Patents for C25D 3 - Electroplating; Baths therefor (11,896)
04/2011
04/20/2011CN102021617A Cyanide-free electroplating bath for copper plating of iron and steel parts
04/20/2011CN102021616A Electrolytic copper plating bath and method for electroplating using the electrolytic copper plating bath
04/20/2011CN102021615A Galvanizing ammonium salt flux bath solution analyzer
04/20/2011CN102021614A High-brightness nickel-plated brightening agent
04/20/2011CN102021613A Electrolyte composition
04/20/2011CN102021576A Method for continuously producing flexible copper clad laminates
04/20/2011CN101709470B Preparation method of composite coating containing in situ generated diffusion barrier
04/20/2011CN101654797B Chemical-copper plating liquid and copper plating production process
04/20/2011CN101580955B Surface processing method for hydrogen storage alloy powder
04/20/2011CN101575694B Process for diffusing ruthenium on surface of molybdenum wafer with ultra-large diameter
04/20/2011CN101285203B Pd-containing plating solution and uses thereof
04/20/2011CN101065519B Molten salt bath, precipitate, and process for producing metal precipitate
04/19/2011US7927733 Case for batteries and preparation method thereof
04/19/2011US7927390 Stable aqueous suspension liquid of finely divided diamond particles, metallic film containing diamond particles and method of producing the same
04/14/2011WO2011041809A1 Method for producing titanium diboride (tib2) layers from molten electrolytes
04/14/2011US20110083967 Electrodeposited alloys and methods of making same using power pulses
04/14/2011DE102009051673B3 Herstellung von Galvannealed-Blechen durch Wärmebehandlung elektrolytisch veredelter Bleche Production of galvannealed sheet metal by heat treatment electrolytically refined sheets
04/14/2011DE102009049565A1 Verfahren und Anlage zur Metallisierung von Siliziumwafern Method and apparatus for metallization of silicon wafers
04/13/2011EP2309036A1 Anti-displacement hard gold compositions
04/13/2011EP2309035A1 Electrolyte composition
04/13/2011EP2309030A1 A method of reducing the quantity of lead released by bronze and/or brass water-system components into liquids that are intended for human consumption
04/13/2011EP2308135A1 Electrical contact pair
04/13/2011EP2307593A2 Composite material
04/13/2011EP2307312A2 Method for dispersing and separating nanotubes
04/13/2011CN201793799U Device for relieving generation of tin sludge in tin-plating solution
04/13/2011CN201793784U High-speed silvering device for bent waveguide cavity
04/13/2011CN102016130A Modified copper-tin electrolyte and method of depositing bronze layers
04/13/2011CN102016129A Electroplating composition and process for coating a semiconductor substrate using said composition
04/13/2011CN102013488A Tin/copper foam alloy cathode material for lithium ion cells and preparation method thereof
04/13/2011CN102011169A Electroplating apparatus and electroplating method
04/13/2011CN102011168A Electroplated diamond bur and manufacturing method thereof
04/13/2011CN102011158A Co-deposition electroplating method with cyanogen-free Au-Sn alloy electrolyte
04/13/2011CN102011157A Electroplated zinc and copper alloy
04/13/2011CN102011156A Zinc and iron alloy plated from pyrophosphate
04/13/2011CN102011155A High zinc-iron alloy plated from sulphate
04/13/2011CN102011154A Gold plating solution for plating gold finger on circuit board
04/13/2011CN102009504A Steel strip plated with multi-layer micron/nano-crystal nickel films and preparation method thereof
04/13/2011CN102009391A Process for manufacturing high precise electroplating CBN (Cubic Boron Nitride) grinding wheel
04/13/2011CN102009390A Electroforming high-precision profiling grinding wheel and preparation process thereof
04/13/2011CN101675185B Electrolyte and method for depositing decorative and technical layers of black ruthenium
04/13/2011CN101570872B Method for growing upright three-dimensional netlike noble metal nano-plate on boron-doped diamond substrate
04/13/2011CN101532149B A two-sided light high performance electrolytic copper foil and its preparation method
04/13/2011CN101263247B Electroplating composition for coating a substrate surface with a metal
04/07/2011WO2011040280A1 Coating film of sn or sn alloy formed by plating and composite material having same
04/07/2011WO2011038463A1 Supercapacitor electrodes
04/07/2011CA2776388A1 Supercapacitor electrodes
04/06/2011EP2142685B1 Barrier layer and method for making the same
04/06/2011EP1214191B1 Laminate comprising treated copper foil and process for making it
04/06/2011EP1211011B1 Method of manufacturing a solder coated material ; corresponding solder coated material
04/06/2011CN201785543U Zinc plating liquid recovery device
04/06/2011CN102007231A Structured chrome solid particle layer and method for the production thereof
04/06/2011CN102003148A Oil casing pipe resisting CO2 corrosion and production method thereof
04/06/2011CN102002749A Improved valve chrome plating device and novel valve liquid flow hard-chrome electroplating process
04/06/2011CN102002743A Preparation method for electroplating thick tungsten coating on pure copper or copper alloy substrate with molten salt
04/06/2011CN102002742A Formula and preparation method of plating solution as well as method for plating aluminum base plate
04/06/2011CN102002741A Preparation of general brightener for potassium salt zinc plating and sulfate zinc plating
04/06/2011CN102002740A Special preparation method for wire and strip zinc-plating brightener
04/06/2011CN102002739A Compounded main brightener for preparing zinc-plating brightener
04/06/2011CN102002738A Plating solution formulation for plating black chrome on oxygen-free copper matrix and electroplating method
04/06/2011CN102002737A Composite additive for producing electrolytic copper foil with high bending resistance and low outline
04/06/2011CN101565839B Cyanogen to cyanogen-free alkali environment-friendly galvanizing brightener
04/06/2011CN101509140B Process for spray electrodeposition Ni-Fe alloy coating on surface of copper or copper alloy
04/06/2011CN101487134B Method for modulating zinc-nickel alloy and nickel combined multi-layer membranous by electrochemical deposition component
04/06/2011CN101481812B Electrolytic solution for integrated circuit copper wire laying electrodeposition
04/06/2011CN101416569B Electrolytic method for filling holes and cavities with metals
04/06/2011CN101108436B Product used for fluxless brazing and its preparing method
03/2011
03/31/2011WO2011036076A2 Copper electroplating composition
03/31/2011WO2011036004A1 Method for electrochemically coating and incorporating particles in the layer
03/31/2011WO2010136814A3 Electrodeposition of elemental zirconium
03/31/2011DE102009045061A1 Producing electrically conductive, structured or fully flat surface, comprises applying base layer on a support using a dispersion, curing and/or drying the material, exposing particle by partial disruption and forming metal- on base layer
03/31/2011DE102009044982A1 Verfahren zum Galvanisieren und zur Passivierung Method of electroplating and passivation
03/31/2011DE102009029558A1 Elektrolytzusammensetzung Electrolyte composition
03/30/2011EP2302103A1 Electrolytic copper coating and method of manufacture therefor, and copper electrolyte for manufacturing electrolytic copper coatings
03/30/2011EP1459644B1 Decorative article having white coating and method for manufacture thereof
03/30/2011CN201778138U Anode device containing copper ball
03/30/2011CN201778134U Copper-plated rotary support
03/30/2011CN201778130U Driving device of working shafts on copper plating vehicle
03/30/2011CN101994140A Method for removing hydrogen in high strength steel electroplated by zinc-nickel alloy
03/30/2011CN101994139A Scattered metal gallium chloride/1-methyl-3-butyliminazole chloride system electroplating solution
03/30/2011CN101994138A Filling closure of distant holes on surface of zinc die casting alloy and preparation method thereof
03/30/2011CN101994128A Method for preparing Al-Ti alloy or plated Al-Ti alloy by low-temperature electrolytic deposition of ionic liquid
03/30/2011CN101992367A Method for plating copper on flux-cored wire by electric brush copper
03/30/2011CN101693993B Phosphorization processing liquid for surface of carbon steel and nickel plating enclosure method
03/30/2011CN101580951B Method for improving corrosion resistance of chromeplated product
03/30/2011CN101255590B Method for preparing carbon nano-tube/nano-platinum composite film
03/23/2011CN101988211A Metal surface multilayer nickel plating process with excellent corrosion resistance
03/23/2011CN101988210A Ionic liquid indium chloride/n-butyl pyridine chloride system electroplating solution
03/23/2011CN101637680B Antiseptic filtering metal material by plating Cu and CeO2 on surface of copper wire mesh, and preparation and application thereof
03/23/2011CN101550577B Surface electroplating method of iron-steel parts
03/23/2011CN101498014B Electroplating process for metallic surface wear-resistance coating
03/22/2011US7909978 Sulfonate salt of chromium in an anhydrous organic solvent of dimethylformamide
03/17/2011WO2011030150A1 Soldering process using electrodeposited indium and/or gallium, and article comprising an intermediate layer with indium and/or gallium
03/17/2011WO2011029781A1 Polymers having terminal amino groups and use thereof as additives for zinc and zinc alloy electrodeposition baths
03/17/2011WO2011029507A1 Process for the electrolytic copper plating of zinc diecasting having a reduced tendency to blister formation
03/17/2011WO2011029197A1 Electrochemical method of producing copper indium gallium diselenide (cigs) solar cells
03/17/2011US20110065804 Electrodeposited metallic finishes including antimicrobial agents
03/17/2011US20110062030 Electrolyte composition
03/17/2011US20110062029 Electrolytic copper plating bath and method for electroplating using the electrolytic copper plating bath
03/17/2011CA2773709A1 Electrochemical method of producing copper indium gallium diselenide (cigs) solar cells
03/17/2011CA2768641A1 Polymers having terminal amino groups and use thereof as additives for zinc and zinc alloy electrodeposition baths
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