Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/1990
11/15/1990WO1990013917A1 Floating-gate charge-balance ccd
11/15/1990WO1990013916A1 Method of fabricating semiconductor devices
11/15/1990WO1990013913A1 Method of making a hermetic seal in a solid-state device
11/15/1990WO1990013912A1 Silicon oxide film and semiconductor device having the same
11/15/1990WO1990013911A1 Method of forming oxide film
11/15/1990WO1990013910A1 Method and apparatus for processing materials
11/15/1990WO1990013909A1 Reactive ion etching apparatus
11/15/1990WO1990013908A1 Electrochemical planarization
11/15/1990WO1990013790A1 Positioning table
11/15/1990WO1990013687A2 Apparatus and method for treating flat substrates under reduced pressure
11/15/1990WO1990013443A1 Etchant solution for photoresist-patterned metal layers
11/15/1990DE4014723A1 Semiconductor memory with redundancy circuit - has memory cell field divided into blocks and redundancy circuit spares
11/15/1990DE3943482A1 Workpiece table for handling semiconductor wafers
11/15/1990DE3943478A1 Workpiece table for handling semiconductor wafers
11/15/1990DE3915650A1 Layer structuring - involving mask layer etching under photolacquer layer to obtain reduced structure width
11/15/1990DE3915337A1 Low-ohmic planar contact metallisation prodn. - without spiking or diffusion problems
11/14/1990EP0397530A2 Alignment apparatus
11/14/1990EP0397462A2 Contact structure for semiconductor integrated circuits
11/14/1990EP0397426A2 IC packaging structure and packaging method
11/14/1990EP0397408A1 Reference voltage generator
11/14/1990EP0397320A2 Encapsulated integrated circuit with lead frame
11/14/1990EP0397315A2 Method and apparatus for heating and cooling semiconductor wafers in semiconductor wafer processing equipment
11/14/1990EP0397194A2 Semiconductor memory device having two types of memory cell
11/14/1990EP0397185A1 Permanently antistatic polymeric rigid containers
11/14/1990EP0397161A2 Methods for device transplantation
11/14/1990EP0397148A2 Heterostructure device and production method thereof
11/14/1990EP0397131A2 Method of manufacturing a contact in semiconductor devices
11/14/1990EP0397051A1 Evacuation apparatus and evacuation method
11/14/1990EP0397034A1 SRAM device using an ultra thin polycristalline Si film, and its manufacturing method
11/14/1990EP0397029A2 Carrier for disc shaped workpieces, and vacuum process chamber
11/14/1990EP0397014A2 Aluminium/Boron P-Well
11/14/1990EP0397010A1 High purity epoxy formlations for use as die attach adhesives
11/14/1990EP0396951A1 Supporting and transporting device for a wafer
11/14/1990EP0396948A1 Bi-cmos integrated circuit
11/14/1990EP0396923A1 Elevating platform and conveyance method
11/14/1990EP0396919A2 Plasma Reactor and method for semiconductor processing
11/14/1990EP0396806A1 Glass-ceramic structure and method for making same
11/14/1990EP0396802A1 Method of making an integrated circuit structure having a lateral bipolar transistor
11/14/1990EP0396768A1 Pattern correction method
11/14/1990EP0396707A1 A latch up free, high voltage, cmos process for sub-half-micron devices.
11/14/1990EP0396704A1 Semiconductor light-emitting devices
11/14/1990EP0396663A1 Charge-coupled device.
11/14/1990EP0283481B1 Trimming passive components buried in multilayer structures
11/14/1990CN1010448B Process for mfg. copper thick-film conductor by infrared stove
11/13/1990US4970724 Redundancy and testing techniques for IC wafers
11/13/1990US4970689 Charge amplifying trench memory cell
11/13/1990US4970580 Semiconductor memory device having protruding cell configuration
11/13/1990US4970578 Selective backside plating of GaAs monolithic microwave integrated circuits
11/13/1990US4970577 Semiconductor chip module
11/13/1990US4970574 Gold, tungsten, tungsten-titanium alloy
11/13/1990US4970572 Semiconductor integrated circuit device of multilayer interconnection structure
11/13/1990US4970571 Bump and method of manufacturing the same
11/13/1990US4970570 Use of tapered head pin design to improve the stress distribution in the braze joint
11/13/1990US4970568 Semiconductor device and a process for producing a semiconductor device
11/13/1990US4970565 Sealed charge storage structure
11/13/1990US4970564 Semiconductor memory device having stacked capacitor cells
11/13/1990US4970546 Exposure control device
11/13/1990US4970409 Voltage multiplier for nonvolatile semiconductor memory
11/13/1990US4970369 Electronic device manufacturing methods
11/13/1990US4970368 Laser scribing method
11/13/1990US4970366 Laser patterning apparatus and method
11/13/1990US4970196 Method and apparatus for the thin film deposition of materials with a high power pulsed laser
11/13/1990US4970177 Corrosion resistant wiring
11/13/1990US4970176 Low and higher temperature, melt flow
11/13/1990US4970175 Method of manufacturing a semiconductor device using SEG and a transitory substrate
11/13/1990US4970174 Method for making a BiCMOS semiconductor device
11/13/1990US4970173 Method of making high voltage vertical field effect transistor with improved safe operating area
11/13/1990US4970107 Composite article comprising a copper element and a process for producing it
11/13/1990US4970106 Thin film multilayer laminate interconnection board
11/13/1990US4970099 Perfluoropolymer coated pellicles
11/13/1990US4969828 Electrical socket for TAB IC's
11/13/1990US4969823 Doping
11/13/1990US4969790 Apparatus on the carousel principle for the coating of substrates
11/13/1990US4969748 Apparatus and method for compensating for errors in temperature measurement of semiconductor wafers during rapid thermal processing
11/13/1990US4969556 Vacuum container
11/13/1990US4969415 PECVD (plasma enhanced chemical vapor deposition) method for depositing of tungsten or layers containing tungsten by in situ formation of tungsten fluorides
11/13/1990CA1276318C Large cross-sectional area molecular beam source for semiconductor processing
11/13/1990CA1276317C Low deflection force sensitive pick
11/13/1990CA1276316C Method for making a doped well in a semiconductor substrate
11/13/1990CA1276315C Self aligned mesfet made using substitutional gate
11/13/1990CA1276314C Silicon ion implanted semiconductor device
11/13/1990CA1276276C Semiconductor devices employing ti-doped group iii-v epitaxial layer
11/13/1990CA1276088C Enhanced adhesion between metals and polymers
11/12/1990WO1990013921A1 Semiconductor device
11/12/1990CA2008537A1 Permanently antistatic polymeric rigid containers
11/08/1990DE4013944A1 Polycrystalline semiconductor film deposition in insulated substrates - using microwave plasma and biasing substrate via HF voltage allows deposition at lower temp. using inexpensive substrates
11/08/1990DE4013929A1 Formation of diffused layers of controllable profile of dopants - using doped glass diffusion sources and selecting of gas-ambient to influence diffusion rate of impurities through glass
11/08/1990DE3923630A1 Stromquellen-spannungsnachfuehrschaltkreis zur stabilisierung von bitleitungen Current source spannungsnachfuehrschaltkreis for stabilization of bit lines
11/08/1990DE3914602A1 Tapering via prodn. esp. in multilevel circuits - by etching insulation layers with different etch rates
11/08/1990DE3913066A1 Hermetically sealed housing for electronic circuits - has edge sealed by soldered layer that bonds cover to surface of circuit board with screen printed coating
11/07/1990EP0396521A2 Apparatus and method for loading electronic component carrier tubes
11/07/1990EP0396508A2 Process for fabricating an EPROM cell array
11/07/1990EP0396398A1 Plasma etching apparatus with surface magnetic fields
11/07/1990EP0396369A2 Semiconductor with filled-by-flow trench isolation
11/07/1990EP0396357A1 Process for forming CMOS field effect transistors
11/07/1990EP0396326A1 Method of processing substrate for semiconductor device
11/07/1990EP0396307A2 Fabrication of semiconductor devices using phosphosilicate glasses
11/07/1990EP0396299A1 Heating coil for use in growth of single crystal
11/07/1990EP0396276A2 Method of manufacturing semiconductor device
11/07/1990EP0396272A2 IC device including test circuit
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