| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 05/23/2012 | CN102473803A 用于固体白光源的无机发光材料 Inorganic luminescent materials for solid white light source |
| 05/23/2012 | CN102473802A Light-emitting diode including a metal-dielectric-metal structure |
| 05/23/2012 | CN102473801A 利用粗糙化的活性层和共形包层的高亮度led Use roughened active layer and the cladding conformal high brightness led |
| 05/23/2012 | CN102473800A 稳定的且所有溶液可加工的量子点发光二极管 All solutions were stable and processable quantum dot light emitting diodes |
| 05/23/2012 | CN102473799A Structure for improving the mirror facet cleaving yield of (Ga,Al,In,B)N laser diodes grown on nonpolar or semipolar (Ga,Al,In,B)N substrates |
| 05/23/2012 | CN102473798A Led驱动电路 Led drive circuit |
| 05/23/2012 | CN102473797A 发光二极管芯片 Light-emitting diode chips |
| 05/23/2012 | CN102473796A 控制iii氮化物器件中的凹坑形成 Control iii nitride devices are formed in the pits |
| 05/23/2012 | CN102473762A Electronic device which performs as light emitting diode and solar cell |
| 05/23/2012 | CN102473717A Radiation-emitting semiconductor component |
| 05/23/2012 | CN102473704A 用于制造发光机构的方法和发光机构 And a method for manufacturing the light emitting mechanism of the light emitting bodies |
| 05/23/2012 | CN102473701A Multicolor light emitting diodes |
| 05/23/2012 | CN102473685A Packagign or mounting a component |
| 05/23/2012 | CN102473674A Anti-fuse element |
| 05/23/2012 | CN102473656A Light emitting device |
| 05/23/2012 | CN102473485A Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, and light-emitting device |
| 05/23/2012 | CN102472906A 驱动装置、背光源单元和图像显示装置 Drive means, a backlight unit and an image display apparatus |
| 05/23/2012 | CN102472867A 光电复合配线模块及其制造方法 Photoelectric composite wiring module and its manufacturing method |
| 05/23/2012 | CN102472863A 具有定位在波导的底表面附近的光源的照明设备 Lighting device having a bottom surface of the waveguide positioned in the vicinity of the light source |
| 05/23/2012 | CN102472471A Lens and semiconductor light-emitting element module using same |
| 05/23/2012 | CN102472443A 照明装置 Lighting device |
| 05/23/2012 | CN102472439A Illumination device, display device, and television receiver |
| 05/23/2012 | CN102471932A Method for preserving a gallium nitride substrate, preserved gallium nitride substrate, semiconductor device, and manufacturing method therefor |
| 05/23/2012 | CN102471931A Iii nitride semiconductor substrate, epitaxial substrate, and semiconductor device |
| 05/23/2012 | CN102471171A Ceramic substrate for mounting luminescent element |
| 05/23/2012 | CN102470639A Metal laminate structure and process for production of metal laminate structure |
| 05/23/2012 | CN102468420A Light emitting diode |
| 05/23/2012 | CN102468419A 一种高出光率led及其制作方法 A light rate led up its production methods |
| 05/23/2012 | CN102468418A 垂直结构发光二极管芯片及其制造方法 Vertical structure light emitting diode chip and its manufacturing method |
| 05/23/2012 | CN102468417A Light emitting device package and method of manufacturing the same |
| 05/23/2012 | CN102468416A 发光装置 Light-emitting device |
| 05/23/2012 | CN102468415A Semiconductor light emitting device |
| 05/23/2012 | CN102468414A 脉冲led白光发光装置 Pulse led white light emitting device |
| 05/23/2012 | CN102468413A Alternating current LED light-emitting device |
| 05/23/2012 | CN102468412A 制造发光二极管封装件的设备和方法 Apparatus and method of manufacturing the light emitting diode package |
| 05/23/2012 | CN102468411A Batwing beam based led and backlight module using the same |
| 05/23/2012 | CN102468410A Light emitting apparatus and production method thereof |
| 05/23/2012 | CN102468409A Light emitting diode components integrated with thermoelectric devices and method of manufacturing the same |
| 05/23/2012 | CN102468408A Bonding material, method, and structure |
| 05/23/2012 | CN102468407A 一种紫外发光二极管 An ultraviolet light-emitting diodes |
| 05/23/2012 | CN102468406A LED (Light Emitting Diode) packaging structure and manufacturing method thereof |
| 05/23/2012 | CN102468405A 发光二极管封装结构及其制造方法 Light emitting diode package structure and manufacturing method |
| 05/23/2012 | CN102468404A 一种防眩光led发光管 One kind of glare led light tube |
| 05/23/2012 | CN102468403A 发光二极管封装结构 A light emitting diode package structure |
| 05/23/2012 | CN102468402A 发光二极管封装结构及其制造方法 Light emitting diode package structure and manufacturing method |
| 05/23/2012 | CN102468401A 发光二极管模组 Light-emitting diode module |
| 05/23/2012 | CN102468400A Led封装结构及其制作方法 Led package structure and production methods |
| 05/23/2012 | CN102468399A 发光装置及其使用方法 Light-emitting device and method of use |
| 05/23/2012 | CN102468398A 发光二极管封装结构 A light emitting diode package structure |
| 05/23/2012 | CN102468397A 发光二极管封装结构 A light emitting diode package structure |
| 05/23/2012 | CN102468396A 发光二极管封装结构 A light emitting diode package structure |
| 05/23/2012 | CN102468395A 一种陶瓷基板led装置 A ceramic substrate led unit |
| 05/23/2012 | CN102468394A 发光二极管元件及其制造方法 The method of manufacturing the light emitting diode element and |
| 05/23/2012 | CN102468393A 发光器件 The light emitting device |
| 05/23/2012 | CN102468392A 具有网状结构的发光二极管 Having a network structure of a light emitting diode |
| 05/23/2012 | CN102468391A 发光二极管结构及其制作方法 Light-emitting diode structure and manufacturing method thereof |
| 05/23/2012 | CN102468390A Semiconductor light emitting device |
| 05/23/2012 | CN102468389A 氮化物半导体发光元件 The nitride semiconductor light emitting element |
| 05/23/2012 | CN102468388A 垂直发光二极管晶粒及其制造方法 Vertical light emitting diode die and the manufacturing method |
| 05/23/2012 | CN102468387A 发光二极管 Led |
| 05/23/2012 | CN102468386A 发光元件 Light-emitting element |
| 05/23/2012 | CN102468385A Composite substrate and method for manufacturing composite substrate |
| 05/23/2012 | CN102468384A 蚀刻发光器件的生长层以减小漏电 Growth layer is etched to reduce the leakage of the light emitting device |
| 05/23/2012 | CN102468383A 具有量子簇柱的固态发光组件与其制作方法 Solid-state light-emitting quantum cluster column assembly has its production methods |
| 05/23/2012 | CN102468382A 一种GaAs衬底AlGaInP发光二极管的制备方法 A substrate AlGaInP light emitting diodes prepared GaAs |
| 05/23/2012 | CN102468381A 一种形成p型重掺杂的方法 A heavily doped p-type method of forming |
| 05/23/2012 | CN102468380A 一种led等高电极的制作方法 Production method led Contour electrode |
| 05/23/2012 | CN102468379A 新型光导出结构的制造方法 The new method of manufacturing a light-export structure |
| 05/23/2012 | CN102468378A 网状透明电极的制作方法 Method of making a transparent electrode mesh |
| 05/23/2012 | CN102468377A 一种提高电流扩展效应的led制作方法 An increase led current spreading effect of production methods |
| 05/23/2012 | CN102468376A 三元GaAsP铝电极发光二极管芯片制备方法 Three yuan GaAsP light emitting diode chip aluminum electrode preparation |
| 05/23/2012 | CN102468375A Light-emitting diode packaging structure and manufacturing method thereof |
| 05/23/2012 | CN102468374A Manufacturing method for light-emitting diode |
| 05/23/2012 | CN102468373A 盖板的制造方法及用于制造封装发光二极管的方法 The method of manufacturing the cover, and a method of manufacturing a light emitting diode package for |
| 05/23/2012 | CN102468372A GaN基垂直结构LED中SiC衬底的剥离方法 Vertical structure GaN-based LED in the peeling method of the SiC substrate |
| 05/23/2012 | CN102468319A Light-emitting chip, light-emitting device, print head and image forming apparatus |
| 05/23/2012 | CN102468318A 一种高压直流发光二极管芯片结构及其制造方法 A high voltage DC LED chip structure and manufacturing method |
| 05/23/2012 | CN102468293A 直接电性连接于交流电源的多晶封装结构 Directly electrically connected to the AC power polycrystalline package structure |
| 05/23/2012 | CN102468291A Light emitting device and manufacturing method of the same |
| 05/23/2012 | CN102468290A LED device with improved thermal performance |
| 05/23/2012 | CN102468289A 发光二极管阵列 Light-emitting diode array |
| 05/23/2012 | CN102468288A 发光二极管模组 Light-emitting diode module |
| 05/23/2012 | CN102468287A Led模组及其制造方法 Led module and manufacturing method |
| 05/23/2012 | CN102468286A 一种集成式led光源以及光源的制作方法 Production methods as well as an integrated led light source |
| 05/23/2012 | CN102466205A Led封装灯、led显示面板及led显示器 Led package light, led display panel and led display |
| 05/23/2012 | CN102466148A 使用定电压电源供应器的多晶封装结构 Use constant voltage power supply polycrystalline package structure |
| 05/23/2012 | CN102466146A 一种脉冲led发光装置 An impulse led light-emitting device |
| 05/23/2012 | CN102465343A Method of manufacturing gan-based film |
| 05/23/2012 | CN102464979A 荧光体及发光装置 Phosphor and light-emitting device |
| 05/23/2012 | CN102464928A 一种反射剂 A reflective agent |
| 05/23/2012 | CN102464887A 发光二极管元件用可硬化硅氧烷树脂组合物 A light emitting diode element with a hardenable siloxane resin composition |
| 05/23/2012 | CN102074644B Alternating-current LED (Light-Emitting Diode) white-light emitting device |
| 05/23/2012 | CN102064169B Single-chip white-light LED and preparation method thereof |
| 05/23/2012 | CN102024804B Mixed light type light emitting diode packaging structure capable of increasing color rendering and brightness |
| 05/23/2012 | CN101979427B Preparation method of methyl phenyl vinyl silicon resin for packaging light-emitting diode (LED) |
| 05/23/2012 | CN101971369B Compound semiconductor light-emitting element and illumination device using the same, and method for manufacturing compound semiconductor light-emitting element |
| 05/23/2012 | CN101952983B Radiant heat structure for pin type power led |
| 05/23/2012 | CN101944562B Method for removing light-emitting diode (LED) chip electrode |
| 05/23/2012 | CN101932969B Display device |
| 05/23/2012 | CN101881420B LED light source using fluorescence conversion device with transparent base material |