| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 01/04/2012 | EP2286469B1 Semiconductor body and method for producing a semiconductor body |
| 01/04/2012 | EP2274779B1 Method for the synthesis of an array of metal nanowires capable of supporting localized plasmon resonances and method for making a photonic device comprising said array |
| 01/04/2012 | EP1953818B1 Electronic component mounting board |
| 01/04/2012 | EP1941555B1 SEMICONDUCTOR LIGHT-EMITTING DEVICE WITH ELECTRODE FOR N-POLAR InGaAlN SURFACE |
| 01/04/2012 | CN202103945U Circuit board for assembling LED (light-emitting diode) |
| 01/04/2012 | CN202103944U Metal-base printed circuit board |
| 01/04/2012 | CN202103943U Printed circuit board with metal micro-radiator |
| 01/04/2012 | CN202103099U High-power LED (light-emitting diode) |
| 01/04/2012 | CN202103098U Heat conduction structure |
| 01/04/2012 | CN202103097U Photo-translating system for semiconductor |
| 01/04/2012 | CN202103096U Nesting radiation support for packaging LED and LED lamp |
| 01/04/2012 | CN202103095U LED (Light-emitting Diode) heat radiator |
| 01/04/2012 | CN202103094U Through hole type high heat dissipation LED chip |
| 01/04/2012 | CN202103093U High-efficiency high-voltage bonded LED chip with perpendicular through hole |
| 01/04/2012 | CN202103092U Efficient and high voltage bond-type LED chip structure with electrodes on side walls |
| 01/04/2012 | CN202103091U High-power LED (Light-emitting Diode) base plate structure |
| 01/04/2012 | CN202103090U Novel LED packaging structure |
| 01/04/2012 | CN202103089U LED package and lead frame |
| 01/04/2012 | CN202103088U Sleeve with additionally arranged light-emitting diode |
| 01/04/2012 | CN202103087U High-power diode chip |
| 01/04/2012 | CN202103086U Isolating post used for LED (light-emitting diode) |
| 01/04/2012 | CN202103085U Thermoelectric separation type LED integrated light source board |
| 01/04/2012 | CN202103084U Independent elastic anti-floating tool for LED mouldboard element |
| 01/04/2012 | CN202103048U Surface mounting device |
| 01/04/2012 | CN202103047U LED luminescence module group |
| 01/04/2012 | CN202103046U Light emitting diode radiating structure and backlight module |
| 01/04/2012 | CN202103045U Modular LED light source structure |
| 01/04/2012 | CN202102655U SMD type LED outdoor screen |
| 01/04/2012 | CN202101179U Device for fixing a PGB paster diode on a curtain |
| 01/04/2012 | CN202100964U LED (light emitting diode) energy-saving lamp tube with wide spectrum |
| 01/04/2012 | CN202097908U Mold for core part of light emitting diode (LED) |
| 01/04/2012 | CN102308399A Light-emitting-device package and a method for producing the same |
| 01/04/2012 | CN102308398A LED light-emitting device |
| 01/04/2012 | CN102308397A Light-emitting diode, and light-emitting diode lamp |
| 01/04/2012 | CN102308396A Method for structuring a semiconductor surface, and semiconductor chip |
| 01/04/2012 | CN102308395A 半导体发光装置 The semiconductor light emitting device |
| 01/04/2012 | CN102308384A Improved packaging for LED combinations |
| 01/04/2012 | CN102308370A Epitaxial wafer, method for manufacturing gallium nitride semiconductor device, gallium nitride semiconductor device and gallium oxide wafer |
| 01/04/2012 | CN102308032A GaN substrate, method for manufacturing GaN substrate, method for manufacturing GaN layer bonded substrate and method for manufacturing semiconductor device |
| 01/04/2012 | CN102306700A Light and color regulable COBLED structure |
| 01/04/2012 | CN102306699A Integrated light-emitting diode (LED) packaging structure |
| 01/04/2012 | CN102306698A Novel LED packaging structure |
| 01/04/2012 | CN102306697A Ultra-thin-type LED (light emitting diode) support with heat-radiation bottom |
| 01/04/2012 | CN102306696A Light-emitting semiconductor chip support with holes |
| 01/04/2012 | CN102306695A Ceramic-layer-plated base for LED (light emitting diode) light source single-cup module |
| 01/04/2012 | CN102306694A Nested radiation bracket for light-emitting diode (LED) packaging, LED lamp and manufacturing method |
| 01/04/2012 | CN102306693A Graphical nitride-based luminescent epitaxial wafer and luminescent chip, and manufacturing methods thereof |
| 01/04/2012 | CN102306692A Processing method of LED (light emitting diode) |
| 01/04/2012 | CN102306691A Method for raising light emitting diode luminescence efficiency |
| 01/04/2012 | CN102306690A Color temperature detection and repair machine of white light LED (light-emitting diode) and detection repair method thereof |
| 01/04/2012 | CN102306689A Method for producing light-emitting diode (LED) bracket based on thermally conductive plastics |
| 01/04/2012 | CN102306647A LED (light emitting diode) illuminant multi-cup module of base plate with a ceramic plated layer |
| 01/04/2012 | CN102306624A Manufacturing methods for photonic crystal and semiconductor and device comprising semiconductor |
| 01/04/2012 | CN102306623A Method for preparing nanoscale silica graphic mask layer |
| 01/04/2012 | CN102306482A Driving device |
| 01/04/2012 | CN102005518B Method for preparing pyramidal patterned substrate through twice corrosion |
| 01/04/2012 | CN101997068B Method for preparing GaN base LED (Light Emitting Diode) |
| 01/04/2012 | CN101964341B Light-emitting structure with a plurality of backup welding pads for improving lead welding success rate and manufacture method thereof |
| 01/04/2012 | CN101891893B Preparation method of phenyl-based hydrogen-based silicone resin for encapsulating LED |
| 01/04/2012 | CN101828274B Nickel tin bonding system with barrier layer for semiconductor wafers and devices |
| 01/04/2012 | CN101821867B Semiconductor luminescent component and semiconductor luminescent device using the same and method of manufacturing semiconductor luminescent device |
| 01/04/2012 | CN101777611B Light emitting diode (LED) magnetic adsorption and positioning aluminum wire bonding machine with cross guide rail transfer table |
| 01/04/2012 | CN101777609B Silica-based forward implantation light-emitting device and manufacturing method thereof |
| 01/04/2012 | CN101752275B Packaging method and packaging structure of light emitting diode (LED) module |
| 01/04/2012 | CN101709858B Making methods of LED lighting high-efficiency heat-radiating aluminum baseplate and LED light source |
| 01/04/2012 | CN101593800B Lighting device with high power |
| 01/04/2012 | CN101577306B Illuminating device |
| 01/04/2012 | CN101449392B A base plate for mounting a luminous element, a luminous element packaging body, a display device and an illuminating apparatus |
| 01/04/2012 | CN101443400B Adhesion-promoting agent, curable organopolysiloxane composition, and semiconductor device |
| 01/04/2012 | CN101415736B Curable resin composition |
| 01/04/2012 | CN101409229B Epitaxial substrate and manufacturing method thereof, and method for manufacturing LED device |
| 01/04/2012 | CN101351899B Semiconductor light emitting device and method for manufacturing the same |
| 01/04/2012 | CN101325195B Semiconductor light emitting apparatus |
| 01/04/2012 | CN101226976B LED device and locating structure thereof |
| 01/04/2012 | CN101189367B Composite comprising array of acicular crystal, process for producing the same, photoelectric conversion element, luminescent element, and capacitor |
| 01/04/2012 | CN101017869B Nitride-based semiconductor light emitting device and method of manufacturing the same |
| 01/03/2012 | US8089093 Nitride semiconductor device including different concentrations of impurities |
| 01/03/2012 | US8089092 Semiconductor light emitting device |
| 01/03/2012 | US8089090 Ultra-thin ohmic contacts for p-type nitride light emitting devices |
| 01/03/2012 | US8089089 Side-emitting LED package and manufacturing method of the same |
| 01/03/2012 | US8089088 Light emitting device |
| 01/03/2012 | US8089087 Light emitting device package |
| 01/03/2012 | US8089086 Light source |
| 01/03/2012 | US8089085 Heat sink base for LEDS |
| 01/03/2012 | US8089084 Light emitting device |
| 01/03/2012 | US8089083 System and method for enhancing light emissions from light packages by adjusting the index of refraction at the surface of the encapsulation material |
| 01/03/2012 | US8089082 Nitride semiconductor LED and fabrication method thereof |
| 01/03/2012 | US8089081 Semiconductor light emitting device |
| 01/03/2012 | US8089080 Engineered structure for high brightness solid-state light emitters |
| 01/03/2012 | US8089079 Light emitting device |
| 01/03/2012 | US8089078 Light emitting device |
| 01/03/2012 | US8089077 Light-emitting element array with micro-lenses and optical writing head |
| 01/03/2012 | US8089075 LFCC package with a reflector cup surrounded by a single encapsulant |
| 01/03/2012 | US8089074 Light emitting device having vertically stacked light emitting diodes |
| 01/03/2012 | US8089067 Semiconductor device |
| 01/03/2012 | US8089061 Quantum dot inorganic electroluminescent device |
| 01/03/2012 | US8088877 Photo or electron beam curable compositions |
| 01/03/2012 | US8088649 Radiation-emitting semiconductor body with carrier substrate and method for the producing the same |
| 01/03/2012 | US8088637 Method of manufacturing a semiconductor device including a superlattice strain relief layer |
| 01/03/2012 | US8088635 Vertical geometry light emitting diode package aggregate and production method of light emitting device using the same |