Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
12/2011
12/14/2011CN202076319U 一种片式led封装用陶瓷散热基板 A chip led package substrate with ceramic heat
12/14/2011CN202076318U 一种led支架和具有该支架的led One kind of led bracket and the bracket has led
12/14/2011CN202076317U 一种浅杯支架led灯珠 A light cup bracket led lamp beads
12/14/2011CN202076316U 二极管金属化封装 Diode metalization package
12/14/2011CN202076315U Led大功率支架 Led High Power Bracket
12/14/2011CN202076314U 一种表面贴装式led封装体 A surface-mount package led
12/14/2011CN202076313U 一种具有多路输出的led照明装置的多功能支架 Multifunctional stand led lighting device having a multi-output
12/14/2011CN202076312U Led灯吸嘴防护器 Led lights nozzle protector
12/14/2011CN202076268U 凸杯结构led光源模块封装结构 Convex glass structure led light module package structure
12/14/2011CN202076267U 一种cob封装结构的led Led one kind cob package structure
12/14/2011CN202076266U 发光二极管的封装模块 Light emitting diode package module
12/14/2011CN202076265U LED module encapsulating structure and lighting device
12/14/2011CN202076264U 一种表面贴装式双色led的封装结构 A surface-mount package of color led
12/14/2011CN202076263U 白色发光数码管 White LED digital tube
12/14/2011CN202075380U 发光元件检测与分类装置 Emitting element detection and classification system
12/14/2011CN202070455U Led固晶机点胶装置 Led Bonder dispensing device
12/14/2011CN1987593B 面状照明装置及以面状照明装置为背光源的液晶显示装置 In the planar lighting device and a planar lighting device for a backlight of a liquid crystal display device
12/14/2011CN1713410B 有机发光二极管及其制造方法 The organic light emitting diode and its manufacturing method
12/14/2011CN102282688A Led模块的制造方法和led模块 Manufacturing methods and led module Led module
12/14/2011CN102282687A 均匀颜色发光的led封装 Uniform color glowing led package
12/14/2011CN102282686A 用于制造光电子器件的方法和光电子器件 Method of manufacturing optoelectronic devices and optoelectronic devices for
12/14/2011CN102282684A 发光器件用衬底 The light emitting device using the substrate
12/14/2011CN102280817A 氮化物半导体器件及其制造方法 The nitride semiconductor device and manufacturing method thereof
12/14/2011CN102280569A 高导热基板及led器件及led组件 High thermal conductivity of the substrate and led led devices and components
12/14/2011CN102280568A 鳍片式散热器 Fin radiator
12/14/2011CN102280567A 利用分配的密封剂的半导体发光器件的封装及其封装方法 Package and packaging method using the allocated sealant semiconductor light emitting device
12/14/2011CN102280566A 一种红外发射管及触摸屏 An infrared emission control and touch screen
12/14/2011CN102280565A 使用量子点的发光装置封装件、照明设备和显示设备 Quantum dot light emitting device package, a lighting device and a display device
12/14/2011CN102280564A 具有荧光粉散热层的发光二极管 LEDs have the phosphor layer of heat
12/14/2011CN102280563A 一种高功率led柔性封装 A high-power led flexible packaging
12/14/2011CN102280562A 发光二极管的封装工艺与其结构 Emitting diode packaging technology and its structure
12/14/2011CN102280561A 发光二极管封装体及其应用 Light-emitting diode package and its application
12/14/2011CN102280560A 发光装置封装结构及其制作方法 The light emitting device package structure and production methods
12/14/2011CN102280559A 发光元件搭载用基板及发光装置 Light-emitting element mounting substrate and light emitting device
12/14/2011CN102280558A 一种搪瓷电致发光元件电极结构 An enameled electroluminescent element electrode structure
12/14/2011CN102280557A 发光元件组立装置及其方法 Emitting element group legislature apparatus and method
12/14/2011CN102280556A Led封装结构 Led package
12/14/2011CN102280555A 一种发光二极管及其制造方法 A light-emitting diode and its manufacturing method
12/14/2011CN102280554A Led芯片电极、led芯片及led照明光源 Led chip electrodes, led chip and led lighting
12/14/2011CN102280553A 覆晶发光二极管晶粒及其晶粒阵列 Flip-chip LED chip array and grains
12/14/2011CN102280552A 发光二极管晶粒及其制作方法 LED chip and manufacturing method thereof
12/14/2011CN102280551A 发光二极管及其制造方法 A light emitting diode and its manufacturing method
12/14/2011CN102280550A 具有改良出光结构的led芯片及其制备方法 Improved chip has led a light structure and its preparation method
12/14/2011CN102280549A 发光装置及投影仪 Light emitting device and projector
12/14/2011CN102280548A 发光二极管结构及其制造方法 Light-emitting diode structure and manufacturing method
12/14/2011CN102280547A 一种有源区为p型的氮化镓系半导体发光管 An active region is p-type gallium nitride based semiconductor light-emitting tube
12/14/2011CN102280546A 量子点发光二极管器件及具有其的显示设备 Quantum dot light emitting diode device and a display device having its
12/14/2011CN102280545A 硅基光发射器件及其制备方法 Silicon-based light emitting device and its preparation method
12/14/2011CN102280544A 半导体发光二极管及其制造方法 The semiconductor light-emitting diode and its manufacturing method
12/14/2011CN102280543A 一种带高反射作用的p型焊盘的发光二极管芯片制造方法 A method of manufacturing the light emitting diode chip with a high reflection effect of the p-type pad
12/14/2011CN102280542A 一种氮化镓基发光二极管多量子阱的生长方法 A gallium nitride-based light-emitting diode MQW growth method
12/14/2011CN102280541A 一种蓝宝石基片表面有序粗化方法及蓝宝石基片、led制备方法和led One kind of orderly sapphire substrate surface roughening methods and sapphire substrates, led the preparation method and led
12/14/2011CN102280540A 具有微通道散热器的led模块及其制备方法 Led module and its preparation method has the microchannel heat sink
12/14/2011CN102280539A 白光led芯片制造方法及其产品和白光led White led chip manufacturing methods and products and white led
12/14/2011CN102280538A 一种复合散热器及其生产工艺 A composite radiator and its production process
12/14/2011CN102280537A 一种led漫反射杯的制备方法 A method for preparing a cup of diffuse led
12/14/2011CN102280536A 一种光辅助红光led的磷化镓窗口层湿法粗化的方法 A light red led gallium phosphide secondary window layer of wet roughening method
12/14/2011CN102280535A 基于氧化石墨制备纳米线阵列led顶电极的方法 Preparation based graphite oxide nanowire arrays led top electrode method
12/14/2011CN102280534A 预处理蓝宝石衬底提高led出光效率的方法 Pretreatment of the sapphire substrate to improve the optical efficiency of the method led
12/14/2011CN102280533A Method for preparing gallium nitride substrate material
12/14/2011CN102280532A 一种发光二极管的smd双色导线架制造方法 A light-emitting diode smd color leadframe manufacturing method
12/14/2011CN102280442A 发光元件基板及其制法 Light-emitting element substrate preparation method
12/14/2011CN102280395A 发光二极管的光电参数分组测试方法 Light-emitting diode optical parameters grouping test method
12/14/2011CN102280370A 一种在硅衬底上生长非极性面AlN模板的方法 Method of growing non-polar surface of the AlN template on a silicon substrate
12/14/2011CN102278621A 一种色温可调的白光led模组、照明设备及制作方法 One kind of adjustable color temperature white led modules, lighting equipment and production methods
12/14/2011CN102277165A 一种基于紫外光或蓝光激发的荧光粉及其制备方法和应用 A phosphor preparation method and application based on UV or blue light excitation
12/14/2011CN102277164A 荧光粉体及发光装置 Phosphor powder and a light emitting device
12/14/2011CN102277163A 白光led用稀土红色荧光粉及其制备方法 White led with rare red phosphor and its preparation method
12/14/2011CN102277162A Europium-doped hydrated zinc molybdate high-efficient red fluorescent powder and preparation method thereof
12/14/2011CN102276958A 用于光学用途的环氧树脂组合物、使用其的光学部件以及使用其获得的光半导体装置 The epoxy resin composition used for optical applications, using the same optical components as well as the use of an optical semiconductor device obtained thereof
12/14/2011CN101924170B 一种led粘片机的旋转定位机构 One kind of led the rotation of the positioning mechanism Die Bonder
12/14/2011CN101877377B 一种分立发光二极管的外延片及其制造方法 A light-emitting diode epitaxial wafer and method of manufacturing a discrete
12/14/2011CN101814479B 电极接触结构及其制造方法 Electrode contact structure and manufacturing method
12/14/2011CN101809769B 化合物半导体外延晶片及其制造方法 Compound semiconductor epitaxial wafer and its manufacturing method
12/14/2011CN101689590B 半导体发光器件封装和方法 The semiconductor light emitting device package and a method of
12/14/2011CN101488551B 一种GaN基发光二极管的制备方法 GaN-based method for preparing one kind of light emitting diode
12/14/2011CN101443924B 利用多层含硅密封剂制备发光器件的方法以及使用该方法制备的发光器件 With multilayer silicon sealant preparation method of the light emitting device and a light emitting device prepared by the method used
12/14/2011CN101425556B 氮化物半导体发光器件及其制造方法 The nitride semiconductor light emitting device and manufacturing method thereof
12/14/2011CN101276994B 半导体光元件的制造方法 The method of manufacturing a semiconductor optical element
12/14/2011CN101036239B 芯片部件型发光器件及其使用的布线基板 Wiring board member type light emitting device chip and its use
12/13/2011US8077248 Optical device and production method thereof
12/13/2011US8077137 Liquid crystal display backlight driving system with light emitting diodes
12/13/2011US8076847 Nitride phosphor and production process thereof, and light emitting device
12/13/2011US8076846 Metal oxide nanoparticles, production method thereof, light-emitting element assembly, and optical material
12/13/2011US8076833 Methods and apparatuses for enhancing heat dissipation from a light emitting device
12/13/2011US8076694 Nitride semiconductor element having a silicon substrate and a current passing region
12/13/2011US8076693 Transparent heat spreader for LEDs
12/13/2011US8076692 LED package
12/13/2011US8076691 Package for light emitting device and method for packaging the same
12/13/2011US8076690 Semiconductor light emitting apparatus having a non-light emitting corner area
12/13/2011US8076689 Light emitting diode
12/13/2011US8076688 Light emitting diode having extensions of electrodes for current spreading
12/13/2011US8076687 Light emitting device for improving the color purity of emitted light and electronic apparatus
12/13/2011US8076686 Light emitting diode and manufacturing method thereof
12/13/2011US8076685 Nitride semiconductor device having current confining layer
12/13/2011US8076684 Group III intride semiconductor light emitting element
12/13/2011US8076683 Surface-textured encapsulations for use with light emitting diodes
12/13/2011US8076682 Contact for a semiconductor light emitting device
12/13/2011US8076681 White organic electroluminescent device
12/13/2011US8076680 LED package having an array of light emitting cells coupled in series