Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
01/2015
01/01/2015US20150001572 Semiconductor light emitting device
01/01/2015US20150001571 Semiconductor device and method for manufacturing the same
01/01/2015US20150001570 LED Package and Method of the Same
01/01/2015US20150001569 Curable Silicone Composition, Cured Product Thereof, And Optical Semiconductor Device
01/01/2015US20150001568 Structured substrate for leds with high light extraction
01/01/2015US20150001567 Solid state light and method of forming
01/01/2015US20150001566 Semiconductor light-emitting device with reflective surface region
01/01/2015US20150001565 Light emitting device
01/01/2015US20150001564 Light emitting device
01/01/2015US20150001563 Light emitting device and method of manufacturing the same
01/01/2015US20150001562 Light emitting diode package
01/01/2015US20150001561 Semiconductor light emitting element
01/01/2015US20150001559 Package for light emitting apparatus and light emitting apparatus including the same
01/01/2015US20150001558 Light-emitting device and electronic apparatus
01/01/2015US20150001557 Semiconductor light emitting device and method for manufacturing light source module
01/01/2015US20150001556 Growth substrate and light emitting device comprising the same
01/01/2015US20150001548 Light emitting chip
01/01/2015US20150001540 Thin film transistor array panel and display device including the same
01/01/2015US20150001519 Electrode Foil and Electronic Device
01/01/2015US20150001467 Semiconductor device having superlattice thin film laminated by semiconductor layer and insulator layer
01/01/2015US20150001465 Electronic devices with yielding substrates
01/01/2015US20150001464 Quantum dot light-emitting device
01/01/2015US20150001463 Semiconductor light emitting device
01/01/2015US20150001425 Device for Emitting Electromagnetic Radiation
01/01/2015US20150001409 Optical Assembly
01/01/2015US20150000120 Formation of phosphor regions for broad-area lighting systems
12/2014
12/31/2014CN204067439U 新型led灯 The new led lights
12/31/2014CN204067438U 发光装置 Light-emitting device
12/31/2014CN204067437U 一种led封装除残胶装置 In addition to an encapsulation device led adhesive residue
12/31/2014CN204067436U 一种led集成封装结构 One kind of led integrated package
12/31/2014CN204067435U 一种发光二极管器件及光源模组及光源模块 A light-emitting diode device and light source module and the light source module
12/31/2014CN204067434U 一种二极管复合封装结构 A composite package diode
12/31/2014CN204067433U Led散热基板结构 Led heat dissipation substrate structure
12/31/2014CN204067432U 一种微型led器件 Led a miniature device
12/31/2014CN204067431U 一种新型led支架及led器件 A new bracket and led led devices
12/31/2014CN204067430U 发光模块及照明装置 Emitting module and lighting equipment
12/31/2014CN204067429U 一种新型发光二极管的改良结构 An improved structure of new light-emitting diode
12/31/2014CN204067428U 贴片式led支架结构 SMD led support structure
12/31/2014CN204067427U 一种高效散热型led灯 An efficient cooling type led lights
12/31/2014CN204067426U 一种蓝宝石衬底芯片对称双引脚光源结构 One kind of sapphire chip symmetric double pin light structure
12/31/2014CN204067425U 一种改进的清零/计数对管封装结构 An improved clearing / counting tube package
12/31/2014CN204067424U 一种防封装体模粒反向装置 An anti-reverse device grain mold package
12/31/2014CN204067423U 通孔铜柱直通散热led芯片封装结构 Straight through-hole copper cylinder cooling led chip package structure
12/31/2014CN204067422U 双体二次光学led芯片封装结构 Catamaran secondary optics led chip package structure
12/31/2014CN204067421U 层状双体led芯片封装结构 Catamaran led layered chip package structure
12/31/2014CN204067420U 球体透镜复合式led芯片封装结构 Sphere lens compound led chip package structure
12/31/2014CN204067419U 高散热性的发光二极管封装结构 High heat of the light emitting diode package structure
12/31/2014CN204067418U 一种带有热电分离结构的圆片级led的封装结构 Led a wafer level package structure with thermal separation of
12/31/2014CN204067417U 一种低热阻cob led A low thermal resistance cob led
12/31/2014CN204067416U 一种发光二极管芯片 A light emitting diode chip
12/31/2014CN204067415U 复合晶片以及功能元件 Composite wafers and functional elements
12/31/2014CN204067414U 一种双图案的led图形化衬底及led芯片 Led a dual-patterned substrate and patterned led chip
12/31/2014CN204067413U 生长在W衬底上的InGaN/GaN多量子阱 Grown on the substrate W of InGaN / GaN multiple quantum well
12/31/2014CN204067412U 生长在W衬底上的AlN薄膜 Grown on the substrate W AlN films
12/31/2014CN204067411U 生长在W衬底上的GaN薄膜 Grown on GaN substrate W film
12/31/2014CN204067410U 一种易于生产的双面发光led模组 An easy production of double-sided light led module
12/31/2014CN204067356U 发光装置 Light-emitting device
12/31/2014CN204067355U 隔离荧光粉集成的led 封装器件 Phosphor isolation led package integrated devices
12/31/2014CN204067354U 一种八脚贴片式led灯 An eight-pin SMD led lights
12/31/2014CN204067353U 一种大功率led集成cob光源封装结构 One kind of power led light source integrated package cob
12/31/2014CN204062925U 光电一体光源模块 Optoelectronic integrated light source module
12/31/2014CN204062533U 灯及照明装置 Lamps and lighting fittings
12/31/2014CN204062532U 灯及照明装置 Lamps and lighting fittings
12/31/2014CN104254927A 用于产生w-台面管芯间隔的方法和装置 Method and apparatus for generating w- spaced mesa die
12/31/2014CN104254798A 发光设备和用于制造这种设备的方法 A light emitting device and a method for manufacturing such a device
12/31/2014CN104254585A 荧光体以及使用了该荧光体的发光装置 Phosphor and a light emitting device using the phosphor
12/31/2014CN104253205A 半导体发光器件和其制造方法 Semiconductor light emitting device and manufacturing method thereof
12/31/2014CN104253204A 一种led晶片封装方法 One kind of led chip packaging method
12/31/2014CN104253203A 发光装置用封装件及使用了它的发光装置 A light emitting device package and a light emitting device using it
12/31/2014CN104253202A 一种光输出耦合设备及包括其的显示器或投影仪 A light output coupling device and including a monitor or projector
12/31/2014CN104253201A 发光器件封装件 Light emitting device package
12/31/2014CN104253200A 发光组件及制作方法 The lighting assembly and production methods
12/31/2014CN104253199A 一种led封装结构及其制作方法 An encapsulation structure and production methods led
12/31/2014CN104253198A 一种荧光粉复合颗粒、其制备方法及应用 One phosphor composite particles, their preparation and use
12/31/2014CN104253197A 发光装置及其制造方法 A light emitting device and manufacturing method thereof
12/31/2014CN104253196A 户外照明装置 Outdoor lighting device
12/31/2014CN104253195A 制作白光led的方法 White led the production method
12/31/2014CN104253194A 一种芯片尺寸白光led的封装结构及方法 Package structure and method of chip size white led
12/31/2014CN104253193A 一种高光效高性能的led A high-performance led light efficiency
12/31/2014CN104253192A 发光元件 Emitting element
12/31/2014CN104253191A 发光二极管制造方法 Light-emitting diode manufacturing method
12/31/2014CN104253190A 照明用led的封装方法 Encapsulation method of lighting led
12/31/2014CN104253189A 发光二极管的封装方法及其结构 Light-emitting diode packaging method and structure
12/31/2014CN104253188A 发光二极管元件的制造方法 The method of manufacturing a light emitting diode element
12/31/2014CN104253187A 铝基板的制作方法 Aluminum plate production methods
12/31/2014CN104253186A 发光二极管晶粒及其制造方法 LED chip and its manufacturing method
12/31/2014CN104253185A 发光装置 Light-emitting device
12/31/2014CN104253184A 一种带有渐变式dbr层的蓝光led外延结构 Blu-led epitaxial structure with a layer of graded type dbr
12/31/2014CN104253183A 光学单元 The optical unit
12/31/2014CN104253182A 一种具有非对称垒层的蓝光led外延结构 Blue led an epitaxial structure with asymmetric barrier layer
12/31/2014CN104253181A 一种具有多重垒层led外延结构 Having led multi-barrier layer epitaxial structure
12/31/2014CN104253180A 氮化物半导体元件、氮化物半导体晶片和形成氮化物半导体层的方法 Nitride semiconductor device, the nitride semiconductor wafer to form a nitride semiconductor layer and a method
12/31/2014CN104253179A 一种GaN基LED外延片的制备方法 A process for producing GaN-based LED epitaxial wafers
12/31/2014CN104253121A 全方位发光的发光二极管装置及其封装方法 Light-emitting diode light-emitting device and method for packaging a full range of
12/31/2014CN104253120A 发光装置 Light-emitting device
12/31/2014CN104251417A 光源模组 Light module
12/31/2014CN104250853A Iii族氮化物晶体 Iii nitride crystal
12/31/2014CN104250555A 黄色荧光粉及其制备方法和使用该荧光粉的发光器件 The fluorescent yellow phosphor light emitting device and its preparation method and use
12/31/2014CN103347978B 荧光体、发光装置及其用途 Phosphor, the light emitting device and use thereof
12/31/2014CN102933678B 封装材料、太阳能电池组件及发光二极管 Packaging materials, solar cells and light-emitting diode module
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