Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
11/2011
11/03/2011US20110266574 Led package
11/03/2011US20110266573 Semiconductor for light emitting device
11/03/2011US20110266572 Organic Light Emitting Component and Illumination Means Comprising a Component of this Type
11/03/2011US20110266571 Semiconductor Arrangement
11/03/2011US20110266570 Light emitting diode package and manufacturing method thereof
11/03/2011US20110266569 Led wafer with laminated phosphor layer
11/03/2011US20110266568 Light emitting device with trenches and a top contact
11/03/2011US20110266567 Method for Producing a Radiation-Emitting Component and Radiation-Emitting Component
11/03/2011US20110266566 Led package structure with concave area for positioning heat-conducting substance and method for manufacturing the same
11/03/2011US20110266565 Display panel
11/03/2011US20110266564 Semiconductor display device
11/03/2011US20110266563 Method for forming a multi-level surface on a substrate with areas of different wettability and a semiconductor device having the same
11/03/2011US20110266562 Glass substrate with an electrode, especially a substrate intended for an organic light-emitting diode device
11/03/2011US20110266561 Optical Systems Fabricated by Printing-Based Assembly
11/03/2011US20110266560 White-emitting led chips and method for making same
11/03/2011US20110266555 Method of growing semiconductor heterostructures based on gallium nitride
11/03/2011US20110266553 Nitride semiconductor light-emitting element and method of manufacturing the same
11/03/2011US20110266552 Light emitting element and manufacturing method thereof
11/03/2011US20110266551 High brightness light emitting diode covered by zinc oxide layers on multiple surfaces grown in low temperature aqueous solution
11/03/2011US20110266548 Light emitting device, method of manufacturing the same, and manufacturing apparatus therefor
11/03/2011US20110266546 Display device and manufacturing method thereof
11/03/2011US20110266543 Circuit board and display device
11/03/2011US20110266520 Superlattice Structure
11/03/2011US20110266519 Light emitting device, light emitting device package and lighting system
11/03/2011US20110266518 Light Emitting Device, Light Emitting Device Package, and Lighting System
11/03/2011US20110265958 Motor arrangement for window coverings
11/03/2011DE102010028481A1 Elektronikgehäuse für eine Lampe, Halbleiterlampe und Verfahren zum Vergießen eines Elektronikgehäuses für eine Lampe Electronics housing for a lamp, the semiconductor lamp and method for encapsulating an electronic package for a lamp
11/03/2011DE102010028416A1 LED-Modul mit Linse zum Erzeugen einer nicht rotationssymmetrischen Lichtverteilung LED module with lens for generating a non-rotationally symmetrical light distribution
11/03/2011DE102010028407A1 Optoelektronisches Bauelement und Verfahren zum Herstellen eines Optoelektronischen Bauelements Optoelectronic component and method of manufacturing an optoelectronic component
11/03/2011DE102010019136A1 Light i.e. LED for use in dental instrument e.g. hand piece, has heat sink in thermal connection with LED chip, where heat sink receives heat generated by LED chip and dissipates received heat to environment
11/02/2011EP2384100A2 Insulated light-reflective substrate
11/02/2011EP2384088A2 Light emitting device for AC power operation
11/02/2011EP2383846A2 Light emitting device and manufacturing method thereof
11/02/2011EP2383808A2 Light emitting device package having leads with a recess for the chip mount area
11/02/2011EP2383807A2 Light-emitting-device package and a method for producing the same
11/02/2011EP2383806A1 Light emitting device, light emitting device package, and lighting system
11/02/2011EP2383805A2 Light emitting device package and lighting system having the same
11/02/2011EP2383804A1 Light emitting device, light emitting device package and lighting system
11/02/2011EP2383803A2 Light emitting device with a stepped transparent electrode
11/02/2011EP2383802A2 Light emitting device, method of manufacturing the light emitting device, light emitting device package, and lighting unit
11/02/2011EP2383801A1 Semiconductor light-emitting element and method for manufacturing semiconductor light-emitting element
11/02/2011EP2383780A1 Light emitting devices
11/02/2011EP2383602A2 Optical sheet for a light source module, backlight unit, display apparatus, television set, and illumination apparatus
11/02/2011EP2383509A1 LED module with lens for generating a non-rotation-symmetric light distribution
11/02/2011EP2383324A1 -sialon phosphor, method for producing same, and light-emitting device
11/02/2011EP2382673A1 Optoelectronic semiconductor component
11/02/2011EP1881367B1 Projector device, multilayer light-emitting diode device, and reflective light-emitting diode unit
11/02/2011EP1733438B1 Laser patterning of light emitting devices and patterned light emitting devices
11/02/2011EP1435118B1 Housing for a surface-mountable light-emitting component, surface-mountable light-emitting component and display or illumination system using a plurality of surface-mountable light-emitting components
11/02/2011CN202025801U Heat dissipation device of large power light-emitting diode (LED) module
11/02/2011CN202025800U LED air pressure active heat radiator
11/02/2011CN202025799U Integrated white light LED capsulation applicable to visible light communication
11/02/2011CN202025798U SMD (Surface Mounted Device) LED (Light Emitting Diode) bracket and LED adopting same
11/02/2011CN202025797U Copper-clad and carbon-based graphite heat-dissipating panel used in high-power LED
11/02/2011CN202025796U Light-emitting diode (LED) lamp strip board
11/02/2011CN202025795U Directly-conductive and heat-dissipating LED and electronic device made by combining same
11/02/2011CN202025794U Light-emitting diode (LED) assembly
11/02/2011CN202025793U Cyan LED (light emitting diode) lamp bead
11/02/2011CN202025792U LED encapsulating structure
11/02/2011CN202025791U GaN base LED chip with vertical structure
11/02/2011CN202025790U Improved light emitting diode chip with current barrier layer
11/02/2011CN202025756U Semiconductor LED secondary packaging piece adopting gold-plated bonding copper wires for connection
11/02/2011CN202025754U Circuit board for LED (Light Emitting Diode) module
11/02/2011CN202025753U LED (light-emitting diode) module
11/02/2011CN202025752U Pressure plate used for LED module group
11/02/2011CN202025751U Efficient white light LED package with controllable junction temperature and adjustable color temperature
11/02/2011CN202025750U Large power LED packaging structure
11/02/2011CN202024613U Preheating furnace for light emitting diode (LED) alloying furnace and LED alloying furnace
11/02/2011CN202024287U Packaging structure of airtight multilayered array light-emitting diode
11/02/2011CN202024212U Lighting lamp of range hood
11/02/2011CN202024182U Light source device for backlight module and LED package structure of light source device
11/02/2011CN202022978U Gaseous phase deposition system
11/02/2011CN102232250A Light-emitting diode package using a liquid crystal polymer
11/02/2011CN102232249A Light-emitting element and light-emitting device using the same
11/02/2011CN102231422A Fluorescent-powder-free single-chip GaN (gallium nitride)-based LED (light-emitting diode) and manufacturing method thereof
11/02/2011CN102231421A Light-emitting diode package structure manufacturing method
11/02/2011CN102231420A Method for introducing extra nucleation points to silicon nanocrystalline film
11/02/2011CN102231419A LED (light-emitting diode) packaging method and LED device packaged by using same
11/02/2011CN102231418A Method for manufacturing white-light LED (Light Emitting Diode) with high color rendering index
11/02/2011CN102231417A Novel process for packaging LED (Light Emitting Diode) convex mirrors
11/02/2011CN102231416A Chemical vapor deposition reaction equipment
11/02/2011CN102231415A Multiple-LED (light-emitting diode) three-dimensional packaging equipment with
11/02/2011CN102231414A Formation method of LED
11/02/2011CN102231413A LED (light-emitting diode) chip and manufacturing method thereof
11/02/2011CN102231378A Light-emitting diode (LED) packaging structure and preparation method thereof
11/02/2011CN102231377A High color rendering light emitting diode and manufacture method thereof
11/02/2011CN102230600A Optical lens for forming square light field
11/02/2011CN102229802A Rare earth double primary colour luminescent material for converting white light by utilizing violet light LED (light-emitting diode) and preparation method thereof
11/02/2011CN101855734B Semiconductor light emitting device
11/02/2011CN101783378B Lighting element with patterned surface
11/02/2011CN101685816B Light-emitting module, light-emitting device having the light-emitting module, and lighting apparatus having the light-emitting device
11/02/2011CN101667629B Led device and manufacturing method thereof
11/02/2011CN101667612B Photoelectric element
11/02/2011CN101442096B Vertical-structure gallium nitride light-emitting diode element and its manufacturing method
11/02/2011CN101419962B LED, production method therefore and illuminator manufactured by the LED
11/02/2011CN101409321B LED with coarsing interface and manufacturing method thereof
11/02/2011CN101403833B Backlight device and liquid crystal display device
11/02/2011CN101335319B High-power LED ceramic package base and productive technology
11/01/2011US8049330 Wafer-level chip scale packaging for LED comprising carrier substrate with thermally conductive through holes and fill channels
11/01/2011US8049318 Semiconductor light emitting device