Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
06/2012
06/27/2012EP2469613A2 Light emitting device and illumination apparatus using the same
06/27/2012EP2469612A2 Method of manufacturing light emitting diode
06/27/2012EP2469596A2 Light module for a lighting device of a motor vehicle with semiconductor light sources arranged on a silicon substrate
06/27/2012EP2469241A2 Optical encoder readhead configuration
06/27/2012EP2468836A1 Phosphor, light-emitting device, and liquid crystal display device using same
06/27/2012EP2467883A2 High brightness led utilizing a roughened active layer and conformal cladding
06/27/2012EP2467877A1 Anisotropic strain control in semipolar nitride quantum wells by partially or fully relaxed aluminum indium gallium nitride layers with misfit dislocations
06/27/2012EP2467872A1 Semipolar nitride-based devices on partially or fully relaxed alloys with misfit dislocations at the heterointerface
06/27/2012EP2467871A1 Method for manufacturing a light-emitting diode device for emitting light
06/27/2012EP1914811B1 Light-emitting device, method for manufacturing same, molded body and sealing member
06/27/2012DE212009000239U1 LED für eine dreidimensionale Beleuchtung LED lighting for a three-dimensional
06/27/2012CN202285457U 散热基材 Heat sink substrate
06/27/2012CN202285250U 一种led基板 One kind of led board
06/27/2012CN202285249U 一种led芯片支架 One kind of led chip stent
06/27/2012CN202285248U 发光二极管的承载支架及其封装结构 Light-emitting diodes and package structure bearing bracket
06/27/2012CN202285247U Top led防水封装结构 Top led waterproof package
06/27/2012CN202285246U 一种新的led发光管支架 A new led light tube bracket
06/27/2012CN1964093B Nitride semiconductor device
06/27/2012CN1949547B Wafer stage chip packing structure of LED and packing method
06/27/2012CN1825586B Led assembly and method of making the same
06/27/2012CN102522488A Encapsulating structure for lighting LED lamp strip
06/27/2012CN102522487A Liquid-crystal display device and LED (Light-Emitting Diode) packaging structure thereof
06/27/2012CN102522486A Photoelectric element
06/27/2012CN102522485A Semiconductor light emitting device
06/27/2012CN102522484A White-light LED (Light-Emitting Diode) device and preparation method of fluorescent powder thereof
06/27/2012CN102522483A Optical wavelength conversion chip, manufacturing method of optical wavelength conversion chip and light source device
06/27/2012CN102522482A Light emitting diode packaging structure and manufacturing method
06/27/2012CN102522481A LED (Light-Emitting Diode) chip bracket for eutectic-soldering die attachment
06/27/2012CN102522480A Preparation method for fluorescent lens for packaging LED
06/27/2012CN102522479A LED (light-emitting diode) module light source, processing method of LED module light source and LED display device
06/27/2012CN102522478A Light-emitting diode module and support thereof
06/27/2012CN102522477A Led packaging structure
06/27/2012CN102522476A Packaging structure of efficient light emitting diode light source
06/27/2012CN102522475A Production method of LED (Light-Emitting Diode) module and LED module
06/27/2012CN102522474A Production method of light-emitting diode (LED) module and LED module
06/27/2012CN102522473A Semiconductor light-emitting device, production method of semiconductor light-emitting device, and semiconductor light-emitting device packaging part
06/27/2012CN102522472A Light-emitting diode with current barrier layer and production method of light-emitting diode with current barrier layer
06/27/2012CN102522471A LED (light-emitting diode) epitaxial wafer
06/27/2012CN102522470A Electric control structure and electric control method for implementation of surface plasmon polariton photon modulation
06/27/2012CN102522469A ZnO substrate epitaxy structure, manufacture method thereof and ZnO substrate chip structure
06/27/2012CN102522468A Light emitting diode with good n-type ohmic contact and manufacturing method thereof
06/27/2012CN102522467A Preparation method of submicron-grade graph on sapphire substrate
06/27/2012CN102522466A Method for packaging LED illuminating device
06/27/2012CN102522465A Method for manufacturing light emitting diode
06/27/2012CN102522464A Method of manufacturing light emitting diode package
06/27/2012CN102522400A Anti-electrostatic-damage vertical light-emitting device and manufacturing method thereof
06/27/2012CN102522399A LED encapsulation structure
06/27/2012CN102522398A COB (Chip On Board) integrated-packaged LED (Light-Emitting Diode) with high color-rendering index and high reliability
06/27/2012CN102522397A Light emitting device and method for manufacturing the same
06/27/2012CN102522396A LED (Light Emitting Diode) package structure capable of improving illumination with softened lighting effect
06/27/2012CN102522382A Chip package
06/27/2012CN102522348A Eutectic welding machine for die bonding of LED (Light Emitting Diode) chip
06/27/2012CN102522318A Self-splitting and transfer method for GaN-based epitaxial film
06/27/2012CN102518956A Packaging body for luminous source
06/27/2012CN102518955A Packaging body for luminous source
06/27/2012CN102518949A 光源 Light source
06/27/2012CN102517017A Phosphor and its preparation method and white LED plane light source containing phosphor
06/27/2012CN102516999A Warm white mixed fluorescent material with color rendering index of more than 90 and preparation method thereof
06/27/2012CN102516979A Color conversion organic material for plant illumination light source and application thereof
06/27/2012CN102516932A Transparent liquid silica gel and preparation method thereof
06/27/2012CN102516712A Heat curable resin composition for light reflection, optical semiconductor element mounting substrate and optical semiconductor device using the resin composition
06/27/2012CN102516501A Photo-curing material for manufacturing light-emitting diode (LED) lens
06/27/2012CN102516500A Organic silicon modified epoxy resin for packaging LED (Light Emitting Diode), and preparation method and application thereof
06/27/2012CN102516314A N-heterocyclic carbene complex catalyst and preparation and application thereof
06/27/2012CN102117868B Method for producing low ripple coefficient semiconductor super-radiation LED
06/27/2012CN102110749B Coarsening and etching method of large-area controllable surface of SiC substrate light emitting diode (LED) based on laser
06/27/2012CN102064248B High-power LED chip packaging method
06/27/2012CN101974772B Secondary electroplating method of GaN based LED transferred substrate with vertical structure
06/27/2012CN101946336B White light emitting device and lighting fitting for vehicles using the white light emitting device
06/27/2012CN101931033B White light diode and manufacturing method thereof
06/27/2012CN101911316B Light emitting device
06/27/2012CN101904023B Semiconductor light emitting device and method of fabricating the same
06/27/2012CN101894889B Method for preparing white light LED
06/27/2012CN101834278B Electroluminescence component packaging body and packaging method thereof
06/27/2012CN101813296B LED light source using filter with dual-function of stopping ultraviolet rays and infrared rays
06/27/2012CN101809765B Optoelectronic component
06/27/2012CN101601135B Illumination devices using externally interconnected arrays of light emitting devices, and methods of fabricating same
06/27/2012CN101552268B Light-emitting diode module
06/27/2012CN101473457B Semiconductor light emitting element and method for fabricating the same
06/27/2012CN101471413B Light-emitting element and method for manufacturing the same
06/27/2012CN101432357B Optical semiconductor encapsulating material
06/27/2012CN101353813B Free-standing (Al, Ga, In)N and parting method for forming same
06/27/2012CN101233623B Injection radiator
06/27/2012CN101218688B Substrate and semiconductor light emitting element
06/26/2012US8208252 Infrared energy powered cooling apparatus and computer chassis comprising same
06/26/2012US8208093 Light-emitting device, display device and method of manufacturing light-emitting device
06/26/2012US8207821 Lighting methods and systems
06/26/2012US8207675 Vehicle lamp
06/26/2012US8207659 Light emitting device and light emitting apparatus
06/26/2012US8207556 Group III nitride semiconductor device and epitaxial substrate
06/26/2012US8207555 Light-emitting element and light emitting device using the same
06/26/2012US8207554 System and method for LED packaging
06/26/2012US8207553 Semiconductor chip assembly with base heat spreader and cavity in base
06/26/2012US8207552 Thin film light emitting diode
06/26/2012US8207551 Semiconductor light-emitting device and method
06/26/2012US8207550 Optoelectronic device and the manufacturing method thereof
06/26/2012US8207549 Light emitting diode package and method for manufacturing same
06/26/2012US8207548 Semiconductor light emitting device, light emitting module, lighting apparatus, display element and manufacturing method of semiconductor light emitting device
06/26/2012US8207547 Thin-film LED with P and N contacts electrically isolated from the substrate
06/26/2012US8207546 Semiconductor light-emitting device and method for manufacturing the same
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