Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
05/2012
05/30/2012CN102484184A Light emitting semiconductor device
05/30/2012CN102484183A 半导体发光元件 The semiconductor light emitting element
05/30/2012CN102484182A Integrated circuit light emission device, module and fabrication process
05/30/2012CN102484181A Group-III nitride crystal substrate, group-III nitride crystal substrate with epitaxial layer, semiconductor device, and method for manufacturing same
05/30/2012CN102484180A Gallium nitride compound semiconductor light-emitting element
05/30/2012CN102484179A LED with improved injection efficiency
05/30/2012CN102484178A 具有曲率控制层的iii族氮化物发光装置 Iii nitride light-emitting device having a curvature control layer
05/30/2012CN102484177A 半导体发光元件的制造方法、灯、电子设备和机械装置 The method of manufacturing a semiconductor light emitting element, a lamp, an electronic device and a mechanical device
05/30/2012CN102484176A 发光元件及发光元件的制造方法 The method of manufacturing a light emitting element and a light-emitting element
05/30/2012CN102484175A 具有提高的量子效率的发光二极管和制造方法 With improved quantum efficiency and a method of manufacturing a light emitting diode
05/30/2012CN102484174A 硅锗量子阱发光二极管 SiGe quantum well light emitting diodes
05/30/2012CN102484173A Epitaxial formation structures and associated methods of manufacturing solid state lighting devices
05/30/2012CN102484172A Ultraviolet light irradiation device
05/30/2012CN102484171A Optoelectronic component having a semiconductor body, an insulating layer, and a planar conductor structure, and method for the production thereof
05/30/2012CN102483543A Liquid crystal display
05/30/2012CN102483427A Cmos moems传感器器件 Cmos moems sensor devices
05/30/2012CN102483210A 发光装置和车辆用前照灯 A light emitting apparatus and the vehicle headlamp
05/30/2012CN102482576A 用于激光应用的灯 Applications for laser lights
05/30/2012CN102482553A Light-reflective anisotropic electroconductive adhesive agent and light-emitting device
05/30/2012CN102479916A 发光二极管芯片结构 Light-emitting diode chip structure
05/30/2012CN102479915A 散热元件及散热元件的处理方法 The heat treatment and cooling element member
05/30/2012CN102479914A 一种高效高压电极侧壁化键合式led芯片及其制作方法 An efficient high-voltage electrode sidewalls of the key Jog led chip and its manufacturing method
05/30/2012CN102479913A 一种高效高压垂直通孔键合式led芯片及其制作方法 An efficient high-pressure vertical vias key Jog led chip and its manufacturing method
05/30/2012CN102479912A 一种通孔式高散热led芯片及其制作方法 One kind of through-hole high heat led chip and manufacturing method thereof
05/30/2012CN102479911A Light emitting device package
05/30/2012CN102479910A Led module
05/30/2012CN102479909A 发光二极管 Led
05/30/2012CN102479908A Led package
05/30/2012CN102479907A 发光二极管封装结构 A light emitting diode package structure
05/30/2012CN102479906A 发光二极管封装结构 A light emitting diode package structure
05/30/2012CN102479905A 一种提高发光器件出光效率的多层导电透明膜及其方法 Method for improving the efficiency of the light emitting device of a multilayer electrically conductive transparent film and a method
05/30/2012CN102479904A 半导体发光元件及其制造方法 The semiconductor light emitting device and manufacturing method
05/30/2012CN102479903A 一种能增强横向电流扩展的发光二极管 One kind of a lateral current spreading can enhance the light emitting diode
05/30/2012CN102479902A 发光组件 The lighting assembly
05/30/2012CN102479901A Patterned substrate and method for producting same
05/30/2012CN102479900A 第iii族氮化物半导体发光器件 Iii first nitride semiconductor light emitting device
05/30/2012CN102479899A 第iii族氮化物半导体发光器件及其制造方法 Iii first nitride semiconductor light emitting device and its manufacturing method
05/30/2012CN102479898A Light emitting diode and method for fabricating the same
05/30/2012CN102479897A 具有凹坑层的发光二极管装置及其制造方法 Light-emitting diode device and a manufacturing method having pits layer
05/30/2012CN102479896A 一种发光二极管芯片 A light emitting diode chip
05/30/2012CN102479895A 图案化基板及其构成的发光二极管 Patterned substrate and light emitting diodes formed
05/30/2012CN102479894A 一种GaN基材料的发光二极管及其制备方法 Light-emitting diode and a method for preparing a GaN-based materials
05/30/2012CN102479893A 光电元件 Optoelectronics
05/30/2012CN102479892A 制造垂直发光器件的方法及用于该发光器件的衬底组件 The method of manufacturing a light emitting device and the vertical component of the substrate for the light emitting device
05/30/2012CN102479891A 一种发光二极管外延片、芯片及其制作方法 A light-emitting diode epitaxial wafers, chip and its manufacturing method
05/30/2012CN102479890A 光学平台的形成方法 The method for forming an optical platform
05/30/2012CN102479889A 形成光学平台的方法 The method for forming an optical platform
05/30/2012CN102479888A 在两光学透镜及分隔环界定的槽间中填注并密封荧光层的方法 In filling in the partition between the two optical lens and the ring groove defined and sealed fluorescent layer method
05/30/2012CN102479887A 磊晶元件的制作方法 Epitaxial device manufacturing method
05/30/2012CN102479886A 具有粗化层的发光二极管的制造方法 The method of manufacturing a light emitting diode layer is roughened
05/30/2012CN102479885A 半导体元件的制造方法 The method of manufacturing a semiconductor device
05/30/2012CN102479797A 一种高散热混光型led芯片及其制作方法 A high-heat mixed light type led chip and its manufacturing method
05/30/2012CN102479785A 具有沉积式荧光披覆层的发光结构及其制作方法 Light-emitting structure and a method of preparing coated layer deposited fluorescent
05/30/2012CN102479784A 用以形成白光的发光二极管模块 To form a white light emitting diode module
05/30/2012CN102479783A 用以提升发光效率的发光二极管模块 To enhance the luminous efficiency of the light emitting diode module
05/30/2012CN102479782A 具荧光层的发光二极管模块 A phosphor layer emitting diode module
05/30/2012CN102479781A 用以形成白光的发光二极管模块 To form a white light emitting diode module
05/30/2012CN102479780A 用以形成白光的发光二极管模块 To form a white light emitting diode module
05/30/2012CN102479779A 用以形成白光的发光二极管模块 To form a white light emitting diode module
05/30/2012CN102479778A 用以形成白光的发光二极管模块 To form a white light emitting diode module
05/30/2012CN102479777A 用以形成白光的发光二极管模块 To form a white light emitting diode module
05/30/2012CN102479776A 一种基于铕配合物的红色发光器件 Red light emitting device based on europium complexes
05/30/2012CN102479683A 通过高热膨胀系数(cte)层降低晶圆变形 By the coefficient of thermal expansion (cte) layer to reduce deformation of the wafer
05/30/2012CN102476087A Led混胶封装的针筒结构 Led mixing syringe structural adhesive package
05/30/2012CN102102862B Method for packing micro-volume multi-LED (Light-Emitting Diode) integrated unit
05/30/2012CN102017193B Semiconductor light-emitting device with double-sided passivation
05/30/2012CN101982905B InP-based strained quantum well structure with pseudo-substrate and preparation method thereof
05/30/2012CN101972735B Numerical control rotary three-dimensional dispenser
05/30/2012CN101965647B 发光器件 The light emitting device
05/30/2012CN101943376B LED packaging structure for eliminating glare
05/30/2012CN101907273B Encapsulating method of high-luminous-efficiency LED
05/30/2012CN101870810B Heat-resistant polyamide composition
05/30/2012CN101868863B Robust LED structure for substrate lift-off
05/30/2012CN101859849B Semiconductor and semiconductor forming method, flip-chip LED packaging structure
05/30/2012CN101853906B Circuit structure
05/30/2012CN101796660B Opto-electronic semiconductor body
05/30/2012CN101792929B Group iii nitride crystal substrate and semiconductor device
05/30/2012CN101779302B Optical element coupled to low profile side emitting led
05/30/2012CN101771117B Light-emitting device and manufacturing method thereof
05/30/2012CN101765764B Plasma-enhanced electromagnetic-radiation-emitting devices and methods for fabricating the same
05/30/2012CN101754859B Method and apparatus for depositing films
05/30/2012CN101752466B Light-emitting component
05/30/2012CN101749664B Method for manufacturing LED light fitting
05/30/2012CN101740681B Nitride semiconductor device
05/30/2012CN101713521B Alternating-current light emitting diode structure
05/30/2012CN101690401B Light-emitting nanocomposite particles
05/30/2012CN101681957B Led with porous diffusing reflector
05/30/2012CN101645480B Method for enhancing antistatic ability of GaN-based light-emitting diode
05/30/2012CN101635294B Light emission device
05/30/2012CN101611501B Method and material for processing iron disilicide for photovoltaic application
05/30/2012CN101598315B Illumination device and radiation structure thereof
05/30/2012CN101572282B LED encapsulated by flat convex lens and manufacturing method thereof
05/30/2012CN101563794B Lighting device of leds on a transparent substrate
05/30/2012CN101551067B White light LED light source module adopting COB technology and array interconnecting
05/30/2012CN101540358B Manufacturing method of wide-spectrum high-power semiconductor superradiance LED
05/30/2012CN101536157B Method for producing silicon carbide substrate and silicon carbide substrate
05/30/2012CN101488553B Silica gel protected LED chip and manufacturing method thereof
05/30/2012CN101482235B Color temperature-adjustable high-color development LED lamp and manufacturing method thereof
05/30/2012CN101479087B Method for compression molding electric component and compression molding apparatus for use in the method
05/30/2012CN101472368B Lighting controller of lighting device for vehicle and lighting control method
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