Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
12/2014
12/25/2014US20140374698 Light emitting diode chip and method for manufacturing same
12/25/2014US20140373898 Optical systems fabricated by printing-based assembly
12/24/2014CN204045634U 导电导热良好的倒装led芯片、及其led器件 Good thermal conductivity flip chip led, and led devices
12/24/2014CN204045633U 发光二极管板上芯片封装结构 A light emitting diode chip on board packaging structure
12/24/2014CN204045632U 双面邦定led的镜面铝基结构 Double-sided mirror aluminum bonding structure led
12/24/2014CN204045631U 一种倒装芯片led灯丝模组 A flip-chip module led filament
12/24/2014CN204045630U 一种发光二极管 A light emitting diode
12/24/2014CN204045629U 发光装置及照明装置 Light emitting device and a lighting device
12/24/2014CN204045628U 一种多碗杯结构的贴片led光源 SMD led light structure of a multi-cups
12/24/2014CN204045627U 一种改进结构的led支架 Led to an improved support structure
12/24/2014CN204045626U 多族阵列的发光二极管板上芯片封装结构 Light-emitting diode chip on board package multi-ethnic array
12/24/2014CN204045625U 贴片式高光效led光源 High-efficiency SMD led light
12/24/2014CN204045624U 可过回流焊的led高温透镜灯珠 Had led to a high temperature reflow lens lamp beads
12/24/2014CN204045623U 一种改善led灯管光斑的高光效cob柔性灯条 An improved lamp led cob spot high efficiency flexible light strip
12/24/2014CN204045622U Led 封装器件 Led packaged devices
12/24/2014CN204045621U 一种蓝宝石衬底芯片光源结构 One kind of light sapphire chip architecture
12/24/2014CN204045620U 高光效高性能的led High light efficiency performance led
12/24/2014CN204045619U 一种新型led灯 A new led lights
12/24/2014CN204045618U 一种倒装led芯片封装元器件 Led a flip chip package components
12/24/2014CN204045617U 具有高空穴浓度的P-GaN蓝光LED外延结构 P-GaN blue LED epitaxial structure with a high hole concentration
12/24/2014CN204045616U 一种倒装蓝宝石衬底发光二极管结构 A flip sapphire substrate the light emitting diode structure
12/24/2014CN204045615U 一种蓝宝石绝缘层上覆硅衬底 One kind of sapphire substrate coated silicon insulation
12/24/2014CN204045614U 生长在蓝宝石衬底上的高均匀性GaN薄膜 Grown on a sapphire substrate a GaN thin film of high uniformity
12/24/2014CN204045592U 一种红蓝双色发光二极管 One kind of red and blue color light-emitting diodes
12/24/2014CN204045591U 一种可增强发光效果的多彩灯珠 One kind can enhance the multi-colored lights glow beads
12/24/2014CN204045590U 一种侧入式大尺寸背光灯珠 A lateral-in large-size backlight lamp beads
12/24/2014CN204045589U 一种led-cob光源 One kind of led-cob light
12/24/2014CN204045588U 一种带端子的高导热cob模组光源 High thermal conductivity of a cob light module with terminal
12/24/2014CN204045587U 一种全角度发光封装模块 An all-angle light emitting package module
12/24/2014CN204045586U 一种超薄型高导热透明玻璃基板全周发光led灯丝模组 An ultra-thin transparent glass substrate with high thermal conductivity type full Zhoufa Guang led filament module
12/24/2014CN204045585U 一种新型led照明装置 A new led lighting device
12/24/2014CN204045584U 一种led cob光源 One kind of led cob light
12/24/2014CN204045583U 一种led发光条 One kind of led light bar
12/24/2014CN204045408U 一种散装电容、led成型机 One kind of bulk capacitance, led molding machine
12/24/2014CN204042628U Led照明器具 Led Lighting
12/24/2014CN204042478U 发光装置和使用该发光装置的照明设备 Light-emitting device and lighting equipment using the light-emitting device
12/24/2014CN204036735U 按压装置 Pressing device
12/24/2014CN104247176A 半导体发光元件 Semiconductor light emitting element
12/24/2014CN104247157A 中继连接器和具备该中继连接器的光源模块 A relay connector and the relay connector includes a light source module
12/24/2014CN104247061A 陶瓷基发光二极管(led)装置、组件和方法 Ceramic-based light emitting diode (led) devices, components and methods
12/24/2014CN104247060A 发光器件、具有改进的化学耐性的部件以及相关方法 Light emitting device having improved chemical resistance member and associated methods
12/24/2014CN104247059A 发光封装 Emitting package
12/24/2014CN104247058A 用于在远程波长转换中实施色彩一致性的方法及设备 Color consistency for the method of the remote device and the wavelength conversion
12/24/2014CN104247057A 发光器件封装 Light emitting device package
12/24/2014CN104247056A 基于子贴装件的表面贴装器件(smd)发光组件及方法 Based on the sub-surface mount devices mounted pieces (smd) lighting assembly and method
12/24/2014CN104247055A 具有优良化学耐性的发光器件和元件及相关的方法 The light emitting device and the element has excellent chemical resistance and associated methods
12/24/2014CN104247054A 具有纳米结构和纳米金属光学腔和天线的发光二极管,快光子-电子源和光电探测器,以及其制造方法 And nano-metal having a nanostructure optical cavity light emitting diode and the antenna, fast photon - electron source and a photodetector, and a manufacturing method thereof
12/24/2014CN104247053A 半导体发光元件、半导体发光元件的制造方法、半导体发光装置及基板 The semiconductor light emitting device, method of manufacturing a semiconductor light emitting element, a semiconductor light emitting device and substrate
12/24/2014CN104247052A 具有减少导光效果的低折射率材料层的发光二极管 Reducing the effect of the light guide having a low refractive index material layer is a light emitting diode
12/24/2014CN104247051A 发光二极管 Led
12/24/2014CN104246995A 具有对准机构的光学装置 Optical device having an alignment mechanism
12/24/2014CN104246990A 具有凹凸结构的晶体衬底的制造方法 A process for production of concavo-convex structure of the crystal substrate
12/24/2014CN104246980A 用于led制造的pvd缓冲层 Pvd buffer layer led to the manufacture of
12/24/2014CN104246364A 光源基板单元 Light source base unit
12/24/2014CN104245883A 荧光体及其制造方法以及发光装置 Phosphor and a light emitting device and manufacturing method thereof
12/24/2014CN104245882A 硅氧氮化物荧光体及其制备方法以及包括该荧光体的光学器件 Silicon oxynitride phosphor and a preparation method and an optical device comprising the phosphor
12/24/2014CN104245881A 光转换用陶瓷复合体及使用其的发光装置 Ceramic composite for light conversion and a light emitting device using thereof
12/24/2014CN104245849A 固化性组合物、固化物和固化性组合物的使用方法 Use curable composition, cured product of the curable composition and
12/24/2014CN104245797A 包含树脂-线性有机硅氧烷嵌段共聚物和有机聚硅氧烷的组合物 The composition of linear organosiloxane block copolymer and an organic polysiloxane - containing resin
12/24/2014CN104244581A 多层电路的高导热装置 High thermal conductivity of a multilayer circuit means
12/24/2014CN104241513A 一种大功率led多孔相变热沉结构 One kind of power led the porous structure of the phase change heat sink
12/24/2014CN104241512A 发光装置 Light-emitting device
12/24/2014CN104241511A 一种高亮度倒装紫外led芯片制备方法 A high-brightness led chip flip-UV preparation
12/24/2014CN104241510A 发光装置 Light-emitting device
12/24/2014CN104241509A 电光装置、电光装置的制造方法以及电子设备 Electro-optical device, a method of manufacturing an electro-optical device and an electronic device
12/24/2014CN104241508A 一种白光led芯片及制备方法 One kind of white led chip and preparation method
12/24/2014CN104241507A 广色域led发光器件及其背光组件 Wide color gamut led light emitting device and backlight assembly
12/24/2014CN104241506A 一种发光二极管器件及光源模组及光源模块 A light-emitting diode device and light source module and the light source module
12/24/2014CN104241505A 一种表面激发的led灯 A surface excitation led lights
12/24/2014CN104241504A 一种基于荧光粉转换的高显色性白光led的制造方法 A method for producing phosphor conversion of high color rendering white led Based
12/24/2014CN104241503A 一种led smd支架防潮结构设计方法 One kind of led smd stent design method of proof
12/24/2014CN104241502A 一种led封装结构 One kind of led package
12/24/2014CN104241501A 全向植物生长灯led灯丝及其制造方法 Filament and method of manufacturing the whole led to Grow Light
12/24/2014CN104241500A 发光二极管封装结构和显示装置 Light emitting diode package structure and a display device
12/24/2014CN104241499A 一种倒装芯片塑封结构及制造方法 A flip-chip structure and method for manufacturing plastic
12/24/2014CN104241498A 一种新型led封装结构 A new structure led package
12/24/2014CN104241497A 一种新型高光效,高可靠性,高散热效率白光led制作方法 A new high-efficiency, high reliability, high thermal efficiency white led production methods
12/24/2014CN104241496A Led用的金属基板 Led by the metal substrate
12/24/2014CN104241495A 一种可以全面发光的led及其制造工艺 A way to fully illuminated led its manufacturing process
12/24/2014CN104241494A 可调节低色温高显色性大功率白光led新方法 Adjustable low color temperature high power white color led new approach
12/24/2014CN104241493A 发光器件和发光器件封装 The light emitting device and a light emitting device package
12/24/2014CN104241492A 具有金属介质组合光栅结构的led芯片 Media combination has led chip metal grating structure
12/24/2014CN104241491A 发光元件及其制造方法 The light emitting device and manufacturing method
12/24/2014CN104241490A 一种led芯片 One kind of led chip
12/24/2014CN104241489A 全覆盖式扩展电极结构的发光二极管及其制造方法 Full overlay extension method of manufacturing a light emitting diode and an electrode structure
12/24/2014CN104241488A 发光二极管 Led
12/24/2014CN104241487A 发光器件和包括发光器件的照明设备 Light-emitting devices and lighting equipment, including light-emitting devices
12/24/2014CN104241486A 半导体发光器件及其制造方法 Semiconductor light emitting device and manufacturing method thereof
12/24/2014CN104241485A 发光器件、发光器件制造方法、发光器件封装和照明系统 A light emitting device, the light emitting device manufacturing method, a light emitting device package and a lighting system
12/24/2014CN104241484A 发光器件、发光器件制造方法、发光器件封装和照明系统 A light emitting device, the light emitting device manufacturing method, a light emitting device package and a lighting system
12/24/2014CN104241483A 发光器件 Light-emitting devices
12/24/2014CN104241482A 一种具有ito纳米柱网状薄膜的led管芯及其制备方法 Led die and its preparation method has a mesh film ito nanopillar
12/24/2014CN104241481A 发光器件和照明系统 Light emitting devices and lighting systems
12/24/2014CN104241480A 一种大功率红外发光二极管制作方法 An infrared light-emitting diode power production methods
12/24/2014CN104241479A 一种基于硅基图形化衬底的复合缓冲层led芯片 Patterned silicon substrate based composite buffer layer led chip
12/24/2014CN104241478A Led衬底结构及其制作方法 Led substrate structure and fabrication method thereof
12/24/2014CN104241477A 带有金属化侧墙的半导体发光器件 The semiconductor light emitting device with a metalized sidewall spacer
12/24/2014CN104241476A 发光装置及其制造方法 A light emitting device and manufacturing method thereof
12/24/2014CN104241475A 发光二极管芯片及其制备方法 Light-emitting diode chip and its preparation method
12/24/2014CN104241474A 发光器件和照明系统 Light emitting devices and lighting systems
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