Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
12/2011
12/22/2011US20110309365 Thin film transistor backplane
12/22/2011US20110309363 Active matrix substrate, liquid crystal display apparatus having the same, and method for manufacturing active matrix substrate
12/22/2011US20110309354 Large-scale Fabrication of Vertically Aligned ZnO Nanowire Arrays
12/22/2011US20110309328 Nitride semiconductor light emitting device, epitaxial substrate, and method for fabricating nitride semiconductor light emitting device
12/22/2011US20110309327 Light emitting device, method for fabricating light emitting device, light emitting device package, and lighting system
12/22/2011US20110309326 Deep ultraviolet light emitting diode
12/22/2011US20110309325 Light source module using quantum dots, backlight unit employing the light source module, display apparatus, and illumination apparatus
12/22/2011US20110309324 Solid state devices with semi-polar facets and associated methods of manufacturing
12/22/2011US20110308851 Circuit Substrate and Light Emitting Diode Package
12/22/2011DE102010024545A1 Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device
12/22/2011DE102010024079A1 Verfahren zur Herstellung eines optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip A method for producing an optoelectronic semiconductor chip and optoelectronic semiconductor chip
12/22/2011DE102010023955A1 Optoelektronisches Bauteil The optoelectronic device
12/22/2011CA2802539A1 Nanowire led structure and method for manufacturing the same
12/21/2011EP2398081A1 Composite substrate for led light emitting element, method of production of same, and led light emitting element
12/21/2011EP2398080A2 Light emitting diode and light emitting diode based light source
12/21/2011EP2398079A1 Illuminating device
12/21/2011EP2398078A1 Semiconductor light emitting diode and method of producing same
12/21/2011EP2398077A1 Semiconductor light emitting diode and method of producing same
12/21/2011EP2398076A2 Light emitting device, method for fabricating the same, light emitting device package, and lighting system including the same
12/21/2011EP2398075A1 Nitride semiconductor light-emitting element and process for production thereof
12/21/2011EP2398074A1 Semiconductor light emitting device, method of manufacturing the same, and lighting apparatus and display apparatus using the same
12/21/2011EP2398073A2 Light emitting diode, light emitting diode package, and lighting system
12/21/2011EP2398072A1 Semiconductor light-emitting device
12/21/2011EP2398051A2 LED package structure
12/21/2011EP2398009A2 Led assembly with improved visibility and shapability, attaching method of the same, and banner using the same
12/21/2011EP2397750A1 Lighting device and lighting apparatus using said lighting device
12/21/2011EP2397749A2 Light-emitting device and lighting apparatus
12/21/2011EP2397455A1 Substrate comprising aluminum/graphite composite, heat dissipation part comprising same, and led luminescent member
12/21/2011EP2396832A1 Encapsulated opto-electronic semiconductor arrangement having solder stop layer and corresponding method
12/21/2011EP2396818A2 An optical device
12/21/2011EP2156223B1 Color-tunable illumination system, lamp and luminaire
12/21/2011EP1820837B1 Phosphor and method for producing same, and light-emitting device using same and method for manufacturing such device
12/21/2011EP1502303B1 High voltage switching devices and process for forming same
12/21/2011CN202084579U 一种发光二极管的封装结构 A light emitting diode package structure
12/21/2011CN202084578U 一种led封装结构 One kind of led package
12/21/2011CN202084577U 一种高可靠性的发光二极管 A highly reliable light-emitting diodes
12/21/2011CN202084576U 基于色温集中控制的白光led灯 Based on the color temperature of white led lights centralized control
12/21/2011CN202084575U 一种大功率led封装基板 One kind of high-power led package substrate
12/21/2011CN202084574U Led灯珠 Led lamp beads
12/21/2011CN202084573U 一种大功率led封装结构 One kind of high-power led package structure
12/21/2011CN202084572U 氮化物发光二极管的欧姆接触电极 Nitride light-emitting diode ohmic contact electrode
12/21/2011CN202084571U 路灯用led发光单元 Led street light with a light-emitting unit
12/21/2011CN202084545U Led集成模块 Led Integration Module
12/21/2011CN202084527U 一种新型晶体管构造 A new transistor structure
12/21/2011CN202084524U Packaging plate
12/21/2011CN1993292B 金属氮化物及金属氮化物的制造方法 The method of producing metal nitride and metal nitride
12/21/2011CN1846317B 发射辐射的半导体元件及其制造方法 Emitting semiconductor device and manufacturing method of radiation
12/21/2011CN102292837A 包括光回收器件的光源以及相应的光回收器件 Including the light source and the corresponding optical device light recycling recycling devices
12/21/2011CN102292836A 光电半导体组件 Optoelectronic semiconductor components
12/21/2011CN102292835A 半导体装置及其制造方法 Semiconductor device and manufacturing method
12/21/2011CN102292834A 利用穿通效应的硅发光器件 Punch-through effect of silicon light-emitting device utilizes
12/21/2011CN102292802A 半导体装置及其制造方法 Semiconductor device and manufacturing method
12/21/2011CN102292758A 显示装置 Display device
12/21/2011CN102291865A 交流驱动发光装置和照明设备 AC drive light emitting device and lighting equipment
12/21/2011CN102290524A 一种led器件及其led模组器件 One kind of device and led module led Devices
12/21/2011CN102290523A 一种led散热结构 One kind of led cooling structure
12/21/2011CN102290522A 无线led封装结构及其制造方法 Wi-led package structure and manufacturing method
12/21/2011CN102290521A 白光发射装置及使用其的用于液晶显示器背光的光源模块 White light emitting device and using the same light source module for liquid crystal displays backlighting
12/21/2011CN102290520A 飞轮牙状led支架 Flywheel teeth shape led bracket
12/21/2011CN102290519A 高白度led封装用基板 High brightness led package substrate
12/21/2011CN102290518A Led封装用陶瓷基板 Led package with ceramic substrate
12/21/2011CN102290517A 光半导体元件搭载用封装及使用其的光半导体装置 An optical semiconductor element mounting package and an optical semiconductor device using the same
12/21/2011CN102290516A 发光模块以及照明装置 The light emitting module and a lighting device
12/21/2011CN102290515A 一种用于led发光器件的支架 A device holder for led light
12/21/2011CN102290514A 一种垂直结构电极氮化镓发光芯片及其制造方法 The vertical structure of the electrode and method of manufacturing the gallium nitride light emitting chip
12/21/2011CN102290513A 一种大功率高亮度发光二极管芯片及其制造方法 One kind of high-power high-brightness light-emitting diode chip and its manufacturing method
12/21/2011CN102290512A 设有电流阻绝层的发光二极管及其制作方法 Has a light-emitting diode and method of making the current denial layer
12/21/2011CN102290511A 发光二极管及其制造方法 A light emitting diode and its manufacturing method
12/21/2011CN102290510A 一种低缺陷高亮度的衬底结构体,制备方法及其用途 A low defect high luminance substrate structure, preparation and use
12/21/2011CN102290509A 一种低缺陷高亮度的衬底结构体,制备方法及其用途 A low defect high luminance substrate structure, preparation and use thereof
12/21/2011CN102290508A 一种无荧光粉的白光led A non-phosphor white led
12/21/2011CN102290507A 发光装置及投影仪 Light emitting device and a projector
12/21/2011CN102290506A 具有图形化透明薄膜电极的led模块制造工艺 Led module has a patterned transparent electrode film manufacturing process
12/21/2011CN102290505A GaN基发光二极管芯片及其制造方法 GaN-based light emitting diode chip and its manufacturing method
12/21/2011CN102290504A 基于高导热基板倒装焊技术的cob封装led模块和生产方法 Based on the high thermal conductivity of the substrate flip chip packaging technology cob led module and production methods
12/21/2011CN102290503A 发光二极管及其制作方法 Light-emitting diode and manufacturing method thereof
12/21/2011CN102290502A 一种smd led贴片分光机的吸料移送装置 One kind of patch smd led sorting machines of suction transfer device
12/21/2011CN102290501A Led日光灯白光封装元件的制造方法 Led fluorescent white light manufacturing method of packaging components
12/21/2011CN102290500A 发光装置及其制造方法 A light emitting device and manufacturing method thereof
12/21/2011CN102290499A 一种led热管散热片的生产工艺 One kind of heat pipe production process led heatsink
12/21/2011CN102290498A 制作芯片阶的平面荧光粉产生白光led的方法 Flat phosphor chip production order to produce white light led approach
12/21/2011CN102290497A 一种发光二极管的smd导线架制造方法 A light-emitting diode smd leadframe manufacturing method
12/21/2011CN102290452A 反射电极和光电元件 Reflective electrode and Optoelectronics
12/21/2011CN102290410A Led面光源及其制造方法 Led surface light source and its manufacturing method
12/21/2011CN102290409A 发光装置 Light-emitting device
12/21/2011CN102290408A 发光装置以及照明装置 A light emitting device and a lighting device
12/21/2011CN102290407A 发光装置以及照明装置 The light emitting device and a lighting device
12/21/2011CN102290406A 具有测试垫的发光二极管封装及其测试方法 A light-emitting diode package and method of test pads
12/21/2011CN102290347A 一种刻蚀系统 One kind of etching system
12/21/2011CN102286261A Led用氨基固化体系环氧功能化有机硅导电胶粘剂 Led curing system with amino functional silicone conductive epoxy adhesive
12/21/2011CN102286260A Led用耐黄变高透光率绝缘环氧胶及制备方法和应用 Led by anti-yellowing epoxy insulation with high transmittance and preparation method and application
12/21/2011CN102286259A Led用环氧功能化有机硅导电胶粘剂 Led by a conductive epoxy functional silicone adhesive
12/21/2011CN101958378B 具有电流阻塞结构的四元系垂直发光二极管及其制备方法 Quaternary vertical light-emitting diode and preparation method has a current blocking structure
12/21/2011CN101916757B 一种微流体冷却的硅晶圆片级led照明系统 A microfluidic cooling the silicon wafer level led lighting system
12/21/2011CN101855736B 具有载流子注入的硅发光器件 Injection of carriers into the silicon light emitting device having
12/21/2011CN101849034B 使用硅烷作为前驱体制备n-型半导体材料的方法 Silane as the precursor preparation method n- type semiconductor material
12/21/2011CN101806429B 彩色发光装置 Color light-emitting device
12/21/2011CN101803048B 发射辐射的器件 Radiation-emitting devices
12/21/2011CN101728468B 实现半导体超辐射发光二极管无制冷封装耦合的方法 Way to achieve super-luminescent diode semiconductor package without refrigeration coupling
12/21/2011CN101719483B 用于生长纤锌矿型晶体的衬底、其制造方法和半导体器件 The substrate for growing a wurtzite type crystal, and a semiconductor device manufacturing method thereof