Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2012
09/13/2012US20120228676 CHANNEL SURFACE TECHNIQUE FOR FABRICATION OF FinFET DEVICES
09/13/2012US20120228673 Field-effect transistor, semiconductor wafer, method for producing field-effect transistor and method for producing semiconductor wafer
09/13/2012US20120228672 Method for forming a ge on iii/v-on-insulator structure
09/13/2012US20120228671 Strained ge-on-insulator structure and method for forming the same
09/13/2012US20120228669 High-yield fabrication of large-format substrates with distributed, independent control elements
09/13/2012US20120228660 Method of manufacturing lead frame for light-emitting device package and light-emitting device package
09/13/2012US20120228643 Light emitting apparatus and method for manufacturing the same
09/13/2012US20120228640 Semiconductor device and method for manufacturing same
09/13/2012US20120228638 Methods of Fabricating Silicon Carbide Devices Having Smooth Channels and Related Devices
09/13/2012US20120228637 Semiconductor device and method of manufacturing the same
09/13/2012US20120228630 Semiconductor device and method for fabricating the same
09/13/2012US20120228629 Thyristors, Methods of Programming Thyristors, and Methods of Forming Thyristors
09/13/2012US20120228628 Semiconductor device and method of fabricating the same
09/13/2012US20120228627 Method for producing compound semiconductor crystal, method for producing electronic device, and semiconductor wafer
09/13/2012US20120228626 Semiconductor device and its fabrication method
09/13/2012US20120228621 Method for manufacturing semiconductor device, semiconductor device, and display device
09/13/2012US20120228614 Semiconductor device and manufacturing method thereof
09/13/2012US20120228613 Method of manufacturing semiconductor wafer, and composite base and composite substrate for use in that method
09/13/2012US20120228611 Bipolar junction transistor with a self-aligned emitter and base
09/13/2012US20120228609 Test circuit for testing signal receiving unit, image pickup apparatus, method of testing signal receiving unit, and method of testing image pickup apparatus
09/13/2012US20120228606 Semiconductor device and manufacturing method thereof
09/13/2012US20120228605 Semiconductor device and method for manufacturing the same
09/13/2012US20120228604 Thin film transistor array panel and manufacturing method thereof
09/13/2012US20120228579 3d polysilicon diode with low contact resistance and method for forming same
09/13/2012US20120228578 Resistive Memory Element and Related Control Method
09/13/2012US20120228576 Storage device and method of manufacturing the same
09/13/2012US20120228575 Nanoscale electronic device with barrier layers
09/13/2012US20120228573 Memory Cell Constructions, and Methods for Fabricating Memory Cell Constructions
09/13/2012US20120228473 Solid-state imaging device, method of manufacturing solid-state imaging device, and imaging apparatus
09/13/2012US20120228143 Method for Electrochemical Fabrication
09/13/2012US20120227955 Substrate temperature control method and plasma processing apparatus
09/13/2012US20120227904 Cylinder cabinet and semiconductor manufacturing system
09/13/2012US20120227886 Substrate Assembly Carrier Using Electrostatic Force
09/13/2012US20120227811 Electrochemical method of producing copper indium gallium diselenide (cigs) solar cells
09/13/2012US20120227810 Solar cell structures, photovoltaic panels and corresponding processes
09/13/2012US20120227800 Biologically Self-Assembled Nanotubes
09/13/2012US20120227331 Abrasive, method of polishing target member and process for producing semiconductor device
09/13/2012US20120227229 Surface Mount Multi-Layer Electrical Circuit Protection Device with Active Element Between PPTC Layers
09/13/2012DE112010004534T5 Transistor mit body-kontakt und verringerter parasitärer kapazität Transistor with body-contact and reduced parasitic capacitance
09/13/2012DE112010004347T5 Tunnelübergangs-Durchkontaktierung Tunnel junction via hole
09/13/2012DE112010004154T5 Verfahren zum Herstellen einer Halbleiter-Dünnschicht und einerphotovoltaischen Einheit, welche die Dünnschicht enthält A method of fabricating a semiconductor thin film and einerphotovoltaischen unit including the thin-film
09/13/2012DE112010003566T5 Vorrichtung und Verfahren zum Bedrucken einer Folie mittels einer geprägten Musterfolie Apparatus and method for printing on a film by means of an embossed pattern sheet
09/13/2012DE112009005104T5 Prozess-, Spannungs- und Temperatursensor Process, voltage and temperature sensor
09/13/2012DE112009003565T5 Grabenbasierte leistungshalbleitervorrichtungen mit eigenschaften einer erhöhten durchbruchspannung Grave-based power semiconductor devices with properties increased by breakdown voltage
09/13/2012DE102012202643A1 Hohlraumstrukturen für mems-bauelemente Cavity structures for mems devices
09/13/2012DE102011056642A1 Dampfabscheidungsvorrichtung und Verfahren zur kontinuierlichen Abscheidung einer dotierten Dünnfilmschicht auf einem Substrat Vapor deposition apparatus and process for the continuous deposition of a doped thin film layer on a substrate
09/13/2012DE102011016566A1 Leiterrahmen für optoelektronische Bauelemente und Verfahren zur Herstellung optoelektronischer Bauelemente Lead frame for optoelectronic devices and methods for producing optoelectronic devices
09/13/2012DE102011013511A1 Disc-shaped magazine for mounting disc-shaped object e.g. semiconductor silicon wafer, has stacking area delimiting boundary structure that inlcudes leaf spring damping elements which are secured to spring at fixed end
09/13/2012DE102011013468A1 Halbleitergehäuse und Verfahren zur Herstellung eines Halbleitergehäuses Semiconductor package and method for manufacturing a semiconductor package
09/13/2012DE102011013375A1 Manufacture of ohmic contact on silicon carbide substrate used in e.g. electronic component, involves thermally treating silicon carbide substrate in non-oxidizing atmosphere, and applying conductive contact material on treated substrate
09/13/2012DE102011013278A1 Housing for receiving optoelectronic functional element e.g. LED for illumination device, has base element with channel in which connector is arranged, where channel is filled with glass in order to connect base element with connector
09/13/2012DE102011013277A1 Gehäuse für Hochleistungsleuchtdioden - "2-Lagen-System" Housing for high power light emitting diodes - "2-layer system"
09/13/2012DE102011013276A1 Housing for electronic component e.g. LED used in lighting device, has glass layer that is arranged between the head section and base, and is made of alkali-titanium silicate glass
09/13/2012DE102011013228A1 Method for manufacturing semiconductor component that is three-dimensionally integrated in semiconductor chip stack, involves selectively removing upper stop layer with respect to lower stop layer
09/13/2012DE102011005322A1 Verfahren zur Herstellung eines Leistungshalbleitersubstrates Method for producing a power semiconductor substrate
09/13/2012DE102010032029B4 Verfahren zum Trennen einer runden Planplatte aus sprödbrüchigem Material in mehrere rechteckige Einzelplatten mittels Laser A method for separating a round flat plate of brittle material into several rectangular individual plates by laser
09/13/2012DE102009025799B4 Verfahren zur Herstellung eines Dünnschichttransistors (TFT) durch Ausnutzung der Unterschiede von Materialien in dem Schwellenwert des Lichtflusses des Lasers A process for producing a thin film transistor (TFT) by making use of differences in materials of the threshold value of the luminous flux of the laser
09/13/2012DE102008048424B4 Elektronikbauelement und Verfahren zu dessen Herstellung An electronics device and process for its preparation
09/13/2012DE102008000261B4 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation
09/13/2012DE102007047857B4 Halbleiteranordnungen und Verfahren zur Herstellung derselben Semiconductor devices and methods of manufacturing the same
09/13/2012DE102007046021B4 Halbleiteranordnung, Halbleitermodul und Verfahren zum Verbinden eines Halbleiterchips mit einem Keramiksubstrat A semiconductor device, semiconductor module and method for connecting a semiconductor chip to a ceramic substrate
09/13/2012DE102007043097B4 Layout-Verfahren für eine Maske Layout method for a mask
09/13/2012DE102007005103B4 Abscheidungsverfahren für ein Dielektrikum mit einem Übergangs-Metall Deposition process for a dielectric with a transition-metal
09/13/2012DE102006015112B4 Halbleitervorrichtung und elektrisches Leistungshalbleiterprodukt Semiconductor device and electric power semiconductor product
09/13/2012CA2829274A1 Formulations of printable aluminium oxide inks
09/13/2012CA2815764A1 Efficient black silicon photovoltaic devices with enhanced blue response
09/12/2012EP2498460A1 Signal transmission circuit device, semiconductor device, method and apparatus for inspecting semiconductor device, signal transmission device, and motor drive apparatus using signal transmission device
09/12/2012EP2498295A1 Method for forming a Ge on III/V-On-Insulator structure
09/12/2012EP2498294A1 Device for controlling electrical conduction across a semiconductor body
09/12/2012EP2498293A1 Epitaxial substrate for semiconductor element, semiconductor element, and method for producing epitaxial substrate for semiconductor element
09/12/2012EP2498290A1 Contact element and power semiconductor module comprising a contact element
09/12/2012EP2498289A2 IGBT power semiconductor package having an electrically conductive clip
09/12/2012EP2498287A2 Method for making vertical interconnections through structured layers
09/12/2012EP2498286A1 Method for treating a semiconductor structure on an insulator
09/12/2012EP2498285A2 Method and apparatus for manufacturing a semiconductor device
09/12/2012EP2498284A2 Method of fabricating a semiconductor package
09/12/2012EP2498283A2 Method for manufacturing a power-semiconductor substrate
09/12/2012EP2498282A1 Epitaxially laminated iii-nitride substrate
09/12/2012EP2498281A2 Methods for fabricating transistors including circular trenches
09/12/2012EP2498280A1 DRAM with trench capacitors and logic back-biased transistors integrated on an SOI substrate comprising an intrinsic semiconductor layer and manufacturing method thereof
09/12/2012EP2498279A1 Method for treating an oxidized metal nitride layer
09/12/2012EP2498278A1 Plasma cvd device and method of manufacturing silicon thin film
09/12/2012EP2498277A1 Chemical vapor deposition device and temperature control method of chemical vapor deposition device
09/12/2012EP2498276A1 Temperature control method of chemical vapor deposition device
09/12/2012EP2498275A2 EUV light source, EUV exposure system, and production method for semiconductor device
09/12/2012EP2498274A1 Method and system for transferring a patterned material
09/12/2012EP2498129A1 Focus test mask, focus measuring method, exposure apparatus, and exposure method
09/12/2012EP2498081A1 Single-position hall effect measurements
09/12/2012EP2498075A2 Semiconductor device, strain gauge, pressure sensor, and method of forming semiconductor device
09/12/2012EP2497849A1 Hybrid silicon wafer
09/12/2012EP2497168A1 Semipolar {20-21} iii-nitride laser diodes with etched mirrors
09/12/2012EP2497117A1 Junction field effect transistor and method of manufacturing the same
09/12/2012EP2497116A1 Power semiconductor devices having selectively doped jfet regions and related methods of forming such devices
09/12/2012EP2497114A2 Semiconductor device
09/12/2012EP2497113A1 Bipolar transistor
09/12/2012EP2497108A1 Junction field effect transistor
09/12/2012EP2497107A1 Mask level reduction for mofet
09/12/2012EP2497106A1 Self-aligned masking for solar cell manufacture
09/12/2012EP2497105A1 Systems and methods for non-periodic pulse partial melt film processing
09/12/2012EP2496540A1 Stabilization of bicycloheptadiene