Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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01/07/2015 | EP2820684A1 Optoelectronic semiconductor chip |
01/07/2015 | EP2820678A1 Integration of gallium nitride leds with aluminum gallium nitride/gallium nitride devices on silicon substrates for ac leds |
01/07/2015 | EP2820106A1 Polycarbonate compositions containing conversions material chemistry and having enhanced optical properties, methods of making and articles comprising the same |
01/07/2015 | EP2819981A2 Polycarbonate made from low sulfur bisphenol a and containing converions material chemistry, and articles made therefrom |
01/07/2015 | CN204088382U 一种半导体芯片封装结构 A semiconductor chip package structure |
01/07/2015 | CN204088381U 一种改进结构的圆形led散热装置 Round led to an improved heat sink structure |
01/07/2015 | CN204088380U 一种改进结构的单管led散热装置 Single-tube heat sink led an improved structure |
01/07/2015 | CN204088379U 一种led照明光源 One kind of led lighting |
01/07/2015 | CN204088378U Led支架 Led bracket |
01/07/2015 | CN204088377U 一种超薄高效bt类led灯丝 Efficient bt class led an ultra-thin filament |
01/07/2015 | CN204088376U 电子控制器引线型发光二极管led装置 Electronic controller led lead type light emitting diode device |
01/07/2015 | CN204088375U Led模块以及照明装置 Led module and a lighting device |
01/07/2015 | CN204088374U 一种led注胶模 One kind of plastic injection mold led |
01/07/2015 | CN204088373U 可弯折的led灯丝及其灯泡结构 Led lamp filament bendable structure and |
01/07/2015 | CN204088372U Led支架 Led bracket |
01/07/2015 | CN204088371U 一种led One kind of led |
01/07/2015 | CN204088370U 一种新型的led支架 A novel led bracket |
01/07/2015 | CN204088369U 一种led封装结构 One kind of led package |
01/07/2015 | CN204088368U 一种图形化处理的贴片支架结构 A graphical processing patch scaffold |
01/07/2015 | CN204088367U 一种荧光led灯 Led a fluorescent lamp |
01/07/2015 | CN204088366U 含正装芯片倒装360度发光可任意环绕led灯丝的led光源 Including formal wear flip-chip 360-degree surround led luminous filament can be arbitrarily led light |
01/07/2015 | CN204088365U 一种热电一体双电级贴片散热结构 A thermoelectric cooling patch one double-level structure |
01/07/2015 | CN204088364U 超薄超小正发光双色led元件 Ultra-thin color led light-emitting elements are small |
01/07/2015 | CN204088363U 发光装置 Light-emitting device |
01/07/2015 | CN204088362U 一种倒装芯片式led灯丝 A flip-chip type led filament |
01/07/2015 | CN204088361U 一种低热阻的晶圆级led封装结构 Wafer-level packaging structure led a low thermal resistance |
01/07/2015 | CN204088360U 发光二极体支架结构 Light-emitting diode support structure |
01/07/2015 | CN204088359U 全覆盖式扩展电极结构的发光二极管 Full coverage extended electrode structure of light-emitting diodes |
01/07/2015 | CN204088358U 发光二极管 Led |
01/07/2015 | CN204088357U Led衬底结构 Led substrate structure |
01/07/2015 | CN204088356U Led衬底结构 Led substrate structure |
01/07/2015 | CN204088355U 一种发光二极管结构 A light emitting diode structure |
01/07/2015 | CN204088354U 一种改进的固晶机胶盘 An improved solid crystal plastic tray |
01/07/2015 | CN204088353U 发光二极管裂片装置 Light-emitting diode device lobes |
01/07/2015 | CN204088317U Led芯片集成模块、光源及其固定结构 Led chip module, light source and a fixed structure |
01/07/2015 | CN204088316U 正装芯片倒装360度发光可任意环绕led灯丝 Formal wear flip-chip 360-degree surround led luminous filament can be arbitrary |
01/07/2015 | CN204088315U Mcob led荧光粉分离封装结构 Mcob led phosphor separate package |
01/07/2015 | CN204088314U 一种集成化led灯丝 An integrated led filament |
01/07/2015 | CN204088313U 一种条状全方位发光led灯丝 One kind of filament light led strip round |
01/07/2015 | CN204088312U 聚光的大功率集成uvled面光源 Uvled integrated high-power condenser surface light source |
01/07/2015 | CN204088311U 一种led光源 One kind of led light |
01/07/2015 | CN204088310U 一种led光源组件 One kind of led light module |
01/07/2015 | CN204088309U 一种led灯的光源组件 Light assembly for a led lamp |
01/07/2015 | CN204088308U 一种cob光源系统 One kind of light source system cob |
01/07/2015 | CN204088307U 一种植物生长照明用led光源 A plant growing lighting led light |
01/07/2015 | CN204088306U 一种白光led模组 One kind of white led module |
01/07/2015 | CN204085071U 一种改良的烤箱 An improved oven |
01/07/2015 | CN204084163U 太阳能led灯 Solar led lights |
01/07/2015 | CN204076384U 直插式led灯珠全切模具下刀片 DIP led lamp beads mold under full cut blade |
01/07/2015 | CN204075546U 具有改良供料机构的led焊接机 With improved feeding mechanism led welding machine |
01/07/2015 | CN204075450U 一种辅助cob led的led光源焊接引线的装置 An auxiliary cob led led light welding wire device |
01/07/2015 | CN104272480A 用于制造器件载体、电子装置和辐射装置的方法以及器件载体、电子装置和辐射装置 Method for manufacturing a device carrier, and the electronic device and the device carrier radiation means, electronic means and radiation means |
01/07/2015 | CN104272479A 具有远程纳米结构磷光体的发光设备 A light emitting device having a phosphor remote nanostructure |
01/07/2015 | CN104272478A 在单个载体管芯上的多个发光二极管(led)的晶圆级封装 In the single carrier on the die multiple light emitting diodes (led) wafer level packaging |
01/07/2015 | CN104272477A 氮化物半导体发光元件 The nitride semiconductor light emitting element |
01/07/2015 | CN104272476A 发光二极管驱动装置以及半导体装置 Emitting diode drive device and semiconductor device |
01/07/2015 | CN104271705A 硅酸盐无机发光材料 Silicate phosphor |
01/07/2015 | CN104271495A 表面修饰金属氧化物粒子材料、分散液、聚硅氧烷树脂组合物、聚硅氧烷树脂复合体、光半导体发光装置、照明器具及液晶图像装置 Surface modification of metal oxide particles, a dispersion liquid, a silicone resin composition, silicone resin composite, a semiconductor light emitting device, a lighting apparatus and liquid crystal image device |
01/07/2015 | CN104269492A 全角度发光的功率型led及其制作方法 Power type and production methods led the whole point of light |
01/07/2015 | CN104269491A Led芯片的封装方法及使用该封装方法的led封装结构 Led chip packaging methods and the use of the encapsulation method led package |
01/07/2015 | CN104269490A 集成红外和白光的发光二极管 Integrated infrared and white light emitting diodes |
01/07/2015 | CN104269489A 一种基于紫外或蓝光led芯片产生白光的方法 A white-based method to produce ultraviolet or blue light led chip |
01/07/2015 | CN104269488A 一种高可靠性led封装结构及方法 Led a highly reliable package structure and method |
01/07/2015 | CN104269487A 一种侧光式背光模组及其大发光角度led封装结构 One kind of edge-lit backlight and large light angle led package |
01/07/2015 | CN104269486A 倒装led芯片及其制备方法 Flip-led chip and its preparation method |
01/07/2015 | CN104269485A Led衬底结构及其制作方法 Led substrate structure and fabrication method thereof |
01/07/2015 | CN104269484A 防止蒸镀铝时led芯片电极产生麻点的方法 When prevent the deposition of aluminum electrodes led chip method pitting |
01/07/2015 | CN104269483A 具备全角反射镜的发光二极管芯片的制备方法 Preparation wide angle mirror with light-emitting diode chip |
01/07/2015 | CN104269482A Led衬底结构及其制作方法 Led substrate structure and fabrication method thereof |
01/07/2015 | CN104269481A 具有嵌入式空气空隙的氮化镓二极管及其制备方法 GaN diode and preparation method with embedded air voids |
01/07/2015 | CN104269480A 一种led倒装芯片及其制作方法 A flip chip and production methods led |
01/07/2015 | CN104269479A Led衬底结构及其制作方法 Led substrate structure and fabrication method thereof |
01/07/2015 | CN104269478A Led衬底结构及其制作方法 Led substrate structure and fabrication method thereof |
01/07/2015 | CN104269477A 一种高紫外透光率的p型欧姆接触层制备方法 UV transmittance of a high-ohmic p-type contact layer preparation |
01/07/2015 | CN104269476A 一种掺杂超晶格结构的黄绿光led及其生产工艺 A superlattice structure doped yellow green led its production process |
01/07/2015 | CN104269475A 发光二极管的外延片及其制作方法 Light-emitting diode epitaxial wafer and manufacturing method thereof |
01/07/2015 | CN104269474A Led外延结构 Led epitaxial structure |
01/07/2015 | CN104269473A 一种单电极led芯片的制作方法及芯片结构 A method of making a single electrode led chip and chip architecture |
01/07/2015 | CN104269472A 一种具有介质-金属近场耦合结构的表面等离激元电致激发源及其制作方法 A kind of media - such as metal surface near-field coupling structure electroluminescent plasmon excitation source and its production method |
01/07/2015 | CN104269471A 全角度侧壁反射电极的led芯片及其制作方法 The whole point of the sidewall reflections led chip electrode and its manufacturing method |
01/07/2015 | CN104269470A 能够释放应力的垂直结构led薄膜芯片的制备方法及结构 Preparation and structure of the vertical structure can release stress led film chip |
01/07/2015 | CN104269469A 一种降低宽禁带半导体器件欧姆接触电阻的方法 A method for reducing the wide bandgap semiconductor devices ohmic contact resistance |
01/07/2015 | CN104269360A 全方位条状发光灯具制作方法 Round luminous strip lighting production methods |
01/07/2015 | CN104266143A 一种恶劣环境下使用的防爆led节能灯 An explosion led energy saving lamps used in harsh environments |
01/07/2015 | CN104266097A 一种可提高透光度的led灯丝结构 An improved led transmittance of filament structure |
01/07/2015 | CN104263370A 一种荧光粉、一种发光材料混合物和一种发光材料 One phosphor, a light emitting material and a light emitting material mixture |
01/07/2015 | CN104263364A 一种生物基碳纳米点荧光粉及其制备方法与应用 A carbon nanodots phosphor preparation method and application of bio-based |
01/07/2015 | CN104263359A 一种全光谱led荧光粉及其应用 Led an all-spectrum fluorescent its application |
01/07/2015 | CN104263316A 一种led封装硅胶 One kind of led package of silica gel |
01/07/2015 | CN104263305A 一种环保热稳性led光敏封装胶及其制备方法 An environmentally friendly thermal stability led photosensitive plastic packaging and preparation method |
01/07/2015 | CN104263304A 一种光固化灌注胶及应用方法 A light-cured potting compound and application methods |
01/07/2015 | CN104262972A 一种功率型白光led用单包装有机硅树脂封装胶及其制备方法 A power-type white led with a single silicone resin packaging plastic packaging and preparation method |
01/07/2015 | CN104262969A 一种大功率白光led用的单包装有机硅凝胶封装胶及制备方法 One kind of white led with silicone gel single packaging plastic packaging and preparation of high-power |
01/07/2015 | CN103314074B 赛伦磷光体、其制造方法和具有其的发光装置封装件 Salem phosphor, its manufacturing method and has its light-emitting device package |
01/07/2015 | CN103153611B 树脂片材层合体、其制造方法及使用其的带有含荧光体树脂片材的led芯片的制造方法 Resin laminate sheet, its manufacturing method and using the same manufacturing method with a phosphor-containing resin sheet led chip |
01/07/2015 | CN103059860B 一种锰掺杂钇铝石榴石单晶材料及其应用 Yttrium aluminum garnet single crystal material and apply a manganese-doped |
01/07/2015 | CN103022307B 一种圆片级led封装方法 One kind of wafer level packaging method led |
01/07/2015 | CN103000779B 具有电流阻挡功能的垂直发光二极管及其制作方法 Has a current blocking function vertical light-emitting diode and manufacturing method thereof |
01/07/2015 | CN102956797B 发光二极管的制造方法 The method of manufacturing a light emitting diode |
01/07/2015 | CN102933683B β 型赛隆的制备方法 preparation of β-type sialon |