Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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12/29/2011 | DE102010024864A1 Optoelektronisches Halbleiterbauteil An optoelectronic semiconductor device |
12/29/2011 | DE102010024862A1 Optoelektronisches Halbleiterbauelement Optoelectronic semiconductor component |
12/29/2011 | DE102010017560A1 Lamp has semiconductor structure that is provided on bottom of trough through thermally conductive adhesive, and is electrically connected with strip guard to emit the light to surrounding reflector |
12/29/2011 | CA2802500A1 Substrate with buffer layer for oriented nanowire growth |
12/28/2011 | EP2400571A1 Light-emitting diode, light-emitting diode lamp, and method for producing light-emitting diode |
12/28/2011 | EP2400570A2 Substrate for an optical device, an optical device package comprising the same and a production method for the same |
12/28/2011 | EP2400569A2 Light-emitting diode package |
12/28/2011 | EP2400568A2 Light emitting device package including several lenses and lighting system |
12/28/2011 | EP2400567A2 Phosphor selection for a Light-Emitting Device |
12/28/2011 | EP2400566A1 Semiconductor light emitting device, lighting module, lighting apparatus |
12/28/2011 | EP2400565A1 Led and led package |
12/28/2011 | EP2400564A2 Light-emitting devices with improved active-region |
12/28/2011 | EP2400563A2 Light-emitting devices with improved active-region |
12/28/2011 | EP2400533A2 Diamond field effect transistor and process for producing the same |
12/28/2011 | EP2400532A2 Diamond semiconductor element and process for producing the same |
12/28/2011 | EP2400531A2 Diamond semiconductor element and process for producing the same |
12/28/2011 | EP2400530A2 Diamond semiconductor element and process for producing the same |
12/28/2011 | EP2400323A1 Liquid crystal display device, backlight and LED |
12/28/2011 | EP2399733A2 Preparation of nanocrystallines |
12/28/2011 | EP2399302A2 Compact molded led module |
12/28/2011 | DE202011108025U1 Optisch wirksames Bauelement zur Verwendung an SMD Leuchtdioden ohne primäre Optik Optically active component for use in SMD LEDs without primary optics |
12/28/2011 | CN202094177U 一种led灯珠 One kind of led lamp beads |
12/28/2011 | CN202094176U Smd发光二极管支架改良结构 Smd improved stand-emitting diode structure |
12/28/2011 | CN202094175U 一种远荧光粉的led封装结构 A far-phosphor led package |
12/28/2011 | CN202094174U 一种发光二极管的封装结构 A light emitting diode package structure |
12/28/2011 | CN202094173U 一种采用荧光粉层封装的led侧背光源 One kind of using the phosphor layer encapsulation led dorsal light |
12/28/2011 | CN202094172U Led支架量产片连体结构 Led stent production piece Siamese structure |
12/28/2011 | CN202094171U Led支架量产片 Led bracket sheet production |
12/28/2011 | CN202094170U 一种新型led集成芯片光源基板 A new integrated chip led light board |
12/28/2011 | CN202094169U 一种led芯片封装结构 One kind of led chip package structure |
12/28/2011 | CN202094168U Led封装结构 Led package |
12/28/2011 | CN202094167U 照明级led Led lighting level |
12/28/2011 | CN202094166U 一种具有反射型电流阻挡层的led芯片 Led chip having a reflection type current blocking layer |
12/28/2011 | CN202094125U 一种高压交流led晶片模块 A high voltage AC led chip module |
12/28/2011 | CN202094119U 凸杯结构led光源模组封装结构 Convex structure led cup light module package structure |
12/28/2011 | CN202094118U 一种用于照明的led光模组和led芯片 Led light module and led chip for lighting |
12/28/2011 | CN202093756U LED (light-emitting diode) display |
12/28/2011 | CN1595670B 宽谱白光led的量子点有源区结构及其外延生长方法 White led a broad spectrum structure quantum dot active region and the epitaxial growth method |
12/28/2011 | CN102301548A 半导体发光装置及其制造方法 The semiconductor light emitting device and manufacturing method thereof |
12/28/2011 | CN102301499A 发光装置、面光源以及显示装置 A light emitting device, a surface light source and a display device |
12/28/2011 | CN102301498A 等离激元发光二极管 Plasmon light-emitting diodes |
12/28/2011 | CN102301497A 包括不可见的发光二极管光源的透明的物体 Including transparent objects invisible light emitting diodes of the light source |
12/28/2011 | CN102300955A α型赛隆荧光体、其制造方法及发光装置 α-SiAlON phosphor, and a light-emitting device manufacturing method |
12/28/2011 | CN102300902A 发uv光芴基共聚物 Hair uv light butylfluorenyl copolymer |
12/28/2011 | CN102299250A 大功率led的散热模组及其制备方法 Cooling module and preparation method of power led |
12/28/2011 | CN102299249A 具有独立电传与热传路径的发光二极管及其制造方法 Light-emitting diode and method of manufacturing an independent telex and heat transfer path |
12/28/2011 | CN102299248A Led封装支架改良制造方法及由此制得的封装结构 Led stent improved method of manufacturing and packaging the thus obtained packaging structure |
12/28/2011 | CN102299247A 一种全户外led模组 An all-outdoor led module |
12/28/2011 | CN102299246A 发光器件 Light-emitting devices |
12/28/2011 | CN102299245A 复合膜和使用该复合膜的半导体发光器件 Use of the composite film and composite film semiconductor light emitting device |
12/28/2011 | CN102299244A 大功率led无缝异型光源 Shaped seamless power led light |
12/28/2011 | CN102299243A 一种薄膜倒装光子晶体led芯片及其制造方法 A thin film flip-chip photonic crystal led its manufacturing method |
12/28/2011 | CN102299242A Led封装用镀陶瓷层基板 Led package plated ceramic substrate layer |
12/28/2011 | CN102299241A 发光装置用透镜 Light-emitting device with a lens |
12/28/2011 | CN102299240A 发光二极管以及包括其的背光单元和液晶显示器件 A light emitting diode, and a backlight unit including a liquid crystal display device and |
12/28/2011 | CN102299239A 发光器件封装 Light emitting device package |
12/28/2011 | CN102299238A 发光装置和使用该发光装置的led照明器具 Light-emitting device and use led lighting fixtures that light-emitting device |
12/28/2011 | CN102299237A 半导体发光器件 Semiconductor light emitting device |
12/28/2011 | CN102299236A 发光装置 Light-emitting device |
12/28/2011 | CN102299235A 高发光效率的发光二极管 High luminous efficiency light emitting diode |
12/28/2011 | CN102299234A 发光二极管及其制造方法 A light emitting diode and its manufacturing method |
12/28/2011 | CN102299233A 一种不带黄圈聚光性好的大功率led灯珠 A yellow circle with a non-condensing good power led lamp beads |
12/28/2011 | CN102299232A 发光二极管及光源模组 Light-emitting diodes and light module |
12/28/2011 | CN102299231A 发光二极管封装结构及其制造方法 LED package structure and manufacturing method |
12/28/2011 | CN102299230A 一种提高led芯片透射率的膜层及其制备方法 Method for improving the transmittance of the film led chip and its preparation method |
12/28/2011 | CN102299229A 具备布拉格薄膜与金属层的发光二极管 Prague film and the metal layer includes a light emitting diode |
12/28/2011 | CN102299228A 一种覆晶插件式发光二极管芯片结构及其制造方法 A chip plug-emitting diode chip structure and manufacturing method |
12/28/2011 | CN102299227A 半导体发光器件 Semiconductor light emitting device |
12/28/2011 | CN102299226A 一种垂直结构发光二极管及其制造方法 The vertical structure of a light emitting diode and its manufacturing method |
12/28/2011 | CN102299225A 具有高反射与低缺陷密度的发光二极管结构 Having a high reflectance and a low defect density light emitting diode structure |
12/28/2011 | CN102299224A 一种发光二极管 A light emitting diode |
12/28/2011 | CN102299223A 一种发光二极管的外延结构及其制造方法 A light-emitting diode epitaxial structure and its manufacturing method |
12/28/2011 | CN102299222A 具有改进激活区的发光器件 Improved light emitting device having an active region |
12/28/2011 | CN102299221A 一种led双色灯封装方法 One kind of color light led encapsulation method |
12/28/2011 | CN102299220A 直驱式固晶机的摆臂机构 Bonder direct-drive swing arm mechanism |
12/28/2011 | CN102299219A 纳米图形化衬底及其制备方法和发光二极管 Nano-patterned substrate preparation method and light-emitting diodes |
12/28/2011 | CN102299218A 发光二极管及其制作方法 Light-emitting diode and manufacturing method thereof |
12/28/2011 | CN102299217A 一种用于制作led硅胶透镜的夹具 A jig for making led silicone lenses |
12/28/2011 | CN102299216A 一种led的封装工艺 Packaging process for the led |
12/28/2011 | CN102299215A 发光二极管与其制造方法 Light-emitting diode and its manufacturing method |
12/28/2011 | CN102299214A 快速分离衬底与外延层的方法 The method is rapid separation of the substrate and the epitaxial layer |
12/28/2011 | CN102299213A Led多晶封装基板及其制作方法 Led polycrystalline package substrate and manufacturing method thereof |
12/28/2011 | CN102299169A 便于去除蓝宝石衬底的外延结构 Facilitate removal of the epitaxial structure of the sapphire substrate |
12/28/2011 | CN102299146A 一种提高光效柔化光照的led封装结构 A light effect softens the lighting led package structure to improve |
12/28/2011 | CN102299145A 一种直插式多芯片led灯珠 One kind of in-line multi-chip led lamp beads |
12/28/2011 | CN102299141A 一种直接在led芯片上制造esd保护电路的方法 A method of manufacturing the chip directly on led esd protection circuit |
12/28/2011 | CN102299132A 半导体装置用封装及其制造方法、以及半导体装置 The semiconductor device package and a manufacturing method, and semiconductor device |
12/28/2011 | CN102299126A 散热基底以及制造该散热基底的方法 Cooling the substrate and a method of manufacturing the heat dissipation substrate |
12/28/2011 | CN102299125A 半导体装置用封装及其制造方法、以及半导体装置 The semiconductor device package and a manufacturing method, and semiconductor device |
12/28/2011 | CN102299105A 蓝宝石晶片的分割方法 Segmentation sapphire wafer |
12/28/2011 | CN102299055A 于蓝宝石衬底表面制作纳米球的方法 Method for the production of sapphire substrate surface nanospheres |
12/28/2011 | CN102297351A LED (light emitting diode) light source module and manufacturing method thereof |
12/28/2011 | CN102295928A Red phosphor based on near ultraviolet light excitation, preparation method and application thereof |
12/28/2011 | CN101976713B 一种基于同质外延制备高效光电子器件的方法 Based on preparation of high performance optoelectronic devices homoepitaxial method |
12/28/2011 | CN101908585B 第三族氮化物发光装置及改进其出光效率的方法 III-nitride light-emitting device and improve the efficiency of its light approach |
12/28/2011 | CN101881419B 一种使用具有透明基材的光学器件的led光源 A method of using a transparent substrate having an optical device led light |
12/28/2011 | CN101769507B 具荧光粉的基板与白光led光源组件的制造方法 A phosphor white led light source module substrate and manufacturing method |
12/28/2011 | CN101761795B 发光二极管照明装置及其封装方法 LED illumination apparatus and method for packaging |
12/28/2011 | CN101752332B 光电半导体装置 Optoelectronic semiconductor devices |
12/28/2011 | CN101728470B 发光二极管装置及其制造方法 Light emitting diode device and manufacturing method |