Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
12/2011
12/29/2011DE102010024864A1 Optoelektronisches Halbleiterbauteil An optoelectronic semiconductor device
12/29/2011DE102010024862A1 Optoelektronisches Halbleiterbauelement Optoelectronic semiconductor component
12/29/2011DE102010017560A1 Lamp has semiconductor structure that is provided on bottom of trough through thermally conductive adhesive, and is electrically connected with strip guard to emit the light to surrounding reflector
12/29/2011CA2802500A1 Substrate with buffer layer for oriented nanowire growth
12/28/2011EP2400571A1 Light-emitting diode, light-emitting diode lamp, and method for producing light-emitting diode
12/28/2011EP2400570A2 Substrate for an optical device, an optical device package comprising the same and a production method for the same
12/28/2011EP2400569A2 Light-emitting diode package
12/28/2011EP2400568A2 Light emitting device package including several lenses and lighting system
12/28/2011EP2400567A2 Phosphor selection for a Light-Emitting Device
12/28/2011EP2400566A1 Semiconductor light emitting device, lighting module, lighting apparatus
12/28/2011EP2400565A1 Led and led package
12/28/2011EP2400564A2 Light-emitting devices with improved active-region
12/28/2011EP2400563A2 Light-emitting devices with improved active-region
12/28/2011EP2400533A2 Diamond field effect transistor and process for producing the same
12/28/2011EP2400532A2 Diamond semiconductor element and process for producing the same
12/28/2011EP2400531A2 Diamond semiconductor element and process for producing the same
12/28/2011EP2400530A2 Diamond semiconductor element and process for producing the same
12/28/2011EP2400323A1 Liquid crystal display device, backlight and LED
12/28/2011EP2399733A2 Preparation of nanocrystallines
12/28/2011EP2399302A2 Compact molded led module
12/28/2011DE202011108025U1 Optisch wirksames Bauelement zur Verwendung an SMD Leuchtdioden ohne primäre Optik Optically active component for use in SMD LEDs without primary optics
12/28/2011CN202094177U 一种led灯珠 One kind of led lamp beads
12/28/2011CN202094176U Smd发光二极管支架改良结构 Smd improved stand-emitting diode structure
12/28/2011CN202094175U 一种远荧光粉的led封装结构 A far-phosphor led package
12/28/2011CN202094174U 一种发光二极管的封装结构 A light emitting diode package structure
12/28/2011CN202094173U 一种采用荧光粉层封装的led侧背光源 One kind of using the phosphor layer encapsulation led dorsal light
12/28/2011CN202094172U Led支架量产片连体结构 Led stent production piece Siamese structure
12/28/2011CN202094171U Led支架量产片 Led bracket sheet production
12/28/2011CN202094170U 一种新型led集成芯片光源基板 A new integrated chip led light board
12/28/2011CN202094169U 一种led芯片封装结构 One kind of led chip package structure
12/28/2011CN202094168U Led封装结构 Led package
12/28/2011CN202094167U 照明级led Led lighting level
12/28/2011CN202094166U 一种具有反射型电流阻挡层的led芯片 Led chip having a reflection type current blocking layer
12/28/2011CN202094125U 一种高压交流led晶片模块 A high voltage AC led chip module
12/28/2011CN202094119U 凸杯结构led光源模组封装结构 Convex structure led cup light module package structure
12/28/2011CN202094118U 一种用于照明的led光模组和led芯片 Led light module and led chip for lighting
12/28/2011CN202093756U LED (light-emitting diode) display
12/28/2011CN1595670B 宽谱白光led的量子点有源区结构及其外延生长方法 White led a broad spectrum structure quantum dot active region and the epitaxial growth method
12/28/2011CN102301548A 半导体发光装置及其制造方法 The semiconductor light emitting device and manufacturing method thereof
12/28/2011CN102301499A 发光装置、面光源以及显示装置 A light emitting device, a surface light source and a display device
12/28/2011CN102301498A 等离激元发光二极管 Plasmon light-emitting diodes
12/28/2011CN102301497A 包括不可见的发光二极管光源的透明的物体 Including transparent objects invisible light emitting diodes of the light source
12/28/2011CN102300955A α型赛隆荧光体、其制造方法及发光装置 α-SiAlON phosphor, and a light-emitting device manufacturing method
12/28/2011CN102300902A 发uv光芴基共聚物 Hair uv light butylfluorenyl copolymer
12/28/2011CN102299250A 大功率led的散热模组及其制备方法 Cooling module and preparation method of power led
12/28/2011CN102299249A 具有独立电传与热传路径的发光二极管及其制造方法 Light-emitting diode and method of manufacturing an independent telex and heat transfer path
12/28/2011CN102299248A Led封装支架改良制造方法及由此制得的封装结构 Led stent improved method of manufacturing and packaging the thus obtained packaging structure
12/28/2011CN102299247A 一种全户外led模组 An all-outdoor led module
12/28/2011CN102299246A 发光器件 Light-emitting devices
12/28/2011CN102299245A 复合膜和使用该复合膜的半导体发光器件 Use of the composite film and composite film semiconductor light emitting device
12/28/2011CN102299244A 大功率led无缝异型光源 Shaped seamless power led light
12/28/2011CN102299243A 一种薄膜倒装光子晶体led芯片及其制造方法 A thin film flip-chip photonic crystal led its manufacturing method
12/28/2011CN102299242A Led封装用镀陶瓷层基板 Led package plated ceramic substrate layer
12/28/2011CN102299241A 发光装置用透镜 Light-emitting device with a lens
12/28/2011CN102299240A 发光二极管以及包括其的背光单元和液晶显示器件 A light emitting diode, and a backlight unit including a liquid crystal display device and
12/28/2011CN102299239A 发光器件封装 Light emitting device package
12/28/2011CN102299238A 发光装置和使用该发光装置的led照明器具 Light-emitting device and use led lighting fixtures that light-emitting device
12/28/2011CN102299237A 半导体发光器件 Semiconductor light emitting device
12/28/2011CN102299236A 发光装置 Light-emitting device
12/28/2011CN102299235A 高发光效率的发光二极管 High luminous efficiency light emitting diode
12/28/2011CN102299234A 发光二极管及其制造方法 A light emitting diode and its manufacturing method
12/28/2011CN102299233A 一种不带黄圈聚光性好的大功率led灯珠 A yellow circle with a non-condensing good power led lamp beads
12/28/2011CN102299232A 发光二极管及光源模组 Light-emitting diodes and light module
12/28/2011CN102299231A 发光二极管封装结构及其制造方法 LED package structure and manufacturing method
12/28/2011CN102299230A 一种提高led芯片透射率的膜层及其制备方法 Method for improving the transmittance of the film led chip and its preparation method
12/28/2011CN102299229A 具备布拉格薄膜与金属层的发光二极管 Prague film and the metal layer includes a light emitting diode
12/28/2011CN102299228A 一种覆晶插件式发光二极管芯片结构及其制造方法 A chip plug-emitting diode chip structure and manufacturing method
12/28/2011CN102299227A 半导体发光器件 Semiconductor light emitting device
12/28/2011CN102299226A 一种垂直结构发光二极管及其制造方法 The vertical structure of a light emitting diode and its manufacturing method
12/28/2011CN102299225A 具有高反射与低缺陷密度的发光二极管结构 Having a high reflectance and a low defect density light emitting diode structure
12/28/2011CN102299224A 一种发光二极管 A light emitting diode
12/28/2011CN102299223A 一种发光二极管的外延结构及其制造方法 A light-emitting diode epitaxial structure and its manufacturing method
12/28/2011CN102299222A 具有改进激活区的发光器件 Improved light emitting device having an active region
12/28/2011CN102299221A 一种led双色灯封装方法 One kind of color light led encapsulation method
12/28/2011CN102299220A 直驱式固晶机的摆臂机构 Bonder direct-drive swing arm mechanism
12/28/2011CN102299219A 纳米图形化衬底及其制备方法和发光二极管 Nano-patterned substrate preparation method and light-emitting diodes
12/28/2011CN102299218A 发光二极管及其制作方法 Light-emitting diode and manufacturing method thereof
12/28/2011CN102299217A 一种用于制作led硅胶透镜的夹具 A jig for making led silicone lenses
12/28/2011CN102299216A 一种led的封装工艺 Packaging process for the led
12/28/2011CN102299215A 发光二极管与其制造方法 Light-emitting diode and its manufacturing method
12/28/2011CN102299214A 快速分离衬底与外延层的方法 The method is rapid separation of the substrate and the epitaxial layer
12/28/2011CN102299213A Led多晶封装基板及其制作方法 Led polycrystalline package substrate and manufacturing method thereof
12/28/2011CN102299169A 便于去除蓝宝石衬底的外延结构 Facilitate removal of the epitaxial structure of the sapphire substrate
12/28/2011CN102299146A 一种提高光效柔化光照的led封装结构 A light effect softens the lighting led package structure to improve
12/28/2011CN102299145A 一种直插式多芯片led灯珠 One kind of in-line multi-chip led lamp beads
12/28/2011CN102299141A 一种直接在led芯片上制造esd保护电路的方法 A method of manufacturing the chip directly on led esd protection circuit
12/28/2011CN102299132A 半导体装置用封装及其制造方法、以及半导体装置 The semiconductor device package and a manufacturing method, and semiconductor device
12/28/2011CN102299126A 散热基底以及制造该散热基底的方法 Cooling the substrate and a method of manufacturing the heat dissipation substrate
12/28/2011CN102299125A 半导体装置用封装及其制造方法、以及半导体装置 The semiconductor device package and a manufacturing method, and semiconductor device
12/28/2011CN102299105A 蓝宝石晶片的分割方法 Segmentation sapphire wafer
12/28/2011CN102299055A 于蓝宝石衬底表面制作纳米球的方法 Method for the production of sapphire substrate surface nanospheres
12/28/2011CN102297351A LED (light emitting diode) light source module and manufacturing method thereof
12/28/2011CN102295928A Red phosphor based on near ultraviolet light excitation, preparation method and application thereof
12/28/2011CN101976713B 一种基于同质外延制备高效光电子器件的方法 Based on preparation of high performance optoelectronic devices homoepitaxial method
12/28/2011CN101908585B 第三族氮化物发光装置及改进其出光效率的方法 III-nitride light-emitting device and improve the efficiency of its light approach
12/28/2011CN101881419B 一种使用具有透明基材的光学器件的led光源 A method of using a transparent substrate having an optical device led light
12/28/2011CN101769507B 具荧光粉的基板与白光led光源组件的制造方法 A phosphor white led light source module substrate and manufacturing method
12/28/2011CN101761795B 发光二极管照明装置及其封装方法 LED illumination apparatus and method for packaging
12/28/2011CN101752332B 光电半导体装置 Optoelectronic semiconductor devices
12/28/2011CN101728470B 发光二极管装置及其制造方法 Light emitting diode device and manufacturing method