Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
05/2012
05/30/2012EP2458653A1 Light emitting diode having vertical topology
05/30/2012EP2458652A1 Method of making light emitting diodes having vertical topology
05/30/2012EP2458428A1 Driver device, backlight unit, and image display apparatus
05/30/2012EP2458412A1 Method for manufacturing an improved optical layer of a light emitting device, and light emitting device with surface nano-micro texturation based on radiation speckle lithography.
05/30/2012EP2457296A1 Optoelectronic semiconductor body with a quantum well structure
05/30/2012EP2457269A2 Optoelectronic device with heat spreader unit
05/30/2012EP2457268A1 Reduced color over angle variation leds
05/30/2012EP2457267A1 Led with molded reflective sidewall coating
05/30/2012EP2457266A1 Reflective contact for a semiconductor light emitting device
05/30/2012EP2457265A1 An electrically driven single photon source
05/30/2012EP2457254A1 Method for manufacturing a light source and light source
05/30/2012EP2457252A1 Packaging or mounting a component
05/30/2012EP1794815B1 Semiconductor heterostructure
05/30/2012DE202011101257U1 Leuchtdioden-Leuchtmittel Light-bulbs
05/30/2012CN202262225U High-power LED (light-emitting diode) mounter
05/30/2012CN202262075U Light emitting diode (LED) circuit board
05/30/2012CN202262034U Radiating carrier plate of light-emitting diode (LED) lighting unit
05/30/2012CN202259446U LED heat radiator with fixed seat
05/30/2012CN202259445U SMD (Surface Mounted Devices)-type LED (Light-Emitting Diode)
05/30/2012CN202259444U Auxiliary part and connecting circuit of light sources
05/30/2012CN202259443U Heat radiator
05/30/2012CN202259442U Lighting device with heat pipe
05/30/2012CN202259441U Novel LED chip
05/30/2012CN202259440U Thermal column used for LED packaging
05/30/2012CN202259439U Large-power LED heat dissipating substrate
05/30/2012CN202259438U Semiconductor lighting device with silver-tin welding electrodes
05/30/2012CN202259437U Multi-reflection cup integrated type LED (light emitting diode) packaging structure
05/30/2012CN202259436U Ceramic-coating substrate for packaging LED (Light Emitting Diode)
05/30/2012CN202259435U LED (Light Emitting Diode) with light reflection film
05/30/2012CN202259434U LED chip packaging structure having concave mirror form packaging pedestal
05/30/2012CN202259433U Transparent ceramic package bracket for low-power LED (Light Emitting Diode)
05/30/2012CN202259432U Red LED lamp bead and indoor lamp adopting same
05/30/2012CN202259431U Light source module and light source module array of light source module
05/30/2012CN202259430U High-power LED (light-emitting diode) micro-circulation heat dissipation device
05/30/2012CN202259429U Ceramic 1W high-power LED package structure
05/30/2012CN202259428U White-light LED (Light-Emitting Diode) capsulation structure
05/30/2012CN202259427U Novel high-power LED (light emitting diode) encapsulating structure
05/30/2012CN202259426U Light source arrangement structure
05/30/2012CN202259425U Electrode connecting structure of light sources
05/30/2012CN202259424U Transparent ceramic packaging support of high-power LED (Light Emitting Diode)
05/30/2012CN202259423U LED lamp adopting fluorescent composite mirror structure
05/30/2012CN202259422U LED encapsulation bracket and LED light source
05/30/2012CN202259421U Light emitting semiconductor chip support with falling hole
05/30/2012CN202259420U Tooth-shaped light-emitting diode (LED) support of flywheel
05/30/2012CN202259419U Gear toothed LED (light emitting diode) bracket
05/30/2012CN202259418U Improved light-emitting diode (LED) support structure
05/30/2012CN202259417U Integrated aluminium substrate for light-emitting diode (LED)
05/30/2012CN202259416U Backlight LED (Light-emitting Diode) radiation bracket
05/30/2012CN202259415U Light-emitting body with large-power LED (Light-Emitting Diode) seamless arc-shaped light source
05/30/2012CN202259414U High-power LED seamless arc-shaped light source
05/30/2012CN202259413U High-power LED light source
05/30/2012CN202259412U Ceramic substrate for LED (Light-emitting Diode) packaging
05/30/2012CN202259411U Light-emitting diode (LED) light source packaging structure with embedded ceramic plate
05/30/2012CN202259410U LED with built-in resistor
05/30/2012CN202259409U Single-chip LED lamp
05/30/2012CN202259408U Packaging structure utilizing concave-mirror-type transparent YAG ceramic or crystal to improve lighting effect of LED chip
05/30/2012CN202259407U Light-emitting diode (LED)-chip on board (COB) plane light source
05/30/2012CN202259406U LED (Light-emitting Diode) displayer
05/30/2012CN202259405U LED light-emitting device
05/30/2012CN202259404U Anti-creeping light-emitting diode (LED) pipe core structure
05/30/2012CN202259403U Chip with cylindrical light transmission structure
05/30/2012CN202259402U Light-white LED (Light Emitting Diode) extension structure
05/30/2012CN202259401U High-power and high-brightness LED (Light Emitting Diode) chip
05/30/2012CN202259400U White light emitting diode (LED) epitaxial structure and white LED chip structure
05/30/2012CN202259399U AlGaAs tube core structure
05/30/2012CN202259398U Luminous device
05/30/2012CN202259397U Light-emitting diode (LED) packaging die
05/30/2012CN202259396U High-whiteness substrate based LED light source single-cup module
05/30/2012CN202259395U LED (light-emitting diode) light source
05/30/2012CN202259299U Light-emitting diode (LED) copper wire lamp string
05/30/2012CN202259298U Ceramic area light source packaging structure
05/30/2012CN202259297U White light emitting diode (LED) integrated encapsulation structure with high color rendering index
05/30/2012CN202259296U Large-power strawhat-shaped integrated packaging light-emitting diode (LED) light source structure used for headlamp of automobile
05/30/2012CN202259295U High-power integrated type LED light source
05/30/2012CN202259294U Novel outdoor display screen special-purpose LED
05/30/2012CN202259293U An LED light having a plurality of chips connected in parallel
05/30/2012CN202259292U High efficiency heat dissipation type LED lamp
05/30/2012CN202259291U Direct inserting type multi-chip LED lamp bead
05/30/2012CN202259290U Light source module of LED (light-emitting diode) integrated packaging structure
05/30/2012CN202259288U LED substrate structure
05/30/2012CN202259287U Luminescent device display
05/30/2012CN202259286U LED and LED lamp formed by LEDs
05/30/2012CN202258163U Efficiently-radiating LED (light emitting diode) display module
05/30/2012CN202256984U Spherical camera
05/30/2012CN202256728U Light-receiving film structure, photoelectric conversion device thereof and light-emitting module
05/30/2012CN202253079U LED lamp bar with structure of improving LED heat radiation
05/30/2012CN1681828B Organic light emitting materials with anionic ligand
05/30/2012CN1663055B Light-emitting diode with silicon carbide substrate
05/30/2012CN102484949A Electronic Device
05/30/2012CN102484195A 发光器件以及使用该发光器件的光单元 The light emitting device and a light unit using the light emitting device
05/30/2012CN102484194A Reflector for light-emitting device, and light-emitting device
05/30/2012CN102484193A 结合窗口元件的模制透镜 The combination of the window molding of the lens element
05/30/2012CN102484192A Light emitter with predefined angular color point distribution
05/30/2012CN102484191A Led module with high index lens
05/30/2012CN102484190A Led package with increased feature sizes
05/30/2012CN102484189A 发光装置 Light-emitting device
05/30/2012CN102484188A Led Equipment Purpose Wafer, Method For Manufacturing Same, And Led-equipped Structure Using Led Equipment Purpose Wafer
05/30/2012CN102484187A Led mount bar capable of freely forming curved surfaces thereon
05/30/2012CN102484186A Optoelectronic module comprising at least one first semiconductor body having a radiation outlet side and an insulation layer and method for the production thereof
05/30/2012CN102484185A 半导体发光二极管及其制造方法 The method of manufacturing a semiconductor light emitting diode and
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