Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
12/2014
12/17/2014CN104221169A 制造供高效率氮化物发光二极体用的纳米图案化基材的方法 Manufacturing method for high-efficiency light-emitting diode nitride nano-patterning the substrate with the body
12/17/2014CN104221168A 制造供高效率氮化物发光二极体用的纳米图案化基材的方法 Manufacturing method for high-efficiency light-emitting diode nitride nano-patterning the substrate with the body
12/17/2014CN104221150A 光电子半导体芯片和具有这样的半导体芯片的前照灯 Optoelectronic semiconductor chip and a semiconductor chip having such a headlamp
12/17/2014CN104221125A 包括直接管芯安装的发光二极管（led)阵列和相关组件 Comprise light emitting diodes mounted directly to the die (led) array and associated components
12/17/2014CN104220651A 具有偏角的硅单晶和iii族氮化物单晶的层叠基板 Laminated substrate having a silicon single crystal and iii declination nitride single crystal of
12/17/2014CN104220398A 包含转化磷光体和具有负的热膨胀系数的材料的复合陶瓷 Contains conversion phosphor having a negative coefficient of thermal expansion of the composite ceramic material
12/17/2014CN104218142A 一种直插式led灯珠封装结构 One kind of in-line package structure led lamp beads
12/17/2014CN104218141A 一种倒装led芯片的封装结构 A flip chip package led the
12/17/2014CN104218140A 发光器件封装 Light emitting device package
12/17/2014CN104218139A 一种全新的led封装结构 A new structure led package
12/17/2014CN104218138A 一种wfc0b光源 One kind of light source wfc0b
12/17/2014CN104218137A Led发光基片、led芯片c0b封装结构及采用该结构的led灯 Led light emitting chip, led chip package structure and c0b the structure using led lights
12/17/2014CN104218136A 发光装置 Light-emitting device
12/17/2014CN104218135A 固态发射器封装、多像素发射封装和led显示器 Solid-state transmitter package, launch the package and led multi-pixel display
12/17/2014CN104218134A 一种具有特殊粗化形貌的le：d垂直芯片结构及其制备方法 Le a special roughened morphology: d vertical chip structure and its preparation method
12/17/2014CN104218133A 一种发光二极管芯片及其制造方法 A method of manufacturing a light emitting diode chip and
12/17/2014CN104218132A 一种氮化镓图形衬底的制备方法 A method of preparing a gallium nitride substrate graphics
12/17/2014CN104218131A 制造第iii族氮化物半导体的方法和第iii族氮化物半导体 The method of manufacturing nitride semiconductor iii and iii nitride semiconductor
12/17/2014CN104218130A Led衬底结构及其制作方法 Led substrate structure and fabrication method thereof
12/17/2014CN104218129A Led衬底结构及其制作方法 Led substrate structure and fabrication method thereof
12/17/2014CN104218128A 具有高效率反射结构的发光元件 A high efficiency light-emitting element having a reflective structure
12/17/2014CN104218127A 一种与等离子体激元耦合的高效GaN基LED及其制作方法 GaN-based LED and efficient production method and plasmon coupling
12/17/2014CN104218126A 异质结发光二极管 Heterojunction light emitting diodes
12/17/2014CN104218125A 一种白光le；d的生长方法及利用该生长方法制备的白光led A white le; d of growth methods and the use of white led the growth process for the preparation of
12/17/2014CN104218124A Led芯片的制备方法和led芯片 Led chips prepared and led chip
12/17/2014CN104218033A 一种高s/p值led发光体 A high-s / p values ​​led emitters
12/17/2014CN104217958A 一种用于提高GaN外延层高电阻特性的预处理方法 A GaN epitaxial storey pretreatment method for improving the resistance characteristic
12/17/2014CN104217927A 多层绝缘薄膜的图形化方法及芯片的多层绝缘薄膜 Multi-layer insulation film multilayered insulating film patterning method and chips
12/17/2014CN104212459A 一种具有石榴石结构的黄橙光荧光粉及其制备方法 Yellow-orange light phosphor and preparation method has the garnet structure
12/17/2014CN104212458A 一种具有石榴石结构的红橙光荧光粉及其制备方法 A red-orange fluorescent light garnet structure and preparation method has
12/17/2014CN104212457A 一种氟硼硅酸盐基红色荧光粉、制备方法及其应用 Borosilicate a fluoropolymer-based red phosphor, preparation method and application
12/17/2014CN104212455A 一种Ce3+激活的石榴石结构荧光粉及其制备方法 One kind of Ce3 + phosphor activated garnet structure and its preparation method
12/17/2014CN104212451A 发光薄膜、制备方法及其应用 Luminescent film, preparation method and application
12/17/2014CN104212408A 一种苯基系高折射率led灌装胶及其制备方法 One kind of high-refractive-phenyl-led filling glue line and its preparation method
12/17/2014CN104212399A 用于半导体芯片封装的低模量非导电胶 Low modulus non-conductive adhesive for a semiconductor chip package
12/17/2014CN104212185A 一种稳定不渗油型电子元器件用透明硅凝胶 A stable electronic components with no oil leakage transparent silicone gel
12/17/2014CN104212049A 一种热缩管和制备方法以及在led灯丝封装上的应用 A heat-shrinkable tube and preparation method and its application in the filament led package
12/17/2014CN104210064A 一种led模压封胶装置及其封胶方法 A molded rubber sealing device and method led sealant
12/17/2014CN103589429B 钒酸盐荧光材料与白光发光装置 Vanadate fluorescent material with white light emitting devices
12/17/2014CN103387810B 一种双组份有机硅灌封胶 A two component silicone encapsulants
12/17/2014CN103254900B 荧光体及其发光装置 Phosphor and light emitting device
12/17/2014CN103087351B 一种含环氧基的线型硅烷偶联剂及其制备方法 Linear silane coupling agent and its preparation method epoxy-containing
12/17/2014CN102945902B 一种光子晶体结构的发光二极管及其应用 A light emitting diode and a photonic crystal structure Applications
12/17/2014CN102785932B 一种全自动固晶机的上料机构 One kind of the feeding mechanism of automatic Bonder
12/17/2014CN102782050B 固化性组合物、固化物和固化性组合物的使用方法 Use curable composition, cured product of the curable composition and
12/17/2014CN102770506B e型赛隆荧光体、其用途以及e型赛隆荧光体的制造方法 e-type sialon phosphor manufacturing method, its use as well as e-SiAlON phosphor
12/17/2014CN102766455B 一种氮化物荧光粉及其制备方法 A nitride phosphor and its preparation method
12/17/2014CN102751399B 采用金属基片制备垂直GaN基LED芯片的设备 Metal substrate preparing vertical GaN-based LED chip device
12/17/2014CN102738325B 金属基片垂直GaN基LED芯片及其制备方法 Metal substrate vertical GaN-based LED chip and its preparation method
12/17/2014CN102709419B 一种具有交叉光栅结构的发光二极管及其制备方法 A light emitting diode having a grating structure and preparation method of the cross
12/17/2014CN102664220B Led晶片的切割方法和该方法所用保护片 Led wafer cutting method and the method used in the protective sheet
12/17/2014CN102637813B Led封装结构及使用该封装结构的led灯 Led package structure and the use of the package structure led lights
12/17/2014CN102623591B 基于量子点和量子阱材料混合结构的超辐射发光管 Superluminescent diodes based on quantum dots and quantum well material hybrid structure
12/17/2014CN102610724B 一种基于CdZnO薄膜的电致发光器件及制备方法 An electrical CdZnO film electroluminescent devices based and preparation methods
12/17/2014CN102598869B 点亮装置及使用该装置的前照灯点亮装置、前照灯和车辆 The lighting device and the device using the headlamp lighting device, and a vehicle headlamp
12/17/2014CN102569551B 具蚀刻停止层的磊晶结构及其制造方法 Epitaxial structure with an etch stop layer and its manufacturing method
12/17/2014CN102559185B 具有氧磷灰石结构的黄光荧光材料、制备方法与其白光二极管装置 Yellow fluorescent material having oxygen apatite structure, its white-light LED device production method
12/17/2014CN102549785B 发光装置 Light-emitting device
12/17/2014CN102522474B Led模组的生产方法及led模组 Led module production methods and led module
12/17/2014CN102473802B 包括金属-电介质-金属结构的发光二极管 Including metal - dielectric - metal structures emitting diodes
12/17/2014CN102217090B 光再利用薄片、太阳能电池模块及光源模块 Light reuse sheet, a solar battery module and light source module
12/17/2014CN102216421B 制备P-SiAlON磷光体的方法 The method for preparing P-SiAlON phosphor
12/17/2014CN102194932B 发光器件及其制造方法 The light emitting device and manufacturing method thereof
12/17/2014CN102153863B 用于封装光学半导体元件和光学半导体器件的树脂组合物 The resin composition for encapsulating optical semiconductor elements and optical semiconductor devices
12/17/2014CN101939854B 具有高效率荧光结构的光发射器件 A light emitting device having a high efficiency of the phosphor structure
12/17/2014CN101859756B 交流式覆晶发光二极管结构及其制造方法 AC-type flip-chip light emitting diode structure and its manufacturing method
12/16/2014US8912718 Light emitting device with a plurality of circuits connected in parallel
12/16/2014US8912717 Illumination device including phosphor element and optical system
12/16/2014US8912642 Packaging substrate and fabrication method thereof
12/16/2014US8912640 Semiconductor device and method of manufacturing the same
12/16/2014US8912619 Ultra-violet light sensing device and manufacturing method thereof
12/16/2014US8912583 Top gate thin-film transistor, display device, and electronic apparatus
12/16/2014US8912565 Light emitting diode and method for manufacturing the same
12/16/2014US8912564 Light-emitting device
12/16/2014US8912563 Nitride semiconductor light-emitting device
12/16/2014US8912562 Remote phosphor LED constructions
12/16/2014US8912560 Light emitting device package
12/16/2014US8912559 Group III nitride semiconductor light-emitting device
12/16/2014US8912558 Light emitting diode package
12/16/2014US8912557 Light emitting diode having N-face GaN with roughened surface
12/16/2014US8912556 Light emitting device and method of manufacturing the same
12/16/2014US8912555 Semiconductor light-emitting device
12/16/2014US8912554 Long wavelength light emitting device with photoluminescence emission and high quantum efficiency
12/16/2014US8912551 Substrate assembly for crystal growth and fabricating method for light emitting device using the same
12/16/2014US8912547 Light-emitting device, display device, and semiconductor device
12/16/2014US8912539 Array substrate and method of fabricating the same
12/16/2014US8912527 Multi-quantum well structure and light emitting diode having the same
12/16/2014US8912302 Curable silicone composition for sealing an optical semiconductor element, method of producing a resin-sealed optical semiconductor element, and resin-sealed optical semiconductor element
12/16/2014US8912079 Compound semiconductor deposition method and apparatus
12/16/2014US8912049 PEC biasing technique for LEDs
12/16/2014US8912033 Dicing-free LED fabrication
12/16/2014US8912029 Manufacturing process of vertical type solid state light emitting device
12/16/2014US8912028 Semiconductor light emitting device and method for manufacturing the same
12/16/2014US8912027 Display device and method of manufacturing the same
12/16/2014US8912025 Method for manufacture of bright GaN LEDs using a selective removal process
12/16/2014US8912024 Front facing piggyback wafer assembly
12/16/2014US8912023 Method and system for forming LED light emitters
12/16/2014US8912022 Methods for making light emitting diodes and optical elements
12/16/2014US8912021 System and method for fabricating light emitting diode (LED) dice with wavelength conversion layers
12/16/2014US8912020 Integrating active matrix inorganic light emitting diodes for display devices
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