Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/1990
10/16/1990US4964143 EPROM element employing self-aligning process
10/16/1990US4964080 Three-dimensional memory cell with integral select transistor
10/16/1990US4964078 Combined multiple memories
10/16/1990US4964057 Block placement method
10/16/1990US4963973 Semiconductor device
10/16/1990US4963971 Symmetrical power semiconductor device and method of fabrication
10/16/1990US4963957 Semiconductor device having bipolar transistor with trench
10/16/1990US4963953 Charge transfer device and method for producing such a device
10/16/1990US4963949 Semiconductors
10/16/1990US4963948 Semiconductor device having level shift diode
10/16/1990US4963924 Linewidth loss measurement
10/16/1990US4963825 Method of screening EPROM-related devices for endurance failure
10/16/1990US4963713 Cooling of a plasma electrode system for an etching apparatus
10/16/1990US4963512 Method for forming conductor layers and method for fabricating multilayer substrates
10/16/1990US4963511 Method of reducing tungsten selectivity to a contact sidewall
10/16/1990US4963510 Method and apparatus for providing interconnection between metallization layers on semiconductors devices
10/16/1990US4963509 Heating substrate with gold layer at reduced temperature; removing surface gold; heating at higher temperature; smoothness
10/16/1990US4963508 Method of making an epitaxial gallium arsenide semiconductor wafer using a strained layer superlattice
10/16/1990US4963506 Selective deposition of amorphous and polycrystalline silicon
10/16/1990US4963505 Semiconductor device and method of manufacturing same
10/16/1990US4963504 Method for fabricating double implanted LDD transistor self-aligned with gate
10/16/1990US4963502 Method of making oxide-isolated source/drain transistor
10/16/1990US4963501 Method of fabricating semiconductor devices with sub-micron linewidths
10/16/1990US4963500 Determining contaminants by measuring degradation of carrier lifetime
10/16/1990US4963423 Method for forming a thin film and apparatus of forming a metal thin film utilizing temperature controlling means
10/16/1990US4963389 Method for producing hybrid integrated circuit substrate
10/16/1990US4963233 Glass conditioning for ceramic package plating
10/16/1990US4963225 Depositing conductive material in opening of dielectric layer, depositing second dielectric layer, removing first layer so conductive material projects beyond it
10/16/1990US4963069 Container for the handling of semiconductor devices and process for particle-free transfer
10/16/1990US4963002 Adhesively joining semiconductor chip to substrate
10/16/1990US4962891 Apparatus for removing small particles from a substrate
10/16/1990US4962879 Method for bubble-free bonding of silicon wafers
10/16/1990US4962776 Removing the frozen film and entrapped microparticles, purification
10/16/1990US4962727 Thin film-forming apparatus
10/16/1990US4962726 Chemical vapor deposition reaction apparatus having isolated reaction and buffer chambers
10/16/1990CA1275332C Multilayer contact structure
10/16/1990CA1275331C Recessed semiconductor device
10/16/1990CA1275235C Method of fabricating multilayer structures with nonplanar surfaces
10/13/1990CA2014430A1 Composite including a layer of a iii-v compound and a layer of rare earths, process for its production and its application
10/11/1990DE4008624A1 Mfg. hybrid semiconductor structure - depositing insulating, photo-hardenable adhesive film of surface(s) of support plate substrate
10/10/1990EP0391790A1 Method of manufacturing an electronic module
10/10/1990EP0391709A2 Single silicon crystal sparingly susceptible of stacking fault induced by oxidation and method for production thereof
10/10/1990EP0391708A2 Backside metallization scheme for semiconductor devices
10/10/1990EP0391562A2 Semiconductor devices incorporating a tungsten contact and fabrication thereof
10/10/1990EP0391561A2 Forming wells in semiconductor devices
10/10/1990EP0391483A2 Bipolar transistor and method of manufacturing the same
10/10/1990EP0391480A2 Method of manufacturing a bipolar transistor
10/10/1990EP0391479A2 A method of manufacturing a bipolar transistor
10/10/1990EP0391420A2 Radiation resistant semiconductor structure
10/10/1990EP0391314A2 Method for patterning on a substrate
10/10/1990EP0391248A2 Opto-electrical multiconnector
10/10/1990EP0391200A2 Formation of very heat-stable relief patterns
10/10/1990EP0391163A2 Adherent silicone coating
10/10/1990EP0391123A2 Extended length trench resistor and capacitor
10/10/1990EP0391081A2 Fabrication and structure of semiconductor-on-insulator islands
10/10/1990EP0391056A2 Dielectrically isolated semiconductor device and method
10/10/1990EP0391035A2 Dense fluid photochemical process for substrate treatment
10/10/1990EP0390944A1 Multilayer ceramic substrate and its manufacturing method
10/10/1990EP0390891A1 Method of forming holes in ceramic ic packages.
10/10/1990EP0390871A1 Plasma pinch system and method of using same.
10/10/1990CN2063694U Semiconductor gas phase epitaxial reaction tube
10/10/1990CN1046062A Two square memory cells having highly conductive word lines
10/10/1990CA2014287A1 Photoresist composition
10/09/1990US4962541 Pattern test apparatus
10/09/1990US4962481 EEPROM device with plurality of memory strings made of floating gate transistors connected in series
10/09/1990US4962476 Semiconductor memory device having bit lines less liable to have influences of the adjacent bit lines
10/09/1990US4962441 Isolated electrostatic wafer blade clamp
10/09/1990US4962423 Mark detecting method and apparatus
10/09/1990US4962414 Method for forming a contact VIA
10/09/1990US4962413 Analog switch with minimized noise ascribable to gate capacitance
10/09/1990US4962365 Integrated circuit trench resistor
10/09/1990US4962318 Alignment system for exposure apparatus
10/09/1990US4962294 Method and apparatus for causing an open circuit in a conductive line
10/09/1990US4962065 Annealing process to stabilize PECVD silicon nitride for application as the gate dielectric in MOS devices
10/09/1990US4962064 Method of planarization of topologies in integrated circuit structures
10/09/1990US4962063 Multistep planarized chemical vapor deposition process with the use of low melting inorganic material for flowing while depositing
10/09/1990US4962062 Polishing, grooves, wetting, contacting, heat treatment, polymer or silica dielectric
10/09/1990US4962061 Method for manufacturing a multilayer wiring structure employing metal fillets at step portions
10/09/1990US4962060 Patterned refractory core; sidewall spacers
10/09/1990US4962059 Process for forming electrodes for semiconductor devices using focused ion beam deposition
10/09/1990US4962058 Forming stud-up, stud-down metal structure lines from single layer; masking etching
10/09/1990US4962057 Method of in situ photo induced evaporation enhancement of compound thin films during or after epitaxial growth
10/09/1990US4962056 Method of manufacturing from a semiconductor wafer a dielectric substrate including mutually insulated and separated island regions, and a method of manufacturing semiconductor elements from the dielectric substrate
10/09/1990US4962054 Controlling spacings between drains and barrier electrodes
10/09/1990US4962053 Multilayer; semiconductor well, polycrystalline emitter, and dielectric
10/09/1990US4962052 Method for producing semiconductor integrated circuit device
10/09/1990US4962051 Forming strained semiconductor using isoelectric dopants; oxidation
10/09/1990US4962050 GaAs FET manufacturing process employing channel confining layers
10/09/1990US4962049 Controlled spacing of surface from cathode; confined plasma forms protective oxide coating
10/09/1990US4961984 Copper foil wiring, crystallization, annealing, cooling, elongation, hardness
10/09/1990US4961829 Passivation of semiconductor surfaces
10/09/1990US4961822 Etching channels in oxide layer, then depositing metals in them to form connectors; integrated circuits
10/09/1990US4961821 Ode through holes and butt edges without edge dicing
10/09/1990US4961820 Using plasma from mixed gas containing oxygen, water vapor and additional gas
10/09/1990US4961804 Carrier film with conductive adhesive for dicing of semiconductor wafers and dicing method employing same
10/09/1990US4961633 VLSI optimized modulator
10/09/1990US4961629 Liquid crystal display device
10/09/1990US4961528 Bonding flame spraying aluminum, thermocompression
10/09/1990US4961399 Epitaxial growth reactor provided with a planetary support
10/09/1990CA1274996A1 Composite optical membrane including anti-reflective coating