Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/1995
10/04/1995CN1109518A SOI integrate circuit chip material containing diamond film and its making technology
10/03/1995US5455894 Wafer fabrication robotic interface unit
10/03/1995US5455793 Electrically reprogrammable EPROM cell with merged transistor and optimum area
10/03/1995US5455790 High density EEPROM cell array which can selectively erase each byte of data in each row of the array
10/03/1995US5455787 Semiconductor memory device
10/03/1995US5455786 Ferroelectric memory
10/03/1995US5455745 Coated bonding wires in high lead count packages
10/03/1995US5455605 for marking a detected defective die
10/03/1995US5455524 CMOS integrated circuit device and data processing system using the same
10/03/1995US5455518 Test apparatus for integrated circuit die
10/03/1995US5455462 Plastic molded package with heat sink for integrated circuit devices
10/03/1995US5455461 Semiconductor device having reformed pad
10/03/1995US5455460 Semiconductor device having complimentary bonding pads
10/03/1995US5455455 Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby
10/03/1995US5455453 Copper or copper alloy as matrix, insulating film, multilayer film; noncracking, nonpeeling
10/03/1995US5455452 Semiconductor package having an LOC structure
10/03/1995US5455450 Semiconductor device comprising a lateral bipolar transistor
10/03/1995US5455448 For mounting on a heat sink
10/03/1995US5455440 Method to reduce emitter-base leakage current in bipolar transistors
10/03/1995US5455439 Semiconductor device which moderates electric field concentration caused by a conductive film formed on a surface thereof
10/03/1995US5455438 Semiconductor integrated circuit device in which kink current disturbances of MOS transistors are suppressed
10/03/1995US5455437 Semiconductor device having crystalline defect isolation regions
10/03/1995US5455435 Late programming mask ROM and process for producing the same
10/03/1995US5455429 Semiconductor devices incorporating p-type and n-type impurity induced layer disordered material
10/03/1995US5455419 Micromechanical sensor and sensor fabrication process
10/03/1995US5455390 Microelectronics unit mounting with multiple lead bonding
10/03/1995US5455385 Multilayer LTCC tub architecture for hermetically sealing semiconductor die, external electrical access for which is provided by way of sidewall recesses
10/03/1995US5455382 IC package heat sink fin
10/03/1995US5455205 Method of producing semiconductor device
10/03/1995US5455204 Thin capacitor dielectric by rapid thermal processing
10/03/1995US5455202 Method of making a microelectric device using an alternate substrate
10/03/1995US5455200 Method for making a lead-on-chip semiconductor device having peripheral bond pads
10/03/1995US5455198 Method for fabricating tungsten contact plug
10/03/1995US5455197 Control of the crystal orientation dependent properties of a film deposited on a semiconductor wafer
10/03/1995US5455195 Using a palladium layer barrier
10/03/1995US5455194 Encapsulation method for localized oxidation of silicon with trench isolation
10/03/1995US5455193 Method of forming a silicon-on-insulator (SOI) material having a high degree of thickness uniformity
10/03/1995US5455192 Method of making dynamic random access memory cell having a stacked capacitor and a trench capacitor
10/03/1995US5455191 Method of fabricating an ASIC cell having multiple contacts
10/03/1995US5455190 Method of making a vertical channel device using buried source techniques
10/03/1995US5455189 Method of forming BICMOS structures
10/03/1995US5455188 Process for fabricating a lateral bipolar junction transistor
10/03/1995US5455185 Producing buried collector in silicon substrate, producing insulation structure at surface of substrate, implanting boron inside insulation structure, depositing layer of borosilicate glass, etching, forming base edges
10/03/1995US5455183 Reduction of current leakage between barrier pad and wafer
10/03/1995US5455182 Semiconductor process for forming channel layer with passivated covering
10/03/1995US5455144 Reduction projection exposure of pattern onto positive photosensitive resist film, then transferring second pattern onto negative resist film, for improving resolution of fine patterns
10/03/1995US5455130 Photomask comprising an optical path adjusting film
10/03/1995US5455082 Reduced pressure processing system and reduced pressure processing method
10/03/1995US5455064 Process for fabricating a substrate with thin film capacitor and insulating plug
10/03/1995US5454970 Octamethyltrisiloxane containing azeotropes
10/03/1995US5454929 Process for preparing solderable integrated circuit lead frames by plating with tin and palladium
10/03/1995US5454928 Melting excess plated metal filling substrate holes to eliminate voids then lapping to level the surfaces
10/03/1995US5454915 Electrochemical etching
10/03/1995US5454906 Method of providing sacrificial spacer for micro-mechanical devices
10/03/1995US5454905 Method for manufacturing fine pitch lead frame
10/03/1995US5454901 Process for treating semiconductor substrates
10/03/1995US5454885 Depositing a layer of mercury telluride or mercury cadmium telluride over cadmium telluride intermetallics, heating to cause copper impurity migrating into coated layer, then remove the deposited layer
10/03/1995US5454871 SOG coated apparatus to solve SOG non-uniformity in the VLSI process
10/03/1995US5454705 Semiconductor mold having cavity blocks with cavities on top and bottom surfaces
10/03/1995US5454506 Structure and process for electro/mechanical joint formation
10/03/1995US5454390 Vapor rinse-vapor dry process tool
10/03/1995US5454347 Laser-beam annealing apparatus
10/03/1995US5454346 Process for growing multielement compound single crystal
10/03/1995US5454161 Through hole interconnect substrate fabrication process
10/03/1995US5454160 Apparatus and method for stacking integrated circuit devices
10/03/1995US5454159 Method of manufacturing I/O terminals on I/O pads
10/03/1995CA2036778C Method of forming trench isolated regions with sidewall doping
10/03/1995CA1337170C Method for forming crystalline deposited film
10/03/1995CA1337169C Zone melt recrystallization apparatus
10/03/1995CA1337168C Zone-melting recrystallization process
09/1995
09/30/1995CA2145712A1 Process for preparing high crystallinity oxide thin film
09/29/1995WO1995026567A1 Method for fabricating suspension members for micromachined sensors
09/28/1995WO1995026124A1 Integrated circuit lamination process
09/28/1995WO1995026047A1 Semiconductor package manufacturing method and semiconductor package
09/28/1995WO1995026046A1 Method for the sealed and electrically insulating attachment of an electrical conductor extending through a metal wall
09/28/1995WO1995026045A1 Method for producing integrated components
09/28/1995WO1995026044A1 Large-area semiconductor thin films formed at low temperature using nanocrystal precursors
09/28/1995WO1995026043A1 Group iv semiconductor thin films formed at low temperature using nanocrystal precursors
09/28/1995WO1995026042A1 Thin film electronic devices and manufacturing method
09/28/1995WO1995026001A1 Efficient direct cell replacement fault tolerant architecture supporting completely integrated systems with means for direct communication with system operator
09/28/1995WO1995025983A1 Methods of fabricating active matrix pixel electrodes
09/28/1995WO1995025689A1 Electrostatic levitation conveyor and electrostatic levitation electrodes thereof
09/28/1995DE4423879A1 Bandspannvorrichtung für einen Halbleiterproduktionsapparat Belt tensioning device for a semiconductor manufacturing apparatus
09/28/1995DE4409006A1 High-speed vertical MOS-FET prodn., useful in highly IC
09/28/1995DE19511191A1 Photoresist wavy form deposition method for semiconductor lithography
09/28/1995DE19510922A1 Verfahren zur Herstellung eines Halbleiterbauelements, Verfahren zur Reinigung einer Kristalloberfläche eines Halbleiters sowie Halbleiterbauelement A process for producing a semiconductor device, method for cleaning a surface of a semiconductor crystal and semiconductor device
09/28/1995DE19510919A1 Verfahren zur Herstellung eines AlGaAs-Kristalls und seine Verwendung als Halbleiterlaser und als HBT-Transitor A process for the preparation of a AlGaAs crystal and its use as a semiconductor laser and HBT as Transitor
09/28/1995DE19510209A1 Doping diamond to obtain optical or electrical property
09/28/1995DE19509440A1 Sputter coating appts.
09/28/1995DE19502392A1 FET mfg. method
09/28/1995CA2186160A1 Methods of fabricating active matrix pixel electrodes
09/28/1995CA2185787A1 Efficient direct cell replacement fault tolerant architecture supporting completely integrated systems with means for direct communication with system operator
09/27/1995EP0674472A2 Electronic package assembly and connector for use therewith
09/27/1995EP0674388A1 Scannable latch and method of using the same
09/27/1995EP0674349A1 Method for forming a step on a deposition surface of a substrate for a superconducting device utilizing an oxide superconductor
09/27/1995EP0674348A1 II-VI Group compound semiconductor device and method for manufacturing the same
09/27/1995EP0674347A1 II-VI Group compound semiconductor device and method for manufacturing the same
09/27/1995EP0674345A2 Wafer notch dimension measuring apparatus
09/27/1995EP0674344A2 Gallium oxide thin films
09/27/1995EP0674343A2 Method for storing silicon wafers
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