Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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12/23/2014 | US8915619 Light emitting module comprising a thermal conductor, a lamp and a luminaire |
12/18/2014 | US20140370631 Removal of 3d semiconductor structures by dry etching |
12/18/2014 | US20140370630 Method for manufacturing semiconductor light emitting device |
12/18/2014 | US20140370629 Method of Manufacturing a Printable Composition of a Liquid or Gel Suspension of Diodes |
12/18/2014 | US20140370625 Stopping An Etch In A Planar Layer After Etching A 3D Structure |
12/18/2014 | US20140369646 Methods of forming three-dimensionally integrated semiconductor systems including photoactive devices and semiconductor-on-insulator substrates |
12/18/2014 | US20140369030 Solid state light sources with common luminescent and heat dissipating surfaces |
12/18/2014 | US20140368744 Display apparatus and television receiving apparatus |
12/18/2014 | US20140368123 Light-emitting metal-oxide-semiconductor devices and associated systems, devices, and methods |
12/18/2014 | US20140367735 Iii nitride semiconductor substrate, epitaxial substrate, and semiconductor device |
12/18/2014 | US20140367734 Light emitting diode |
12/18/2014 | US20140367733 Light-emitting device |
12/18/2014 | US20140367732 Light emitting device, method of fabricating the same and lighting system having the same |
12/18/2014 | US20140367731 Light emitting diode and manufacturing method thereof |
12/18/2014 | US20140367730 Semiconductor light emitting device |
12/18/2014 | US20140367729 Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device |
12/18/2014 | US20140367728 Light emitting device and manufacturing method thereof |
12/18/2014 | US20140367727 Light-emitting device having dielectric reflector and method of manufacturing the same |
12/18/2014 | US20140367726 Semiconductor light-emitting device and fabricating method thereof |
12/18/2014 | US20140367725 Composite film and semiconductor light emitting device using the same |
12/18/2014 | US20140367724 Light emitting device package and lighting system including the same |
12/18/2014 | US20140367723 Curable Silicone Composition, Cured Product Thereof, And Optical Semiconductor Device |
12/18/2014 | US20140367722 Light emitting diode and method for manufacturing same |
12/18/2014 | US20140367721 Light-emitting device containing flattened anisotropic colloidal semiconductor nanocrystals and processes for manufacturing such devices |
12/18/2014 | US20140367720 Semiconductor light emitting device and method of manufacturing the same |
12/18/2014 | US20140367719 Phosphors For Use With LEDS and Other Optoelectronic Devices |
12/18/2014 | US20140367718 Light-emitting device and method of manufacturing the same |
12/18/2014 | US20140367717 Semiconductor optical emitting device with metallized sidewalls |
12/18/2014 | US20140367716 Chip on board light emitting diode device having dissipation unit array |
12/18/2014 | US20140367715 Light emitting device and lighting system |
12/18/2014 | US20140367714 Semiconductor light-emitting device |
12/18/2014 | US20140367713 Multi-layer conversion material for down conversion in solid state lighting |
12/18/2014 | US20140367712 Tiny 6 pin side view surface mount led |
12/18/2014 | US20140367711 Led light pipe |
12/18/2014 | US20140367710 Led module |
12/18/2014 | US20140367709 Semiconductor light emitting device lamp that emits light at large angles |
12/18/2014 | US20140367705 Reflective bank structure and method for integrating a light emitting device |
12/18/2014 | US20140367704 Led light assembly |
12/18/2014 | US20140367703 Solid state light sources based on thermally conductive luminescent elements containing interconnects |
12/18/2014 | US20140367698 Method of controlling stress in group-iii nitride films deposited on substrates |
12/18/2014 | US20140367697 Light-emitting diode device and manufacturing method thereof |
12/18/2014 | US20140367696 Formation of group iii-v material layers on patterned substrates |
12/18/2014 | US20140367693 Light-emitting device and the manufacturing method thereof |
12/18/2014 | US20140367692 Light-emitting device and the manufacturing method thereof |
12/18/2014 | US20140367686 Ultrathin solid state dies and methods of manufacturing the same |
12/18/2014 | US20140367666 Organic light-emitting diode, connector and luminaire |
12/18/2014 | US20140367641 Multilayer construction |
12/18/2014 | US20140367640 Light-emitting element, epitaxial wafer, and method for producing the epitaxial wafer |
12/18/2014 | US20140367639 Light emitting device and lighting system |
12/18/2014 | US20140367638 Insulating Layer for Planarization and Definition of the Active Region of a Nanowire Device |
12/18/2014 | US20140367637 Light emitting device and lighting system |
12/18/2014 | US20140367636 Ultraviolet light emitting device incorporating optically absorbing layers |
12/18/2014 | US20140367635 Light emitting diode structure |
12/18/2014 | US20140367634 Nitride-based light emitting diode including nonorods and method of mmanufacturing the same |
12/18/2014 | US20140367633 Led display with wavelength conversion layer |
12/18/2014 | US20140367548 Apparatus for manufacturing fluorescent layers |
12/18/2014 | US20140367357 Manufacturing method of grating |
12/17/2014 | CN204029869U 一种中小功率led散导热封装基板 One kind of scattered small thermal power led package substrate |
12/17/2014 | CN204029868U Led灯 Led lights |
12/17/2014 | CN204029867U 一种led封装结构 One kind of led package |
12/17/2014 | CN204029866U Led芯片及包含其的发光二极管 Led chip and a light emitting diode which contains |
12/17/2014 | CN204029865U 一种led光源 One kind of led light |
12/17/2014 | CN204029864U 发光二极管封装结构 Light emitting diode package structure |
12/17/2014 | CN204029863U 一种单侧电极芯片的led封装结构 Led chip package structure of a unilateral electrode |
12/17/2014 | CN204029862U 一种异侧电极芯片的led封装结构 Led package structure for the opposite side of the chip electrode |
12/17/2014 | CN204029861U 一种发光二极管 A light emitting diode |
12/17/2014 | CN204029860U 一种发光二极管 A light emitting diode |
12/17/2014 | CN204029859U 一种倒锥形ledcob基板结构 An inverted cone ledcob substrate structure |
12/17/2014 | CN204029858U 一种新型照明用双控三色cob A new dual-control lighting cob tricolor |
12/17/2014 | CN204029857U 一种光反射基板及其组成的led模组 A light reflective substrate and composition led module |
12/17/2014 | CN204029856U 一种led灯丝 One kind of led filament |
12/17/2014 | CN204029855U 一种led灯 One kind of led lights |
12/17/2014 | CN204029854U Led灯 Led lights |
12/17/2014 | CN204029853U 发光器件 Light-emitting devices |
12/17/2014 | CN204029852U 一种贴片式led A patch type led |
12/17/2014 | CN204029851U 一种led集成封装基板 An integrated package substrate led |
12/17/2014 | CN204029850U 一种基板表面图形化的cob封装结构 A substrate surface graphical package structure cob |
12/17/2014 | CN204029849U 红外线大功率led IR power led |
12/17/2014 | CN204029848U 一种聚光led模组 One kind of condenser led module |
12/17/2014 | CN204029847U 一种led模块c0b封装结构 One kind of led module packaging structure c0b |
12/17/2014 | CN204029846U 一种新型发光二极管 A new light-emitting diode |
12/17/2014 | CN204029845U 一种具有同侧电极芯片的led封装结构 Led package structure having the same side of the electrode chip |
12/17/2014 | CN204029844U 一种无衬底led芯片的电极结构 A non-substrate electrode structure led chip |
12/17/2014 | CN204029843U 一种具有不导电衬底的led芯片电极结构 Having a non-conductive substrate electrode structure led chip |
12/17/2014 | CN204029842U 一种有利于提局光通量的网状图形衬底 An environment conducive to mention the graphics mesh substrate flux Bureau |
12/17/2014 | CN204029841U 发光二极管芯片 Light-emitting diode chips |
12/17/2014 | CN204029840U 一种能切割成led芯片的晶圆 One can cut wafer led chip |
12/17/2014 | CN204029801U 采用倒装芯片封装的集成模组led光源 Flip chip package integrated module led light |
12/17/2014 | CN204029800U 白光发光器件 White light emitting device |
12/17/2014 | CN204029799U 八脚贴片式led灯 Eight feet SMD led lights |
12/17/2014 | CN204029798U Led灯芯组合光源 Led wick combination of light |
12/17/2014 | CN204029797U 一种c0b封装led模组 One kind of led module package c0b |
12/17/2014 | CN204026217U 一种360°发光led日光灯 One kind of fluorescent light led 360 ° |
12/17/2014 | CN204026216U 一种led镜面玻璃集成光源 One kind of mirror glass led integrated light source |
12/17/2014 | CN204019874U 用于led灯丝模压封装的治具结构 Governance structure for the filament led molded package |
12/17/2014 | CN104221484A Led网格装置以及led网格装置的制造方法 Led mesh device and method of manufacturing the device led grid |
12/17/2014 | CN104221173A 发光半导体器件和用于制造发光半导体器件的方法 A light emitting semiconductor device and a method of manufacturing a light emitting semiconductor device |
12/17/2014 | CN104221172A 光转换组件、灯和灯具 Optical conversion module, lamps and lighting |
12/17/2014 | CN104221171A 半导体装置、芯片粘合材料和半导体装置的制造方法 The method of manufacturing a semiconductor device, chip bonding material and a semiconductor device |
12/17/2014 | CN104221170A 用于分离外延层与生长基板的方法及使用其的半导体器件 The method of separating the epitaxial layer and the growth substrate for the semiconductor device and the use thereof |