H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof

Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
10/2011
10/27/2011	US20110260184 Semiconductor light emitting device and method for manufacturing same
10/27/2011	US20110260183 Electronic device and method of manufacturing the same
10/27/2011	US20110260182 Light emitting device array assemblies and related methods
10/27/2011	US20110260181 Mounting structure for LEDs, LED assembly, LED assembly socket, method for forming a mounting structure
10/27/2011	US20110260180 Image display device and the method for manufacturing the same
10/27/2011	US20110260179 Flexible led packaging structure
10/27/2011	US20110260178 Lighting system including collimators aligned with light emitting segments
10/27/2011	US20110260177 Method for manufacturing semiconductor light emitting element, and semiconductor light emitting element
10/27/2011	US20110260176 Light-emitting sensor device and method for manufacturing the same
10/27/2011	US20110260169 Display device and electronic device
10/27/2011	US20110260167 Actively driven organic el device and manufacturing method thereof
10/27/2011	US20110260143 Organic light-emitting diode luminaires
10/27/2011	DE202007019330U1 Beschichtung/Abdeckung für optoelektronische Bauteile Coating / cover for optoelectronic devices
10/27/2011	DE102010028246A1 Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements Optoelectronic component and method of manufacturing an optoelectronic component
10/26/2011	EP2381496A1 Substrate for mounting light-emitting element and light-emitting device employing the substrate
10/26/2011	EP2381495A2 Light emitting device package, backlight unit, display device and lighting device
10/26/2011	EP2381494A2 Light emitting device and light unit having the same
10/26/2011	EP2381493A2 Light emitting diode
10/26/2011	EP2381492A2 Light emitting device with resonant thickness of one semiconductor layer
10/26/2011	EP2381491A1 Light emitting diode
10/26/2011	EP2381490A2 Light emitting device with electrode material having different Plasmon frequency differing from emitted light
10/26/2011	EP2381489A2 Light emitting device, light emitting device package, and lighting system
10/26/2011	EP2381488A1 Method of manufacturing a light emitting diode
10/26/2011	EP2381487A1 Substrate for light-emitting element
10/26/2011	EP2381478A2 Integrated circuit device
10/26/2011	EP2381474A2 Lead frame for light emitting device package, light emitting device package, and illumination apparatus employing the light emitting device package
10/26/2011	EP2381303A2 Wavelength converted semiconductor light emitting devices
10/26/2011	EP2381299A1 Backlight unit, liquid crystal display device, data generating method, data generating program and recording medium
10/26/2011	EP2381156A1 Lamp with increased eye safety and method for operating a lamp
10/26/2011	EP2380944A1 Light source for emitting infrared radiation, particularly for medical skin irradiation
10/26/2011	EP2380218A2 Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component
10/26/2011	EP2380217A2 Method of making double-sided wavelength converter and light generating device using same
10/26/2011	EP2380216A2 Light generating device having double-sided wavelength converter
10/26/2011	EP2380215A1 Optoelectronic semiconductor component
10/26/2011	EP2036965B1 Phosphor composite material and phosphor composite member
10/26/2011	CN202019000U High-power LED bracket
10/26/2011	CN202018999U Semiconductor LED encapsulation piece adopting palladium-plated bonding copper wire for connection
10/26/2011	CN202018998U Semiconductor light emitting diode secondary package part with nickel-plated bonding copper wires for connection
10/26/2011	CN202018997U Semiconductor LED secondary enclosure adopting palladium-plated bonding copper wire for connection
10/26/2011	CN202018996U Semiconductor light emitting diode package part with silver-plated bonding copper wires for connection
10/26/2011	CN202018995U Semiconductor light emitting diode packaging piece connected with nickel plating bonding copper wire
10/26/2011	CN202018994U Semiconductor light-emitting diode (LED) packaging component connected through gilt bonding copper wire
10/26/2011	CN202018993U LED encapsulating structure with high light extraction efficiency
10/26/2011	CN202018992U LED (light-emitting diode) packaging structure for improving spectrum quality
10/26/2011	CN202018991U Ceramic bracket for packaging light emitting diode (LED) integrated light source
10/26/2011	CN202018990U High-power white-light LED light source encapsulating structure
10/26/2011	CN202018989U LED (light-emitting diode) bracket
10/26/2011	CN202018988U Large power LED packaging structure with high efficient luminescence and heat radiation
10/26/2011	CN202018987U LED (light-emitting diode) packaging base
10/26/2011	CN202018986U Offset-optical-axis LED tube
10/26/2011	CN202018964U Omnibearing luminous LED light source
10/26/2011	CN202018963U Integrated LED bracket
10/26/2011	CN202018962U Semiconductor light-emitting diode secondary encapsulating component connected through silver-plated bonded copper wire
10/26/2011	CN202018961U Compound wafer light emitting diode and wire rack structure thereof
10/26/2011	CN202018960U Luminous chip packaging structure of insulating bottom plate
10/26/2011	CN202017909U Light-emitting diode (LED) light module for illumination and LED chip for illumination
10/26/2011	CN102227954A Surface-emission light source with uniform illumination
10/26/2011	CN102227827A Light emission module, light emission module manufacturing method, and lamp unit
10/26/2011	CN102227826A Illumination device for display devices and display device
10/26/2011	CN102227825A Optoelectronic semiconductor chip and method for producing optoelectronic semiconductor chip
10/26/2011	CN102227807A Radiation-emitting semiconductor chip
10/26/2011	CN102227156A High reflection mirror MCPCB (printed circuit board) and preparation method thereof
10/26/2011	CN102227012A White light LED with uniform color temperature and high color rendering performance
10/26/2011	CN102227011A Reflector cup and method for controlling geometric shape of fluorescent powder layer in LED (light-emitting diode) packaging by using same
10/26/2011	CN102227010A Preparation method for large power white light LED lens
10/26/2011	CN102227009A Method for removing substrate of high-power LED (light-emitting diode)
10/26/2011	CN102227008A Preparation method of P type GaN layer of LED chip
10/26/2011	CN102227007A Method for screening LEDs (light-emitting diodes)
10/26/2011	CN102227006A Semiconductor device manufacturing method and semiconductor device
10/26/2011	CN102226995A LED (light-emitting diode) packaging structure and manufacturing method thereof
10/26/2011	CN102226994A Display device for integrating LED (light-emitting diode) chip on conducting glass and manufacturing method thereof
10/26/2011	CN102226993A Light source packaging composition of large power LED street lamp and packaging technology thereof
10/26/2011	CN102226504A Multi-chip integration packaged LED (light emitting diode) light source module and preparation process thereof
10/26/2011	CN102226271A Double-layer quartz tube
10/26/2011	CN101794768B Light emitting diode package and projecting device
10/26/2011	CN101793377B Light-emitting diode (LED) with deformable lens
10/26/2011	CN101675535B Optoelectronical component emitting electromagnetic radiation and method for producing an optoelectronical component
10/26/2011	CN101656210B Semiconductor light-emitting element and preparation method, convex part and forming method
10/26/2011	CN101593805B Nitride semiconductor light emitting device
10/26/2011	CN101483208B LED encapsulation construction and assembling method thereof
10/26/2011	CN101383332B Electronic element device and manufacturing process thereof
10/26/2011	CN101010453B Method for preparing crystal of nitride of metal belonging to group 13 of periodic table and method for manufacturing semiconductor device using the same
10/25/2011	US8044898 LED display apparatus having a column and row controller
10/25/2011	US8044611 LED control device
10/25/2011	US8044587 White light emitting diode package for incandescent color
10/25/2011	US8044585 Light emitting diode with bumps
10/25/2011	US8044572 Light conversion structure and light-emitting device using the same
10/25/2011	US8044569 Light emitting device
10/25/2011	US8044493 GaAs semiconductor substrate for group III-V compound semiconductor device
10/25/2011	US8044492 Compound semiconductor device including AIN layer of controlled skewness
10/25/2011	US8044474 Optoelectronic module, and method for the production thereof
10/25/2011	US8044439 Light-emitting device and manufacturing method of the same
10/25/2011	US8044430 Nitride semiconductor light-emitting device comprising multiple semiconductor layers having substantially uniform N-type dopant concentration
10/25/2011	US8044429 Light-emitting device and method for manufacturing the same
10/25/2011	US8044428 Package and semiconductor device for preventing occurrence of false connection
10/25/2011	US8044427 Light emitting diode submount with high thermal conductivity for high power operation
10/25/2011	US8044426 Light emitting device capable of removing height difference between contact region and pixel region and method for fabricating the same
10/25/2011	US8044424 Light-emitting device
10/25/2011	US8044423 Light emitting device package
10/25/2011	US8044422 Semiconductor light emitting devices with a substrate having a plurality of bumps

1 ... 361 362 363 364 365 366 367 368 369 370 371 372 373 374 375 376 377 378 379 380 381 ... 994