| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 01/19/2012 | US20120012859 Light emitting device and method of manufacturing the same |
| 01/19/2012 | US20120012856 GaN Light Emitting Diode and Method for Increasing Light Extraction on GaN Light Emitting Diode Via Sapphire Shaping |
| 01/19/2012 | US20120012855 Solid-state light emitters having substrates with thermal and electrical conductivity enhancements and method of manufacture |
| 01/19/2012 | US20120012852 Method of manufacturing thin film transistor |
| 01/19/2012 | US20120012850 Organic light emitting display apparatus |
| 01/19/2012 | US20120012849 Organic light emitting display device and method of manufacturing the same |
| 01/19/2012 | US20120012847 Display device and electronic device including the same |
| 01/19/2012 | US20120012840 Thin-film Transistor (TFT) With A Bi-layer Channel |
| 01/19/2012 | US20120012839 Oxide thin film transistor and method of fabricating the same |
| 01/19/2012 | US20120012815 Light emitting device |
| 01/19/2012 | US20120012814 Semiconductor light emitting device and method for manufacturing same |
| 01/19/2012 | US20120012813 Optical device to emit polarized light |
| 01/19/2012 | US20120012812 Solid state lighting devices with reduced crystal lattice dislocations and associated methods of manufacturing |
| 01/19/2012 | DE202010017532U1 Foliensystem für LED-Anwendungen Film system for LED applications |
| 01/19/2012 | DE112009002311T5 Farbabstimmbare Halbleiter-Breitbandlichtquellen und Vollfarbmikrodisplays Farbabstimmbare semiconductor broadband light sources and full-color microdisplays |
| 01/19/2012 | DE102010032807A1 Heat derivative structure for LED construction, has LED crystals provided on metallic carrier, and base board provided with printed conductor layer, where LED crystals on metallic carrier are connected with conductor layer |
| 01/19/2012 | DE102010031302A1 Halbfabrikat und Verfahren zur Herstellung einer Leuchtdiode Semi-finished product and process for producing a light-emitting diode |
| 01/19/2012 | DE102010027411A1 Halbleiterbauelement, Substrat und Verfahren zur Herstellung einer Halbleiterschichtenfolge A semiconductor device, substrate and method of manufacturing a semiconductor layer sequence, |
| 01/19/2012 | DE102010027313A1 Trägervorrichtung für einen Halbleiterchip, elektronisches Bauelement mit einer Trägervorrichtung und optoelektronisches Bauelement mit einer Trägervorrichtung A support device for a semiconductor chip, an electronic device having a carrier device and an optoelectronic component with a support device |
| 01/19/2012 | DE102010027253A1 Optoelektronisches Halbleiterbauteil An optoelectronic semiconductor device |
| 01/19/2012 | DE102010027212A1 Strahlungsemittierendes Bauelement Radiation-emitting component |
| 01/19/2012 | CA2805405A1 Improved heat sinking methods for performance and scalability |
| 01/19/2012 | CA2805348A1 Semifinished product and method for producing a light-emitting diode |
| 01/18/2012 | EP2408031A2 Light emitting diode package and frame shaping method of the same |
| 01/18/2012 | EP2408030A2 Electrode configuration for a light emitting device |
| 01/18/2012 | EP2408029A2 Light emitting device |
| 01/18/2012 | EP2408028A2 Light emitting device |
| 01/18/2012 | EP2408027A1 Light emitting diode, light emitting diode lamp and illuminating device |
| 01/18/2012 | EP2408026A1 Epitaxial wafer for light emitting diode |
| 01/18/2012 | EP2408025A1 Light emitting diode and manufacturing method thereof |
| 01/18/2012 | EP2408024A1 Method for generating white light and lihgting device |
| 01/18/2012 | EP2407980A1 Method for producing conductive material, conductive material obtained by the same method, electronic device containing the conductive material, and light-emitting device |
| 01/18/2012 | EP2407706A1 Warm white light LED lamp with high luminance and high color rendering index and led module |
| 01/18/2012 | EP2407527A1 Non stoichiometric tetragonal copper alkaline earth silicate phosphors and method of preparing the same |
| 01/18/2012 | EP2406835A2 Led leadframe package, led package using the same, and method of manufacturing the led package |
| 01/18/2012 | EP2406834A2 Led module with improved light output |
| 01/18/2012 | EP2406833A2 Phosphor-coated light extraction structures for phosphor-converted light emitting devices |
| 01/18/2012 | EP2406832A2 Led module for modified lamps and modified led lamp |
| 01/18/2012 | EP2406827A1 Optoelectronic semiconductor component |
| 01/18/2012 | EP2240964B1 A light emitting device |
| 01/18/2012 | EP2171774B1 White or ultraviolet leds containing a getter system |
| 01/18/2012 | EP1999231B1 Electroluminescent device |
| 01/18/2012 | EP1615195B1 Display led drive circuit |
| 01/18/2012 | EP1576654B1 Led package die having a small footprint |
| 01/18/2012 | EP1454369B1 Light emitting diode with multilayer reflector |
| 01/18/2012 | EP1439584B1 Light emitting device using led |
| 01/18/2012 | DE202008018212U1 Gehäuse für eine lichtemittierende Vorrichtung A housing for a light emitting device |
| 01/18/2012 | DE202004021874U1 Eine lichtemittierende Vorrichtung unter Verwendung eines Nitridhalbleiters A light emitting device using a nitride semiconductor |
| 01/18/2012 | CN202121859U High reflecting mirror surface blind cup groove printed circuit board |
| 01/18/2012 | CN202120986U Improved light source structure of LED display screen |
| 01/18/2012 | CN202120985U Surface-mounting full-color LED |
| 01/18/2012 | CN202120984U LED chip packaging body for illuminating lamp |
| 01/18/2012 | CN202120983U White light diode possessing isolating excitation heat energy structure |
| 01/18/2012 | CN202120982U Led |
| 01/18/2012 | CN202120981U Led display |
| 01/18/2012 | CN202120980U Light emitting diode package unit |
| 01/18/2012 | CN202120979U Full color SMD support improved structure |
| 01/18/2012 | CN202120978U Co-firing ceramic substrate having built-in heat radiation portion and light emitting diode comprising same |
| 01/18/2012 | CN202120977U White light product utilizing fluorescent powder packaging technology |
| 01/18/2012 | CN202120976U LED chip for emitting circularly polarized light |
| 01/18/2012 | CN202120975U Feeding clamp for LAMP die bonder machine |
| 01/18/2012 | CN202120974U Composite substrate structure |
| 01/18/2012 | CN202120909U LED module group |
| 01/18/2012 | CN202120908U Single-lead light-emitting diode (LED) module |
| 01/18/2012 | CN202120907U Leadless LED (Light-emitting Diode) module |
| 01/18/2012 | CN202120906U Surface mounting type LED |
| 01/18/2012 | CN202120905U Luminous device |
| 01/18/2012 | CN202120886U Packaging structure |
| 01/18/2012 | CN202118634U Light-emitting diode (LED) module light source with low thermal resistance and high lighting effect |
| 01/18/2012 | CN1921159B Light source with UV LED and UV reflector |
| 01/18/2012 | CN102326270A Light-emitting device |
| 01/18/2012 | CN102326269A Compact molded led module |
| 01/18/2012 | CN102326268A Light-emitting diode, method for producing same, and light-emitting diode lamp |
| 01/18/2012 | CN102326267A Nitride semiconductor light-emitting element and manufacturing method therefor |
| 01/18/2012 | CN102326266A Light-emitting diode element and method for manufacturing same |
| 01/18/2012 | CN102326265A Semiconductor light-emitting element, semiconductor light-emitting device, and method for manufacturing semiconductor light-emitting element |
| 01/18/2012 | CN102326231A Method for forming epitaxial wafer and method for manufacturing semiconductor element |
| 01/18/2012 | CN102325856A Oxynitride phosphor, method for preparing the same, and light-emitting device |
| 01/18/2012 | CN102324460A LED (Light Emitting Diode) packaging device based on graphical packaging substrate |
| 01/18/2012 | CN102324459A Light-emitting diode (LED) lamp package structure and preparation method thereof |
| 01/18/2012 | CN102324458A Semiconductor light-emitting device provided with transparent organic supporting base plate and preparation method for semiconductor light-emitting device |
| 01/18/2012 | CN102324457A Gear tooth type LED (Light-Emitting Diode) bracket |
| 01/18/2012 | CN102324456A High-power LED packaging structure |
| 01/18/2012 | CN102324455A Ultra-thin ohmic contacts for p-type nitride light emitting devices and methods of forming |
| 01/18/2012 | CN102324454A Luminous element and manufacturing method thereof |
| 01/18/2012 | CN102324453A High-power LED (Light Emitting Diode) packaging process of double-layer lens |
| 01/18/2012 | CN102324452A Ultra-thin ohmic contacts for p-type nitride light emitting devices and methods of forming |
| 01/18/2012 | CN102324451A Method for manufacturing ESD protection circuit on LED chip by sacrificing luminescence area |
| 01/18/2012 | CN102324450A GaN-based light emitting diode chip and preparation method thereof |
| 01/18/2012 | CN102324449A Chip turning device for surface-mounted device (SMD) light-emitting diode (LED) patch light splitting machine |
| 01/18/2012 | CN102324426A Novel high-power light-emitting diode (LED) package structure |
| 01/18/2012 | CN102324425A Novel integrated light-emitting diode (LED) package structure |
| 01/18/2012 | CN102324424A White-light LED (Light Emitting Diode) packaged by fluorescent transparent ceramic lens |
| 01/18/2012 | CN102324423A Integrated COBLED (Chip on Board Light-emitting Diode) encapsulation structure |
| 01/18/2012 | CN102324395A Operation system and operation method for LED (light-emitting diode) crystal grain scanning and point-detection |
| 01/18/2012 | CN102321478A Nitrogen oxide fluorescent powder and preparation method as well as application thereof |
| 01/18/2012 | CN102321477A Cerium-ion-doped borate blue fluorescent powder and preparation method thereof |
| 01/18/2012 | CN102321370A Anti-static high heat conductivity light-emitting diode (LED) packaging substrate material and production process thereof |
| 01/18/2012 | CN102319680A Chip positioning device for surface mount device light emitting diode (SMD LED) patch spectrophotometry machine |
| 01/18/2012 | CN101892467B Integrating multi-reaction chamber flow process epitaxial growth method and system |