| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 05/24/2012 | US20120126272 Light-emitting element and display device using same |
| 05/24/2012 | US20120126271 Light-emitting device having a gain region and a reflector |
| 05/24/2012 | US20120126270 Organic Optical Device and Protective Component of Organic Optical Device |
| 05/24/2012 | US20120126269 Light emitting device, manufacturing method thereof, and optical device |
| 05/24/2012 | US20120126267 Light emitting diode package and manufacturing method thereof |
| 05/24/2012 | US20120126266 Illumination apparatus |
| 05/24/2012 | US20120126265 Led package |
| 05/24/2012 | US20120126264 Light emitting diode package and method for manufacturing the same |
| 05/24/2012 | US20120126262 Etching growth layers of light emitting devices to reduce leakage current |
| 05/24/2012 | US20120126261 Lens, light-emitting module, light-emitting element package, illumination device, display device, and television receiver |
| 05/24/2012 | US20120126260 High efficacy semiconductor light emitting devices employing remote phosphor configurations |
| 05/24/2012 | US20120126259 Light emitting diode |
| 05/24/2012 | US20120126258 Display device, organic light emitting diode display, and manufacturing method of sealing substrate |
| 05/24/2012 | US20120126257 Light emitting devices and methods |
| 05/24/2012 | US20120126256 Led package |
| 05/24/2012 | US20120126255 Light emitting devices and methods |
| 05/24/2012 | US20120126254 Led lamp with improved die arrangement |
| 05/24/2012 | US20120126253 Phosphor blend for an led light source and led light source incorporating same |
| 05/24/2012 | US20120126242 Light emitting device and lighting apparatus |
| 05/24/2012 | US20120126241 Group iii nitride semiconductor light-emitting device and production method therefor |
| 05/24/2012 | US20120126235 Apparatus and method for reducing photo leakage current for tft lcd |
| 05/24/2012 | US20120126203 High Power LED Device Architecture Employing Dielectric Coatings and Method of Manufacture |
| 05/24/2012 | US20120126202 Light emitting device and light emitting device package |
| 05/24/2012 | US20120126201 Gallium nitride led devices with pitted layers and methods for making thereof |
| 05/24/2012 | US20120126200 Nanowhiskers with PN Junctions, Doped Nanowhiskers, and Methods for Preparing Them |
| 05/24/2012 | US20120126198 Light emitting diode for droop improvement |
| 05/24/2012 | US20120126174 Non stoichiometric tetragonal copper alkaline earth silicate phosphors and method of preparing the same |
| 05/24/2012 | US20120125911 Oven having diffuse light pipe assembly |
| 05/24/2012 | DE202012003706U1 LED-Leuchtmittelsockel LED Lamp Socket |
| 05/24/2012 | DE10327360B4 Verfahren zum Herstellen eines Keramik-Metall-Substrates A method of manufacturing a ceramic-metal substrate |
| 05/24/2012 | DE102011102550A1 Gehäuse zur Aufnahme mindestens einer Lichtquelle Housing for accommodating at least one light source |
| 05/24/2012 | DE102010061848A1 LED-Modul mit vorgefertigtem Element LED module with prefabricated element |
| 05/24/2012 | DE102010061801A1 LED-Modul mit gemeinsamem Farbumwandlungsmodul für wenigstens zwei LED-Chips LED module with common color conversion module for at least two LED chips |
| 05/24/2012 | DE102010051959A1 Optoelektronisches Halbleiterbauelement Optoelectronic semiconductor component |
| 05/23/2012 | EP2455991A1 Led chip assembly, led package, and manufacturing method of led package |
| 05/23/2012 | EP2455990A2 LED package |
| 05/23/2012 | EP2455989A1 Nitride-based semiconductor light-emitting element |
| 05/23/2012 | EP2455988A1 Nitride-based semiconductor light-emitting element |
| 05/23/2012 | EP2455987A2 Light emitting device and lighting system having the same |
| 05/23/2012 | EP2455986A2 Method for fabricating vertical light emitting devices and substrate assembly for the same |
| 05/23/2012 | EP2455970A1 Light emitting device and method of fabricating the same |
| 05/23/2012 | EP2455969A2 Light emitting device |
| 05/23/2012 | EP2455966A1 Light emitting device |
| 05/23/2012 | EP2454765A1 Light-emitting diode and method for producing a light-emitting diode |
| 05/23/2012 | EP2454764A1 Reflective substrate for leds |
| 05/23/2012 | EP2454763A1 Optoelectronic semiconductor component and method for producing an inorganic optoelectronic semiconductor component |
| 05/23/2012 | EP2454762A1 P-contact and light-emitting diode for the ultraviolet spectral range |
| 05/23/2012 | EP2454761A1 Method of bonding using a bonding layer based on zinc, silicon and oxygen and corresponding structures |
| 05/23/2012 | EP2454621A2 Lighting device with light sources positioned near the bottom surface of a waveguide |
| 05/23/2012 | EP2454519A1 Solid state light fixture |
| 05/23/2012 | CN202231944U High heat-dissipation type PCB structure for LED |
| 05/23/2012 | CN202231065U Structure for heat conduction of LED (light-emitting diode) |
| 05/23/2012 | CN202231064U Surface mount type luminous device |
| 05/23/2012 | CN202231063U LED light source, displayer and light fixture |
| 05/23/2012 | CN202231062U LED packaging structure |
| 05/23/2012 | CN202231061U LED packaging structure |
| 05/23/2012 | CN202231060U High-efficiency white light emitting diode (LED) package employing transparent ceramic support |
| 05/23/2012 | CN202231059U Efficient radiating white light LED (light-emitting diode) package with light mixing chamber |
| 05/23/2012 | CN202231058U Light guide structure for light-emitting diode |
| 05/23/2012 | CN202231057U Package structure of SMD (surface mounting device) LED (light emitting diode) |
| 05/23/2012 | CN202231056U Improved integrally-packaged light-emitting diode (LED) module |
| 05/23/2012 | CN202231055U LED (light-emitting diode) support and LED |
| 05/23/2012 | CN202231054U LED (Light-Emitting Diode) project lamp |
| 05/23/2012 | CN202231053U LED (light-emitting diode) ceramic substrate for integrated packaging |
| 05/23/2012 | CN202231052U Bracket for LED (light-emitting diode) luminescent device |
| 05/23/2012 | CN202231051U Packaging structure of large power LED module group |
| 05/23/2012 | CN202231010U Novel integrated LED (light emitting diode) package structure |
| 05/23/2012 | CN202231009U Novel fluorescent powder-free dual wavelength blended white-light LED encapsulation |
| 05/23/2012 | CN1945822B Semiconductor device, semiconductor module and semiconductor module producing method |
| 05/23/2012 | CN1917240B Light-emitting semiconductor device possessing light-emitting conversion element |
| 05/23/2012 | CN102474956A 照明装置 Lighting device |
| 05/23/2012 | CN102474949A Surface light emitting device |
| 05/23/2012 | CN102474946A Light-emitting element drive apparatus and handheld device |
| 05/23/2012 | CN102473830A Lead frame for optical semiconductor device, manufacturing method of lead frame for optical semiconductor device, and optical semiconductor device |
| 05/23/2012 | CN102473829A LED chip assembly, LED package, and manufacturing method of LED package |
| 05/23/2012 | CN102473828A Mounting substrate for semiconductor light emitting element, backlight chassis, display device and television receiver |
| 05/23/2012 | CN102473827A Led package and manufacturing method thereof |
| 05/23/2012 | CN102473826A Light-reflecting substrate, substrate which can be mounted in light-emitting element, light-emitting device, and process for production of substrate which can be mounted in light-emitting element |
| 05/23/2012 | CN102473825A 发光二极管和用于制造发光二极管的方法 A light emitting diode and a method for manufacturing a light emitting diode |
| 05/23/2012 | CN102473824A White color reflecting material and process for production thereof |
| 05/23/2012 | CN102473823A 发光装置 Light-emitting device |
| 05/23/2012 | CN102473822A 具有散射颗粒区域的led封装 Scattering particles has led package region |
| 05/23/2012 | CN102473821A Led模块、led灯和照明装置 Led module, led lamps and lighting equipment |
| 05/23/2012 | CN102473820A LED with silicone layer and laminated remote phosphor layer |
| 05/23/2012 | CN102473819A 发光装置 Light-emitting device |
| 05/23/2012 | CN102473818A 颜色关于角度的变化减少的led Color change led on a reduced angle |
| 05/23/2012 | CN102473817A 无镉再发光半导体构造 Cadmium-free re-emitting semiconductor construction |
| 05/23/2012 | CN102473816A 基于电流拥挤调节颜色的电致发光装置 Based on current crowding adjust the color of the electroluminescent device |
| 05/23/2012 | CN102473815A Light-emitting device |
| 05/23/2012 | CN102473814A Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component |
| 05/23/2012 | CN102473813A Light emitting device and method for manufacturing same |
| 05/23/2012 | CN102473812A Light emitting diode circuit for ambient light |
| 05/23/2012 | CN102473811A 具有模制的反射侧壁涂层的led Has molded reflective sidewall coating led |
| 05/23/2012 | CN102473810A 光电子半导体器件和用于制造无机光电子半导体器件的方法 Optoelectronic semiconductor device and a method of manufacturing an inorganic optoelectronic semiconductor device |
| 05/23/2012 | CN102473809A 发光二极管 Led |
| 05/23/2012 | CN102473808A 发光二极管 Led |
| 05/23/2012 | CN102473807A 用于半导体发光器件的反射性接触 A reflective contact with the semiconductor light emitting device |
| 05/23/2012 | CN102473806A 发光二极管 Led |
| 05/23/2012 | CN102473805A GaN基半导体发光器件及其制造方法 GaN-based semiconductor light-emitting device and its manufacturing method |
| 05/23/2012 | CN102473804A 用于III族磷化物半导体发光器件的p接触层 P-contact layer for the Group III phosphide semiconductor light emitting device |