| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 12/24/2014 | CN104241473A 一种氮化镓基led外延片的生长方法 A gallium nitride-based epitaxial wafers led growth method |
| 12/24/2014 | CN104241472A 一种能减低位错密度的led芯片生长方法 One kind can reduce the dislocation density chip led growth method |
| 12/24/2014 | CN104241471A 一种垂直结构的led芯片及其制造方法 Led chip and its manufacturing method of a vertical structure |
| 12/24/2014 | CN104241470A 一种led芯片 One kind of led chip |
| 12/24/2014 | CN104241469A 发光器件及照明系统 Light-emitting devices and lighting systems |
| 12/24/2014 | CN104241468A 一种高外量子效率GaN基LED外延片及其制作方法 Of a high external quantum efficiency of GaN-based LED epitaxial wafer and manufacturing method thereof |
| 12/24/2014 | CN104241467A 发光器件以及照明系统 The light emitting device and a lighting system |
| 12/24/2014 | CN104241466A Led基板的转接结构、pcb转接层的设计方法及led显示屏 Led substrate transfer structure, transfer layer pcb design methods and led display |
| 12/24/2014 | CN104241465A 一种纳米粗化复合图形化的蓝宝石衬底及制备方法 A nanocomposite graphical sapphire substrate and roughening preparation |
| 12/24/2014 | CN104241464A 一种提高p型氮化镓掺杂浓度的外延生长方法 A method for increasing the doping concentration of p-type gallium nitride epitaxial growth methods |
| 12/24/2014 | CN104241463A 一种发光二极管外延片生长方法 A light emitting diode epitaxial wafer growth method |
| 12/24/2014 | CN104241462A 一种利用纳米压痕提高发光二极管光提取效率的方法 A use of nanoindentation improve light extraction efficiency light-emitting diode method |
| 12/24/2014 | CN104241461A 一种led封装模块制作方法及其产品 One kind of led package module production methods and products |
| 12/24/2014 | CN104241460A 光学组件 Optical Components |
| 12/24/2014 | CN104241459A 发光器件及发光器件封装件 The light emitting device and a light emitting device package |
| 12/24/2014 | CN104241458A 一种垒宽可变的氮化镓基led外延片的制备方法 A broad base of gallium nitride-based variable led wafer preparation |
| 12/24/2014 | CN104241457A 一种精确控制涂覆面积的荧光粉涂覆方法 A precise control of the coated phosphor coating method area |
| 12/24/2014 | CN104241456A 金属基板和led芯片的接合方法 The method of joining metal substrate and led chip |
| 12/24/2014 | CN104241455A Led芯片及其制造方法 Led chip and its manufacturing method |
| 12/24/2014 | CN104241261A 一种led封装结构及方法 An encapsulation structure and method led |
| 12/24/2014 | CN104241205A 一种衬底可剥离的外延结构及其应用 A substrate can be stripped of epitaxial structure and its application |
| 12/24/2014 | CN104232093A 一种氟硅酸盐红色荧光粉及制备方法 One kind of red phosphor fluorosilicate and preparation methods |
| 12/24/2014 | CN104232082A 红色荧光体、白色光源、发光装置和红色荧光体形成方法 Red phosphor, a white light source, the light emitting device and a method for forming the red phosphor |
| 12/24/2014 | CN104232081A 一种光转换功能材料及其制备方法和应用 A light conversion material and its preparation method and application |
| 12/24/2014 | CN104232080A 一种白光led用单一基质全色荧光粉材料及其制备方法 One kind of white led matrix with a single full-color phosphor material and method |
| 12/24/2014 | CN104232009A 一种乙烯基mq树脂改性有机硅封装胶及制备方法和应用 Mq of a vinyl resin-modified silicone plastic packaging and preparation method and application |
| 12/24/2014 | CN104232007A 新型高品质led封装材料 New high-quality packaging materials led |
| 12/24/2014 | CN104227547A 蓝宝石基板的加工方法 Processing method of the sapphire substrate |
| 12/24/2014 | CN102888001B 乙烯基苯基硅树脂 Vinyl phenyl silicone |
| 12/24/2014 | CN102875811B 苯基乙烯基mq硅树脂的制备方法 Phenyl vinyl silicone resin prepared mq |
| 12/24/2014 | CN102843823B 照明设备 Lighting |
| 12/24/2014 | CN102810608B 高光取出率发光二极管,及其制作方法 High light extraction rate of light-emitting diodes, and its production method |
| 12/24/2014 | CN102792533B 氮化物系半导体发光元件 Nitride-based semiconductor light-emitting element |
| 12/24/2014 | CN102790071B 一种单面电极结构的AlGaInP-LED集成微显示器件 AlGaInP-LED a single electrode structure integrated micro display |
| 12/24/2014 | CN102779927B 白光led及其封装方法 White led and packaging method |
| 12/24/2014 | CN102738359B 发光二极管封装体 Light-emitting diode package |
| 12/24/2014 | CN102709443B Led封装及其封装方法 Led packaging and packaging method |
| 12/24/2014 | CN102694108B 一种大功率led封装结构 One kind of high-power led package structure |
| 12/24/2014 | CN102639926B 照明装置和显示装置 Illumination device and a display device |
| 12/24/2014 | CN102629657B 一种拉夹式薄片led贴片结构及其贴片方法 Pull one kind of clip-thin SMD led structure and placement method |
| 12/24/2014 | CN102629656B 一种具有高散热效果的led封接结构及其封接方法 A high cooling effect led sealing structure and sealing method |
| 12/24/2014 | CN102623587B Led芯片的制造方法 Led chip manufacturing method |
| 12/24/2014 | CN102610709B 封装载板及其制作方法 Package carrier and its production method |
| 12/24/2014 | CN102593317B 一种高功率高亮度led光源封装结构及其封装方法 A high-power, high brightness led light package and packaging method |
| 12/24/2014 | CN102593280B 一种led表面图案化方法 A surface patterning method led |
| 12/24/2014 | CN102569025B 磊晶基板、使用该磊晶基板之半导体发光元件及其制程 Epitaxial substrates using semiconductor light emitting device and method of fabricating the epitaxial substrate |
| 12/24/2014 | CN102468318B 一种高压直流发光二极管芯片结构及其制造方法 A high voltage DC LED chip structure and manufacturing method |
| 12/24/2014 | CN102437275B 一种半导体发光器件 A semiconductor light emitting device |
| 12/24/2014 | CN102169938B 发光器件、发光器件封装以及照明系统 A light emitting device, a light emitting device package and a lighting system |
| 12/24/2014 | CN102157506B 发光装置 Light-emitting device |
| 12/24/2014 | CN102106008B 光电子半导体芯片 Optoelectronic semiconductor chip |
| 12/24/2014 | CN101689593B 半导体发光器件及其制造方法 Semiconductor light emitting device and manufacturing method thereof |
| 12/23/2014 | US8917365 Method of manufacturing TFT-LCD array substrate |
| 12/23/2014 | US8917011 LED heat dissipation structure |
| 12/23/2014 | US8917010 Lighting device including phosphor layer and light-transmitting layer that is arranged in contact with the phosphor layer to release static charge to substrate |
| 12/23/2014 | US8916944 Stress-sensitive micro-electromechanical device and use thereof |
| 12/23/2014 | US8916906 Boron-containing buffer layer for growing gallium nitride on silicon |
| 12/23/2014 | US8916904 Semiconductor light emitting element, method for producing semiconductor light emitting element and light emitting device |
| 12/23/2014 | US8916903 Light emitting device |
| 12/23/2014 | US8916902 LED module packaging structure with an IC chip |
| 12/23/2014 | US8916901 Semiconductor light emitting device and method for manufacturing the same |
| 12/23/2014 | US8916900 Optoelectronic module and method of producing an optoelectronic module |
| 12/23/2014 | US8916899 Light emitting apparatus and lighting system |
| 12/23/2014 | US8916898 Wafer level LED package and method of fabricating the same |
| 12/23/2014 | US8916897 Light-emitting element, light-emitting device, display device, electronic device, and lighting device |
| 12/23/2014 | US8916896 Light emitter components and methods having improved performance |
| 12/23/2014 | US8916895 Infrared light-emitting diode and touch screen |
| 12/23/2014 | US8916894 Light-reflective anisotropic conductive adhesive agent, and light emitting device |
| 12/23/2014 | US8916893 Light-emitting device |
| 12/23/2014 | US8916892 Light-scattering substrate, method of manufacturing the same, organic light-emitting display device including the same, and method of manufacturing the organic light-emitting display device |
| 12/23/2014 | US8916891 Light emitting device, light emitting device package, method of manufacturing light emitting device, and lighting system |
| 12/23/2014 | US8916890 Light emitting diodes with light filters |
| 12/23/2014 | US8916889 Light emitting device |
| 12/23/2014 | US8916888 LED component by integrating epitaxial structure and package substrate together and method of manufacturing the same |
| 12/23/2014 | US8916887 Light emitting device package and lighting system using the same |
| 12/23/2014 | US8916886 Optoelectronic semiconductor component |
| 12/23/2014 | US8916885 Semiconductor device with efficient carrier recombination |
| 12/23/2014 | US8916884 Light-emitting device |
| 12/23/2014 | US8916883 Light emitting device and method for fabricating the same |
| 12/23/2014 | US8916858 Display device |
| 12/23/2014 | US8916856 Display apparatus |
| 12/23/2014 | US8916850 Light-emitting element and method for manufacturing same |
| 12/23/2014 | US8916671 Silicone resin |
| 12/23/2014 | US8916654 Curable composition |
| 12/23/2014 | US8916653 Curable composition |
| 12/23/2014 | US8916458 III-nitride quantum well structure, a method for producing the same, and a light-emitting unit using the same |
| 12/23/2014 | US8916457 In situ synthesis of nanoparticles on substrates by inkjet printing |
| 12/23/2014 | US8916456 Group III-V substrate material with particular crystallographic features |
| 12/23/2014 | US8916405 Light emitting diode (LED) using carbon materials |
| 12/23/2014 | US8916404 E-paper array substrate with storage capacitor electrode and manufacturing method thereof |
| 12/23/2014 | US8916403 Method for producing a plurality of optoelectronic semiconductor chips |
| 12/23/2014 | US8916402 Semiconductor light emitting device including substrate having protection layers providing protection against chemicals and method for manufacturing the same |
| 12/23/2014 | US8916401 Method for fabricating semiconductor light emitting device |
| 12/23/2014 | US8916400 Manufacturing method for an LED comprising a nitrided AlN reflecting layer |
| 12/23/2014 | US8916398 Encapsulated structure of light-emitting device, encapsulating process thereof and display device comprising encapsulated structure |
| 12/23/2014 | US8916397 Method for producing an electronic component and electronic component |
| 12/23/2014 | US8916396 Method of manufacturing semiconductor element |
| 12/23/2014 | US8916064 Functionalized matrices for dispersion of nanostructures |
| 12/23/2014 | US8916032 Light emitting diode vacuum coating by magnetized mask |
| 12/23/2014 | US8915620 Illumination system for use in a stereolithography apparatus |