H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof

Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
12/2011
12/01/2011	US20110291097 Tft array substrate, and liquid crystal display panel
12/01/2011	US20110291096 Array substrate and method of fabricating the same
12/01/2011	US20110291094 Display panel
12/01/2011	US20110291088 Light Emitting Device
12/01/2011	US20110291074 Semi-Polar Nitride-Based Light Emitting Structure and Method of Forming Same
12/01/2011	US20110291073 Quantum dot phosphor for light emitting diode and method of preparing the same
12/01/2011	US20110291072 Semiconductor dies, light-emitting devices, methods of manufacturing and methods of generating multi-wavelength light
12/01/2011	US20110291071 Quantum dot light emitting diode device and display device therewith
12/01/2011	US20110291070 Light emitting device, light emitting device package, and lighting system
12/01/2011	US20110291069 Light-emitting devices and methods of manufacturing the same
12/01/2011	DE10393949T5 Lichtemittierende Vorrichtung, Verfahren zum Herstellen der Vorrichtung und LED-Lampe, bei der die Vorrichtung verwendet wird A light emitting device, method for manufacturing the device and LED lamp, wherein the device is used
12/01/2011	DE102011102594A1 Strukturierter Monokristall Structured monocrystal
12/01/2011	DE102010029529A1 Component carrier i.e. metal core printed circuit board, for LED lighting device, has heat guide element arranged on mounting plate and in contact with electronic component, where heat guide element passes through heat sink
12/01/2011	DE102010029368A1 Elektronische Anordnung und Verfahren zum Herstellen einer elektronischen Anordnung An electronic device and method for manufacturing an electronic device
12/01/2011	DE102010021791A1 Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements und eines Verbunds Optoelectronic component and process for producing an optoelectronic component and a composite
12/01/2011	DE102007017335B4 Beleuchtungseinheit mit einer transparenten Trägerplatte und daraufsitzender Leuchtdiode Lighting unit with a transparent base plate and sitting on light-emitting diode
12/01/2011	CA2800496A1 Light emitting diode light source including all nitride light emitting diodes
11/2011
11/30/2011	EP2390972A1 Nitride-semiconductor luminescent element, epitaxial substrate, and method of producing nitride-semiconductor luminescent element
11/30/2011	EP2390937A1 Light emitting device package comprising an optical filter between a light emitting device and a fluorescent layer
11/30/2011	EP2390936A1 Semiconductor light emitting device and method for manufacturing same
11/30/2011	EP2390935A1 Semiconductor light emitting device and method for manufacturing same
11/30/2011	EP2390934A2 Light emitting device and light emitting device package
11/30/2011	EP2390933A1 Semiconductor light emitting device
11/30/2011	EP2390932A1 Semiconductor device and method for manufacturing same
11/30/2011	EP2390931A2 Light emitting device, light emitting device package, and lighting device system
11/30/2011	EP2390930A2 Semiconductor dies, light-emitting devices, methods of manufacturing and methods of generating multi-wavelength light
11/30/2011	EP2390929A1 Semiconductor light-emitting device
11/30/2011	EP2390928A2 Light emitting device, light emitting device package, and lighting system
11/30/2011	EP2390927A1 Light emitting device array, method for fabricating light emitting device array and light emitting device package
11/30/2011	EP2390926A2 Light emitting device, method for fabricating the light emitting device, light emitting device package, and lighting unit
11/30/2011	EP2390918A2 Light emitting device using AC and manufacturing method of the same
11/30/2011	EP2390917A2 Light emitting device and lighting apparatus
11/30/2011	EP2390916A2 Stacked light emitting devices and method of fabricating the same
11/30/2011	EP2390915A1 Light emitting device and light unit having the same
11/30/2011	EP2390909A1 Miniature packaging for discrete circuit components
11/30/2011	EP2390903A1 Semiconductor device and method of manufacturing same
11/30/2011	EP2390555A1 Illuminating apparatus
11/30/2011	EP2389694A1 Light source comprising a light recycling device and corresponding light recycling device
11/30/2011	EP2389693A2 Semiconductor device, light emitting device and method for manufacturing the same
11/30/2011	EP2389692A1 Post-synthesis modification of colloidal nanocrystals
11/30/2011	EP2119754B1 Light-emitting device
11/30/2011	EP1843402B1 Semiconductor lighting means and illumination panel comprising the same
11/30/2011	EP1735816B1 Phosphor and blends thereof for use in leds
11/30/2011	DE20321881U1 LEDS mit vertikaler Struktur LEDS vertical structure
11/30/2011	DE20321880U1 LEDS mit vertikaler Struktur LEDS vertical structure
11/30/2011	CN202058788U 光电器件的固定装置 Fixing means photovoltaic device
11/30/2011	CN202058787U 一种带引脚的大功率led A tape-pin power led
11/30/2011	CN202058786U 一种采用cob封装的发光器件 A packaged light emitting device using cob
11/30/2011	CN202058785U 一种依靠荧光胶调色的新型led One kind of rely on a new type of fluorescent plastic palette led
11/30/2011	CN202058784U 一种发光二极管 A light emitting diode
11/30/2011	CN202058783U 一种led封装反光杯 One kind of led package Reflector
11/30/2011	CN202058782U Led支架以及料带结构 Led strip and stand structure
11/30/2011	CN202058781U Led光源组件 Led light source assembly
11/30/2011	CN202058780U 一种节能型led基板 An energy-saving led board
11/30/2011	CN202058779U 一种led灯珠 One kind of led lamp beads
11/30/2011	CN202058778U 支架取片器 Take the piece bracket
11/30/2011	CN202058735U 陶瓷衬底的氮化镓基芯片 The gallium nitride-based ceramic substrate chip
11/30/2011	CN202058733U 闪烁式led封装的支架结构 Scaffold flashing type led package
11/30/2011	CN202058732U 一种芯片与荧光粉分离的大功率led白光面板 A chip with separate high power led white phosphor panel
11/30/2011	CN202058731U 可调变极性的发光二极管改良结构 Adjustable alternating polarity of light-emitting diode structure improvement
11/30/2011	CN202058730U 一种led高导热绝缘基座封装的器件 One kind of led high thermal insulation base package devices
11/30/2011	CN202058720U 散热板改良结构 Improved heat dissipation plate structure
11/30/2011	CN202056572U 一种大角度照明的cobled封装模块 One kind of wide-angle lighting package module cobled
11/30/2011	CN102265706A Led点亮装置及前灯用led点亮装置 Led lighting device and headlights with led lighting device
11/30/2011	CN102265417A 光半导体装置用引线框、其制造方法及光半导体装置 Leadframe optical semiconductor device, method of manufacturing a semiconductor device and light
11/30/2011	CN102265416A 半导体发光元件 Semiconductor light emitting element
11/30/2011	CN102265415A 半导体发光元件的制造方法以及半导体发光元件 The method of manufacturing a semiconductor light emitting element and the semiconductor light emitting element
11/30/2011	CN102265414A 制作垂直结构发光二极管的方法 Making vertical structure light emitting diode
11/30/2011	CN102265399A 光电子投影装置 Photoelectron projection device
11/30/2011	CN102265382A 用于生长Ⅲ族氮化物半导体层的方法 Ⅲ method for growing nitride semiconductor layer
11/30/2011	CN102264503A 粘焊方法和包括粘焊组件的设备 Stick welding method and stick welding components including equipment
11/30/2011	CN102263195A 采用荧光粉导热结构的功率型发光二极管 Thermal structure of power using phosphor light-emitting diode
11/30/2011	CN102263194A 半导体封装与制造半导体封装的方法 Semiconductor package and method of fabricating a semiconductor package
11/30/2011	CN102263193A 提高发光二极管亮度的发光芯片及其封装方法 Improve brightness light-emitting diode emitting chip and packaging method
11/30/2011	CN102263192A 发光二极管次基板、发光二极管封装及其制造方法 Second light emitting diode substrate, a light emitting diode package and a manufacturing method
11/30/2011	CN102263191A 发光器件封装 Light emitting device package
11/30/2011	CN102263190A 发光装置 Light-emitting device
11/30/2011	CN102263189A Led器件制造方法 Led device manufacturing method
11/30/2011	CN102263188A 发光元件构装结构 Emitting element package structure
11/30/2011	CN102263187A 发光二极管封装结构及其制造方法 LED package structure and manufacturing method
11/30/2011	CN102263186A 一种高可靠二极管及其制作方法 A highly reliable diode and its manufacturing method
11/30/2011	CN102263185A 热辐射散热发光二极管结构及其制作方法 Thermal radiation heat-emitting diode structure and manufacturing method thereof
11/30/2011	CN102263184A 一种发光二极管制作方法及结构 A light emitting diode manufacturing method and structure
11/30/2011	CN102263183A 一种偏振出光发光二极管 One polarization of light emitting diodes
11/30/2011	CN102263182A 发光器件及其制造方法、发光器件封装以及照明系统 The light emitting device and manufacturing method thereof, a light emitting device package and a lighting system
11/30/2011	CN102263181A 衬底、具有该衬底的led外延片、芯片及发光装置 A substrate having led the substrate wafer, chip and light-emitting device
11/30/2011	CN102263180A 发光器件、制造发光器件的方法以及发光器件封装 A light emitting device, a method of manufacturing the light emitting device and a light emitting device package
11/30/2011	CN102263179A 发光二极管、背光模块及液晶显示装置 Light-emitting diodes, the backlight module and a liquid crystal display device
11/30/2011	CN102263178A 外延片及其形成方法 Epitaxial wafer and method for forming
11/30/2011	CN102263177A 发光器件、发光器件封装以及照明系统 A light emitting device, a light emitting device package and a lighting system
11/30/2011	CN102263176A 发光器件、发光器件封装以及发光装置系统 A light emitting device, a light emitting device package and a light emitting device system
11/30/2011	CN102263175A Led衬底及其制备方法 Led substrate and its preparation method
11/30/2011	CN102263174A 半导体发光元件 Semiconductor light emitting element
11/30/2011	CN102263173A 发光二极管及其制造方法 A light emitting diode and its manufacturing method
11/30/2011	CN102263172A 半导体芯片、发光器件和制造半导体芯片的方法 A semiconductor chip, the light emitting device and a method of manufacturing a semiconductor chip
11/30/2011	CN102263171A 外延衬底、外延衬底的制备方法及外延衬底作为生长外延层的应用 Epitaxial substrate, a method for preparing an epitaxial substrate as a substrate and an epitaxial growth of the epitaxial layer application
11/30/2011	CN102263170A 发光器件和发光器件封装 The light emitting device and a light emitting device package
11/30/2011	CN102263169A Automatic pin cutting machine for LED (Light-Emitting Diode) support
11/30/2011	CN102263120A 半导体发光元件、发光装置、照明装置、显示装置、信号灯器和道路信息装置 The semiconductor light emitting element, a light emitting device, a lighting device, a display device, lights and road information means
11/30/2011	CN102263119A 发光器件阵列及其制造方法以及发光器件封装 The method of manufacturing the light emitting device array and a light emitting device package

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