| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 12/16/2014 | US8911160 Light emitting device package and backlight unit using the same |
| 12/16/2014 | US8911093 Light emitting device and super-luminescent diode having layer with first, second, and third waveguides |
| 12/11/2014 | US20140363915 Negative photosensitive resin composition and application thereof |
| 12/11/2014 | US20140363912 Multicolor LED and Method of Fabricating Thereof |
| 12/11/2014 | US20140363910 Novel semiconductor package with through silicon vias |
| 12/11/2014 | US20140363908 Method of Manufacturing a Light Emitting, Power Generating or Other Electronic Apparatus |
| 12/11/2014 | US20140362885 Semiconductor light emitting device and illumination device |
| 12/11/2014 | US20140362603 Light source module and backlight unit having the same |
| 12/11/2014 | US20140362565 Light emitting device |
| 12/11/2014 | US20140361332 Light-emitting device |
| 12/11/2014 | US20140361331 Light-emitting apparatus, surface light source, and method for manufacturing package for light-emitting apparatus |
| 12/11/2014 | US20140361330 Semiconductor light emitting element |
| 12/11/2014 | US20140361329 Producing light emitting devices at variable flux levels |
| 12/11/2014 | US20140361328 Uv photoexcited red light-emitting material and light emitting apparatus |
| 12/11/2014 | US20140361327 Light emitting diode and method of manufacturing the same |
| 12/11/2014 | US20140361326 Light emitting device and light emitting device package |
| 12/11/2014 | US20140361325 Package structure and method for manufacturing the same |
| 12/11/2014 | US20140361324 Semiconductor light emitting device |
| 12/11/2014 | US20140361323 Light emitting diode package structure |
| 12/11/2014 | US20140361322 Display contrast |
| 12/11/2014 | US20140361321 Light-emitting element wafer, light emitting element, electronic apparatus, and method of producing light-emitting element wafer |
| 12/11/2014 | US20140361320 Sealed Body, Method for Manufacturing Sealed Body, Light-Emitting Device, and Method for Manufacturing Light-Emitting Device |
| 12/11/2014 | US20140361319 Intergrated lighting apparatus and method of manufacturing the same |
| 12/11/2014 | US20140361318 Light emitting device provided with lens for controlling light distribution characteristic |
| 12/11/2014 | US20140361317 Solid state lighting component package with reflective layer |
| 12/11/2014 | US20140361316 Electro-optical apparatus, manufacturing method for electro-optical apparatus, and electronic device |
| 12/11/2014 | US20140361307 Light emitting chip |
| 12/11/2014 | US20140361288 ZnO FILM STRUCTURE AND METHOD OF FORMING THE SAME |
| 12/11/2014 | US20140361248 Semiconductor light emitting device |
| 12/11/2014 | US20140361247 Gallium nitride-based light emitting diode |
| 12/11/2014 | US20140361246 Light emitting device and lighting system |
| 12/11/2014 | US20140361245 Led chip and method of manufacturing the same |
| 12/11/2014 | US20140361244 Nanowire LED Structure with Decreased Leakage and Method of Making Same |
| 12/11/2014 | US20140361243 Light emitting device |
| 12/10/2014 | CN204014284U 一种用于led灯的电路板和led灯板 A circuit board and led lights led light board |
| 12/10/2014 | CN204011483U 一种双面发光的led芯片封装结构 A double-sided illuminated led chip package structure |
| 12/10/2014 | CN204011482U 用于显示屏的发光二极管 A light emitting diode for display |
| 12/10/2014 | CN204011481U 电热分离并集成led芯片的高反射率电路板 Electrically isolated and integrated high reflectivity led chip board |
| 12/10/2014 | CN204011480U 一种电热分离并集成led芯片的电路板 One kind of electric separation and integration led chip circuit board |
| 12/10/2014 | CN204011479U 一种led型ic封装结构 One kind of led type ic package |
| 12/10/2014 | CN204011478U 一种无透镜的led直下式液晶模组 A non-lens led direct type LCD modules |
| 12/10/2014 | CN204011477U 广角型发光二极管及其发光装置 Wide-angle light-emitting diode and a light-emitting device |
| 12/10/2014 | CN204011476U 一种led封装结构及led显示屏 One kind of led package structure and led display |
| 12/10/2014 | CN204011475U Led贴片 Led SMD |
| 12/10/2014 | CN204011474U 双锥形全角度发光led灯丝 Double cone whole point of light led filament |
| 12/10/2014 | CN204011473U 一种led的封装结构 Packaging structure for the led |
| 12/10/2014 | CN204011472U 一种esd保护的低热阻led灯珠的封装结构 Esd protection package structure for low thermal resistance led lamp beads |
| 12/10/2014 | CN204011471U 一种深紫外led器件封装结构 One kind of device package structure led DUV |
| 12/10/2014 | CN204011470U 发光组件基板以及使用此发光组件基板的发光组件 Components of the substrate and the use of light-emitting components of this light-emitting luminescent substrate components |
| 12/10/2014 | CN204011469U 发光二极管封装及照明装置 LED packaging and lighting equipment |
| 12/10/2014 | CN204011468U 一种led倒装芯片 One kind of flip-chip led |
| 12/10/2014 | CN204011467U 近红外发光二极管 Near-infrared light-emitting diodes |
| 12/10/2014 | CN204011466U 一种反极性AlGaInP基发光二极管 An anti-polar AlGaInP-based light-emitting diodes |
| 12/10/2014 | CN204011465U 一种白光发光二极管led及其led芯片 One kind of white light emitting diodes led and led chip |
| 12/10/2014 | CN204011464U 一种集成led芯片的高发光效率电路板 An integrated high luminous efficiency led chip board |
| 12/10/2014 | CN204011463U 用于放置led芯片的治具 For placement led chip fixture |
| 12/10/2014 | CN204011462U 用于制备led的退火炉管腔体 Annealing furnace for the preparation of the body lumen led the |
| 12/10/2014 | CN204011418U 一种设有正装倒置芯片的led灯丝 One kind of dress features inverted chip led filament |
| 12/10/2014 | CN204011417U 一种通用的折弯型led支架及其封装产品 A common stand and bend type led packages |
| 12/10/2014 | CN204011416U 一种通用的高杯型led支架及其封装产品 A common stand tall cup led product and its packaging |
| 12/10/2014 | CN204011415U 发光二极管 Led |
| 12/10/2014 | CN204011414U 具有热沉结构的led钨丝灯支架 Tungsten has led heat sink structure of the stent |
| 12/10/2014 | CN204010568U 一种led点阵模块 One kind of led dot matrix module |
| 12/10/2014 | CN204005329U 共极式led发光装置 Total pole led light-emitting device |
| 12/10/2014 | CN104205381A Led发光装置及其制造方法以及led照明装置 Led light-emitting device and manufacturing method and led lighting device |
| 12/10/2014 | CN104205380A 具有改善的电接触件的光发射器组件和方法 Light emitter electrical contact assembly and method with improved |
| 12/10/2014 | CN104205379A 光电子模块和用于制造光电子模块的方法 The method of manufacturing optoelectronic modules and optoelectronic modules for |
| 12/10/2014 | CN104205378A 具有高度反射性载体的led模块 Led module having a highly reflective support |
| 12/10/2014 | CN104205377A 发光装置 Light-emitting device |
| 12/10/2014 | CN104205376A 发光二极管器件及用于生产其的包括转换材料化学的方法 The method comprises the chemical conversion material and a light emitting diode device for the production thereof |
| 12/10/2014 | CN104205375A 包括发光器件和波长转换材料的光学腔 A light emitting device comprising an optical cavity and the wavelength conversion material |
| 12/10/2014 | CN104205374A 具有波长转换侧面涂层的发光器件 Having a wavelength conversion light emitting device side coating |
| 12/10/2014 | CN104205373A 陶瓷波长转换板和包括陶瓷波长转换板的光源 Ceramic wavelength conversion board and include ceramic plate light wavelength conversion |
| 12/10/2014 | CN104205372A Led 模块、照明装置和灯 Led modules, lighting equipment and light |
| 12/10/2014 | CN104205371A Led模块和制备led模块的方法、照明装置 Led module and a method for preparing led module, an illumination device |
| 12/10/2014 | CN104205370A 光学基板、半导体发光元件以及半导体发光元件的制造方法 Method for producing an optical substrate, the semiconductor light emitting element and a semiconductor light emitting element |
| 12/10/2014 | CN104205369A 在硅衬底上生长的发光器件 Grown on a silicon substrate a light emitting device |
| 12/10/2014 | CN104205368A 半导体纳米晶体、其制备方法、组合物、以及产品 Semiconductor nanocrystals, their preparation, compositions, and products |
| 12/10/2014 | CN104205367A 近紫外发光装置 Near-ultraviolet light-emitting device |
| 12/10/2014 | CN104205366A 密封的半导体发光器件 Sealing the semiconductor light emitting device |
| 12/10/2014 | CN104205365A 磷光体施加前后发光器件的单个化 Before and after applying a single phosphor of the light emitting device |
| 12/10/2014 | CN104205297A 制造非极性氮化镓基半导体层的方法、非极性半导体器件及其制造方法 The method of manufacturing a non-polar gallium nitride based semiconductor layer, a non-polar semiconductor device and manufacturing method thereof |
| 12/10/2014 | CN104204652A 用于伸展的引线框架构的预旋转的重叠模制双向发散透镜 Overmolded bi diverging lens for the pre-rotation configuration of a lead frame extending |
| 12/10/2014 | CN104204134A 荧光体、荧光体的制造方法及发光装置 Method for producing a phosphor, the phosphor and the light emitting device |
| 12/10/2014 | CN104204025A 光固化性热固化性树脂组合物、固化物、印刷电路板以及光源模块 Photocurable and thermosetting resin composition, cured product, the printed circuit board and a light source module |
| 12/10/2014 | CN104204024A 光反射用树脂组合物、光半导体元件搭载用基板和光半导体装置 Light-reflecting resin composition for optical semiconductor element mounting board and an optical semiconductor device |
| 12/10/2014 | CN104203807A 具有纳米线的光电子半导体结构以及制造这种结构的方法 Optoelectronic semiconductor nanowire structure having such a structure and a method of manufacturing |
| 12/10/2014 | CN104201293A 一种全无机量子点发光二极管 An all-inorganic quantum dot light emitting diode |
| 12/10/2014 | CN104201277A 一种大功率红外发光二极管 One kind of high-power infrared light-emitting diodes |
| 12/10/2014 | CN104201276A 一种周面发光的条状光源 One circumferential surface of the light emitting stripe |
| 12/10/2014 | CN104201275A 一种散热层、具其的电子器件及电子器件的制作方法 A heat sink layer, with which the electronic device and an electronic device fabrication method |
| 12/10/2014 | CN104201274A 一种二极管复合封装结构及其制造方法 A composite package structure and method of manufacturing the diode |
| 12/10/2014 | CN104201273A 高效的led灯珠制造方法、可注塑成型led支架的导电基板及高密集度led支架模组 Efficient manufacturing methods led lamp beads, conductive substrates can be injection molded and led bracket bracket high intensity led module |
| 12/10/2014 | CN104201272A 一种led全彩cob模式的封装方法 An encapsulation method for full-color mode led cob |
| 12/10/2014 | CN104201271A Led灯丝 Led filament |
| 12/10/2014 | CN104201270A Led衬底结构及其制作方法 Led substrate structure and fabrication method thereof |
| 12/10/2014 | CN104201269A 一种单侧电极芯片的led封装结构 Led chip package structure of a unilateral electrode |
| 12/10/2014 | CN104201268A 一种具有嵌入式扩展电极的红外发光二极管制作方法 A kind of extended electrodes embedded infrared LED manufacturing method |
| 12/10/2014 | CN104201267A 发光器件、发光器件封装以及照明系统 A light emitting device, a light emitting device package and a lighting system |
| 12/10/2014 | CN104201266A 一种氮化镓基深紫外led有源区结构 A gallium nitride-based DUV led the active region structure |