Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/1990
08/17/1990CA2010219A1 Process and apparatus for the planarizing of rough, structured or heterogeneous surfaces
08/16/1990EP0382648A1 Process and apparatus for recrystallization of semiconductor layer
08/16/1990EP0382621A1 Process for the encapsulation of an integrated circuit on a support, device for carrying out this method and electronic assembly obtained by this process
08/16/1990EP0382504A2 Semiconductor integrated circuit having interconnection with improved design flexibility
08/16/1990EP0382445A2 High density bond pad design
08/16/1990EP0382360A2 Event qualified testing architecture for integrated circuits
08/16/1990EP0382341A1 Deposition of diamond films
08/16/1990EP0382298A1 Method of manufacturing a semiconductor device using electroless metallisation
08/16/1990EP0382249A2 Electron beam exposure data processing method, electron beam exposure method and apparatus
08/16/1990EP0382165A2 High-voltage semiconductor device having silicon-on-insulator structure with reduced on-resistance
08/16/1990EP0382136A1 Method for manufacturing a film capacitor
08/16/1990EP0382080A2 Bump structure for reflow bonding of IC devices
08/16/1990EP0382065A2 Apparatus for plasma processing
08/16/1990EP0382046A2 Electrically conductive resist composition, process for its production and its use
08/16/1990EP0382036A2 Epitaxial film growth using low pressure MOCVD
08/16/1990EP0381901A2 Method of fabricating a bipolar transistor structure comprising a self-aligned trench-isolated emitter
08/16/1990EP0381849A1 Fast power semiconductor circuit
08/16/1990DE3937502A1 Insulating or field-screening structure - for IC semiconductor devices
08/16/1990DE3904219A1 Herstellverfahren fuer hybridschaltkreisgehaeuse Manufacturing processes for hybridschaltkreisgehaeuse
08/16/1990DE3903855A1 Light-induced dry etching process
08/14/1990US4949305 Erasable read-only semiconductor memory device
08/14/1990US4949275 Semiconductor integrated circuit device made by a standard-cell system and method for manufacture of same
08/14/1990US4949224 Structure for mounting a semiconductor device
08/14/1990US4949212 Circuit configuration for protecting an integrated circuit
08/14/1990US4949159 Carrier for film-mounted integrated circuit
08/14/1990US4949158 Semiconductor device
08/14/1990US4949157 Large scale integrated circuit
08/14/1990US4949154 Thin dielectrics over polysilicon
08/14/1990US4949153 Semiconductor IC device with polysilicon resistor
08/14/1990US4949152 Semiconductor integrated circuit
08/14/1990US4949151 Bipolar transistor having side wall base and collector contacts
08/14/1990US4949150 Programmable bonding pad with sandwiched silicon oxide and silicon nitride layers
08/14/1990US4949149 Semicustom chip whose logic cells have narrow tops and wide bottoms
08/14/1990US4949148 Self-aligning integrated circuit assembly
08/14/1990US4949146 Structured semiconductor body
08/14/1990US4949145 Homo-junction bipolar transistor having high base concentration and suitable for low temperature operation
08/14/1990US4949144 Semiconductor photo-detector having a two-stepped impurity profile
08/14/1990US4949142 Integrated N-channel power MOS bridge circuit
08/14/1990US4949141 Vertical gate thin film transistors in liquid crystal array
08/14/1990US4949140 EEPROM cell with integral select transistor
08/14/1990US4949137 Semiconductor device
08/14/1990US4949034 Method for contactless evaluation of characteristics of semiconductor wafers and devices
08/14/1990US4948983 Alignment of mask and semiconductor wafer using linear fresnel zone plate
08/14/1990US4948979 Vacuum device for handling workpieces
08/14/1990US4948757 Method for fabricating three-dimensional microstructures and a high-sensitivity integrated vibration sensor using such microstructures
08/14/1990US4948756 Forming two openings by etching polysilicon layer and dielectric
08/14/1990US4948755 Method of manufacturing self-aligned conformal metallization of semiconductor wafer by selective metal deposition
08/14/1990US4948754 Semiconductor substrate, electrode pads, passivation films
08/14/1990US4948751 Vacuum deposition
08/14/1990US4948750 Method and apparatus for producing semiconductor layers composed of amorphous silicon-germanium alloys through glow discharge technique, particularly for solar cells
08/14/1990US4948749 Process for forming electrodes for semiconductor devices
08/14/1990US4948748 Manufacture of a substrate structure for a composite semiconductor device using wafer bonding and epitaxial refill
08/14/1990US4948747 Controlled doping to provide desires electroconductivity
08/14/1990US4948746 Isolated gate MESFET and method of making and trimming
08/14/1990US4948745 Process for elevated source/drain field effect structure
08/14/1990US4948744 Process of fabricating a MISFET
08/14/1990US4948743 Method of manufacturing a semiconductor device
08/14/1990US4948742 Method of manufacturing a semiconductor device
08/14/1990US4948702 Shelf life
08/14/1990US4948645 Tape automated bonding and method of making the same
08/14/1990US4948629 Chemical vapor deposition using aliphatic acid or aromatic anhydride and high powered pulsed laser
08/14/1990US4948624 Etch resistant oxide mask formed by low temperature and low energy oxygen implantation
08/14/1990US4948623 Decomposing vapor of complex containing phosphine, arsine, or amine ligand
08/14/1990US4948462 Tungsten etch process with high selectivity to photoresist
08/14/1990US4948461 Dry-etching method and plasma
08/14/1990US4948459 Method of enabling electrical connection to a substructure forming part of an electronic device
08/14/1990US4948458 Radiofrequency resonant current induced in a planar coil; uniform flux; semiconductor wafer processing
08/14/1990US4948456 Without requirement of subsequent thinning
08/14/1990US4948330 Alignment stage device
08/14/1990US4948231 Liquid crystal display device and method of manufacturing the same
08/14/1990US4947784 Apparatus and method for transferring wafers between a cassette and a boat
08/14/1990US4947598 Method for grinding the surface of a semiconductor wafer
08/14/1990US4947545 Automated burn-in system
08/14/1990CA1272812A1 Ultraviolet exposure arrangement for the production of masks
08/10/1990CA2009723A1 High density bond pad design
08/09/1990DE4002435A1 Cellular power semiconductor device - has draught-board type array of N and P=type cells connected resp. to two areas by pair of conductive sheets
08/08/1990EP0381467A1 Method of manufacturing an x-ray mask
08/08/1990EP0381456A1 Vapor-phase growth of epitaxial crystals
08/08/1990EP0381430A2 A method of firing copper compatible thick film materials
08/08/1990EP0381411A2 Methods of joining components
08/08/1990EP0381404A2 Non-volatile memory
08/08/1990EP0381396A1 Compound semiconductor devices
08/08/1990EP0381338A2 Method and apparatus for the transfer of wafers in a vertical cvd diffusion apparatus
08/08/1990EP0381280A1 Method of manufacturing an integrated circuit with a protection element
08/08/1990EP0381253A1 Apparatus and method for processing one or more wafers of material
08/08/1990EP0381247A2 Apparatus and method for epitaxial deposition
08/08/1990EP0381207A2 Process of amorphisation to structure semiconductor body
08/08/1990EP0381139A2 Semiconductor integrated circuit and method of manufacture thereof
08/08/1990EP0381111A2 Electroactive-passivation film
08/08/1990EP0381110A1 Protection layer for electroactive passivation layers
08/08/1990EP0381109A2 Moisture barrier for organic dielectrics
08/08/1990EP0381071A2 An improved method for forming emitters in a bicmos process
08/08/1990EP0381051A1 Growth of solidified films, particularly semiconductors, from melts using a substrate with a profiled surface
08/08/1990EP0380964A2 Method of making a semiconductor device having a contact member
08/08/1990EP0380906A2 Tape bonded semiconductor device
08/08/1990EP0380815A1 Integration of GaAs on Si substrate
08/08/1990EP0380682A1 Method of fabricating semiconductor devices
08/08/1990EP0380654A1 Lens arrays for light sensitive devices
08/08/1990EP0380570A1 Heat dissipating interconnect tape for use in tape automated bonding
08/08/1990EP0380519A1 Ic chips with self-aligned thin film resistors