method of the same |
08/07/2014 | US20140217357 Semiconductor light emitting device |
08/07/2014 | US20140217356 Thin film wafer transfer and structure for electronic devices |
08/07/2014 | US20140217355 Semiconductor light emitting device |
08/07/2014 | US20140217326 Coated phosphors and light emitting devices including the same |
08/07/2014 | US20140217272 Thermal conductivity and phase transition heat transfer mechanism including optical element to be cooled by heat transfer of the mechanism |
08/07/2014 | DE112012003819T5 Verfahren zum Fertigen einer LED, Vorrichtung zum Fertigen einer LED und LED A method for manufacturing a LED, apparatus for fabricating an LED and LED |
08/07/2014 | DE102013202034A1 Optoelektronische Bauelementevorrichtung, Verfahren zum Herstellen einer optoelektronischen Bauelementevorrichtung; Optoelectronic Devices device, method of manufacturing an opto-electronic device components; geometrisch flexible Reflektorpaste; geometrically flexible reflector paste; Verfahren zum Herstellen eines geometrisch flexiblen Reflektors A method for producing a geometrically flexible reflector |
08/07/2014 | DE102013201931A1 Laserbauelement und Verfahren zu seiner Herstellung Laser device and method for its preparation |
08/07/2014 | DE102013201775A1 Beleuchtungsmodul und Verfahren zur Herstellung eines Beleuchtungsmoduls Lighting module and method of manufacturing a illumination module |
08/07/2014 | DE102013100576A1 Optoelektronisches Halbleiterbauteil An optoelectronic semiconductor device |
08/07/2014 | DE102006027307B4 Verfahren zur Herstellung einer Sinterglaskeramik und deren Verwendung A process for producing a sintered glass ceramic, and their use |
08/06/2014 | EP2763199A1 Light-emitting element mounting substrate and light emitting device |
08/06/2014 | EP2763198A1 Light emitting device and coating liquid |
08/06/2014 | EP2763197A1 Phosphor dispersion liquid and method for manufacturing led device |
08/06/2014 | EP2763196A2 Semiconductor light emitting device and method for manufacturing the same |
08/06/2014 | EP2763195A2 Light emitting device |
08/06/2014 | EP2763194A2 Light emitting device |
08/06/2014 | EP2763193A2 Light emitting device |
08/06/2014 | EP2763192A1 Nitride semiconductor element and method for producing same |
08/06/2014 | EP2763191A2 Light emitting device, super-luminescent diode, and projector |
08/06/2014 | EP2763175A2 Semiconductor light emitting element |
08/06/2014 | EP2761685A2 Optoelectronic device package, array and method of fabrication |
08/06/2014 | EP2761680A2 Spontaneous and stimulated emission control using quantum-structure lattice arrays |
08/06/2014 | EP2761679A2 Coalesced nanowire structures with interstitial voids and method for manufacturing the same |
08/06/2014 | EP2761678A2 Nanowire sized opto-electronic structure and method for manufacturing the same |
08/06/2014 | EP2761677A1 Light emitting diode fabricated by epitaxial lift-off |
08/06/2014 | EP2761645A2 Group iii-v substrate material with particular crystallographic features and methods of making |
08/06/2014 | EP2760970A1 Phosphor materials and related devices |
08/06/2014 | EP2760925A1 Polyamide composition having high thermal conductivity |
08/06/2014 | EP2760910A2 Oxetane-containing compounds and compositions thereof |
08/06/2014 | DE202014103436U1 Optoelektronische Baugruppe mit Wärmesenke The optoelectronic assembly with heat sink |
08/06/2014 | CN203760515U 适合激光焊接的led Suitable for laser welding led |
08/06/2014 | CN203760514U 一种led照明灯 One kind of led lighting |
08/06/2014 | CN203760513U Led显示屏器件及led显示模组 Led display devices and led display module |
08/06/2014 | CN203760512U 一种led显示屏器件及led显示模组 One kind of led display devices and led display module |
08/06/2014 | CN203760511U 一种led封装结构 One kind of led package |
08/06/2014 | CN203760510U 一种大出光角度的led光源模组 One kind of large-angle light led light module |
08/06/2014 | CN203760509U 一种360度发光的柔性led发光条 One kind of 360-degree light-emitting flexible led light bar |
08/06/2014 | CN203760508U 一种全金属结构的led封装支架 An all-metal stents led package structure |
08/06/2014 | CN203760507U 一种具有对位标识的led共晶晶片 A kind of counterpoint identity led Jingjing sheet total |
08/06/2014 | CN203760506U 一种提高整体波长均匀性的石墨基座 Method for improving the uniformity of the overall wavelength graphite base |
08/06/2014 | CN203760505U 用于lao衬底的非极性蓝光led外延片的制备装置 Nonpolar blue led for lao substrate wafer preparation device |
08/06/2014 | CN203760473U 一种系统级led封装器件 A system-level devices led package |
08/06/2014 | CN203760472U 一种系统级led封装器件 A system-level devices led package |
08/06/2014 | CN203760471U 一种led的组件 One kind of led components |
08/06/2014 | CN203760469U 一种led组件 One kind of led module |
08/06/2014 | CN203760468U 嵌入裸芯片背光源结构 Embed die backlight structure |
08/06/2014 | CN203760467U 一种可调色温的白光led光源 An adjustable color temperature of white led light |
08/06/2014 | CN203760466U 一种高导热高光输出的led封装基板 Led package substrate a high light output of a high thermal |
08/06/2014 | CN203760095U 一种透明导电薄膜 A transparent conductive film |
08/06/2014 | CN203760010U 一种基于积层基板的显示、控制分离的半导体显示单元 A laminated substrate based on the display, the display control unit separate semiconductor |
08/06/2014 | CN203760002U 一种长方形的led显示单元模组 One kind of rectangular led display unit module |
08/06/2014 | CN203757395U 照明用光源 Illumination light source |
08/06/2014 | CN103975451A 制造半导体发光器件的方法 The method of manufacturing a semiconductor light emitting device |
08/06/2014 | CN103975040A 具有厚且均匀的二氧化钛涂层的高度可靠的光致发光材料 Highly reliable light having a thick and uniform titanium oxide coating electroluminescent material |
08/06/2014 | CN103974992A 环氧树脂组合物、其固化物以及光半导体装置 Epoxy resin composition, cured product thereof and an optical semiconductor device |
08/06/2014 | CN103974485A 发光模块 Emitting module |
08/06/2014 | CN103972743A 发光二极管及运用其的电连接器 Light-emitting diodes and the use of its electrical connector |
08/06/2014 | CN103972380A 一种led电路板 One kind of led board |
08/06/2014 | CN103972379A 具有发光二极管的发光装置 A light emitting device having a light emitting diode |
08/06/2014 | CN103972378A 一种led发光装置及其封装方法 A light emitting device and packaging method led |
08/06/2014 | CN103972377A 利用倒装固晶对全角度发光led灯丝进行封装的方法 The use of solid crystal flip the whole point of light led filament encapsulation method |
08/06/2014 | CN103972376A 发光二极管装置 Light-emitting diode device |
08/06/2014 | CN103972375A 一种免封装且免电路板的发光二极管装置及其制造方法 A light emitting diode device package Free Free circuit board and its manufacturing method |
08/06/2014 | CN103972374A 多垂直led封装结构 More vertical structure led package |
08/06/2014 | CN103972373A 一种led金属引线框架及其制造方法 Metal lead frame and method of manufacturing led |
08/06/2014 | CN103972372A 发光二极管封装结构 Light emitting diode package structure |
08/06/2014 | CN103972371A 发光二极管封装结构及其制造方法 LED package structure and manufacturing method |
08/06/2014 | CN103972370A 半导体光学装置 Semiconductor optical device |
08/06/2014 | CN103972369A 一种led灯条及其制造方法 A lamp led strip and its manufacturing method |
08/06/2014 | CN103972368A 一种基于光刻技术的led荧光粉的图形化方法 Graphical method based on lithography led phosphor |
08/06/2014 | CN103972367A 发光二极管装置 Light-emitting diode device |
08/06/2014 | CN103972366A 波长转换物质、波长转换胶体以及发光装置 Wavelength conversion material, the wavelength conversion light emitting device and colloidal |
08/06/2014 | CN103972365A 一种功率led封装结构及方法 A power led package structure and method |
08/06/2014 | CN103972364A 一种led光源的制造方法 A method of manufacturing a light source led |
08/06/2014 | CN103972363A 固晶机摆臂复合运动模组 Composite Bonder arm motion module |
08/06/2014 | CN103972362A 发光器件 Light-emitting devices |
08/06/2014 | CN103972361A 电路板、光电子构件和光电子构件的装置 System board, optoelectronics components and optoelectronic components |
08/06/2014 | CN103972360A Led晶片封装方法 Led chip packaging method |
08/06/2014 | CN103972359A 发光二极管及其芯片板上封装结构 Light-emitting diode chip and board packaging structure |
08/06/2014 | CN103972358A 双面发光的led灯板结构及其制造方法 Sided glowing led light board structure and manufacturing method |
08/06/2014 | CN103972357A 发光二极管封装件及其导线架 Light-emitting diode package and leadframe |