Patents for C09J 201 - Adhesives based on unspecified macromolecular compounds (8,003)
11/2005
11/17/2005WO2005108498A1 Curable composition
11/17/2005WO2005108494A1 Curable composition
11/17/2005WO2005108493A1 Curable composition
11/17/2005WO2005108492A1 Curable composition
11/17/2005WO2005108491A1 Curable composition
11/17/2005US20050255631 Method of soldering a polymer surface to a conducting or semiconducting surface and applications of same
11/17/2005US20050255325 Protective film for surface of display
11/17/2005US20050252598 Viscous adhesive material for fastening electronic components
11/16/2005EP1297089B1 Adhesive security tape that allows to detect unauthorized opening of a packaging
11/16/2005CN1696234A Adhesive compsn.circuit connection material,joint stucture of circuit parts and semiconductor device
11/16/2005CN1227316C Pressure sensitive conductive adhesive having hot-melt properties and biomedical electrodes using same
11/16/2005CN1227313C Thermal strippable contact adhesive sheet
11/16/2005CN1227038C Skin friendly adhesive with ph-lowering substance
11/15/2005CA2339984C Creping compositions with improved thermo-oxidative stability and processes
11/10/2005WO2005105633A1 Anisotropic conductive film holding tape and mounting method
11/10/2005US20050249446 Thermosetting adhesive for optical use, optical isolator element made with the adhesive, and optical isolator
11/09/2005EP1593728A2 Michael addition compositions
11/09/2005EP1593727A1 Michael addition compositions
11/09/2005EP1311577B1 Aqueous dispersion and the use thereof in the production of coating agents, adhesives and sealing agents that can cured by heat or by actinic radiation
11/09/2005EP1252214B1 Organometallic compositions
11/09/2005EP1196512B1 Adhesive composition comprising a particulate thermoplastic component
11/09/2005EP0855049B1 A method of forming a monolayer of particles, and products formed thereby
11/09/2005CN1694918A Superabsorbent-hydrophobic polymer two-phase compositions
11/09/2005CN1226378C Adhesive composition and adhesive sheet
11/03/2005WO2005103186A1 Gel adhesive composition
11/03/2005WO2005103185A2 Adhesive composition and sealed information medium
11/03/2005US20050245801 Bioadhesive compositions and biomedical electrodes containing them
11/03/2005US20050245721 Bonding substrate, forming foams, elastomers, roofing membrane, gasket; using catalyst; laminating adhesive
11/03/2005US20050244605 Use of an adhesive for assembling a member and a wheel, a member-and-wheel assembly, a member, and a wheel
11/03/2005US20050243245 Polarizing plate and production process of the same
11/02/2005EP1401976B1 Reactive oligomers
10/2005
10/27/2005US20050238881 Semiconductor assembly using dual-cure die attach adhesive
10/27/2005US20050238692 Biomedical adhesive
10/26/2005EP1588800A1 Pressure sensitive adhesive tape and method of lens shape machining
10/26/2005EP1383844B1 A thermosetting adhesive film, and an adhesive structure based on the use thereof
10/26/2005CN1688903A Particulate transfer film with improved bead carrier
10/26/2005CN1688667A Smoke suppressant hot melt adhesive composition
10/25/2005US6958154 Tacky component of an adhesive, and a film-forming, non-tacky component that are immiscible with each other to undergo phase separation
10/20/2005WO2005097934A1 Curable adhesive composition, adhesive kit and method of adhering substrates
10/20/2005WO2005097909A1 Curable compositions
10/20/2005US20050233139 Foamed contact adhesives
10/20/2005CA2561867A1 Curable adhesive composition, adhesive kit and method of adhering substrates
10/19/2005EP1347788B1 Antimicrobial hot melt adhesive
10/19/2005CN1685025A Hybrid plastisol/hot melt compositions
10/19/2005CN1684796A Adhesive tape and edging method using same
10/19/2005CN1684571A Adhesive system and method for printed circuit board surface
10/13/2005WO2005096442A1 Anisotropic conductive film and manufacturing method thereof
10/13/2005WO2005095485A1 Hardenable composition
10/13/2005US20050228120 Polymer having charged units
10/13/2005CA2561385A1 Hardenable composition
10/12/2005EP1242494B1 Substance mixture which can be cured thermally and by using actinic radiation, and the use thereof
10/12/2005CN1681878A Polymeric compositions containing polymers and ionic liquids
10/12/2005CN1680507A Binding composition, electric circuit connecting material, electric component connecting structure and production thereof
10/12/2005CN1222324C Self-adhesive wound dressing
10/11/2005CA2353368C Method of applying chemical anchoring adhesive
10/05/2005EP1583144A2 Dicing die-bonding film
10/05/2005EP1161348B1 Marking film and composite marking film
10/05/2005CN1678639A Transformable pressure sensitive adhesive tape and use thereof in display screens
10/05/2005CN1676561A Electrostatic-proof coating and electrostatic-proof film
10/05/2005CN1222017C Adhesive film for protecting simiconductor wafer surface and method for protecting wafer with same
10/05/2005CN1221624C Adhesive composition comprising particle thermoplastic component
10/05/2005CN1221621C Adhesive compositions containing graft copolymers
09/2005
09/29/2005WO2005090510A1 Resin composition and semiconductor devices made by using the same
09/29/2005US20050215030 Method and device for separating a reinforcing-plate fixed to a reinforced semiconductor wafer
09/29/2005US20050214493 Refractory building structure formed by regeneration product made of waste material
09/28/2005EP1580245A1 Acrylic pressure sensitive adhesive composition and pressure sensitive adhesive tape
09/28/2005EP1274570B1 Adhesive sheet and floor surface covered structure
09/28/2005CN1675330A Epoxy compositions having improved shelf life and articles containing the same
09/28/2005CN1675120A Splicing tape with separating portions
09/28/2005CN1674235A Method and device for separating a reinforcing-plate fixed to a reinforced semiconductor wafer
09/28/2005CN1220720C Room-temperature-curable organopolysiloxane composition
09/27/2005US6949880 Encapsulation for organic LED device
09/22/2005WO2005087888A1 Heat-peelable pressure-sensitive adhesive sheet and method of processing adherend with the heat-peelable pressure-sensitive adhesive sheet
09/22/2005WO2005087887A1 Heat-peelable pressure-sensitive adhesive sheet and method of processing adherend with the heat-peelable pressure-sensitive adhesive sheet
09/22/2005WO2005087865A1 Moisture-curable composition and method of bonding
09/22/2005WO2005087822A1 Liquid composition containing no solvent
09/22/2005US20050209380 A crosslinked polymer of alkyl (meth)acrylate having 2-14 alkyl carbon atoms and an unsaturated carboxylic acid blended with tackifier resins containing natural products as raw material; coated on both surfaces of a non-woven fabric to fix and store recyclable parts; removability, adhesion; strength
09/22/2005US20050208736 Dicing die-bonding film
09/22/2005US20050206025 Pressure waveform setting method for injection pressure control and an injection molding machine
09/21/2005EP1311640B1 Adhesive tapes comprising a textile support for enveloping elongated material, particularly looms of cables
09/21/2005CN1671942A Point attachment systems for laminated glass and a process for preparing same
09/21/2005CN1671633A Glass fiber sizing compositions, sized glass fibers, and polyolefin composites
09/21/2005CN1670942A Dicing die-bonding film
09/21/2005CN1670102A Acrylic adhesive composition and adhesive tape
09/21/2005CN1219840C Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same
09/21/2005CN1219832C Low foaming N, N'-dialkyl malic imine wetting agent
09/15/2005WO2005085309A2 Method for hardening a photosensitive filler material and hardening device
09/15/2005US20050202070 Antimicrobial properties; use in surgical incise drapes; iodine and/or iodide salt are combined with a pre-adhesive composition in a hot melt mixer, with an iodine/iodide complexing agent such as polyvinylpyrrolidone present in the mixture
09/15/2005US20050201974 Bioadhesive polymers with catechol functionality
09/13/2005US6943207 Smoke suppressant hot melt adhesive composition
09/08/2005US20050196942 Protective tape for use in grinding back of semiconductor wafer and method of fabricating semiconductor device
09/08/2005DE102004007780A1 Wäßrige, kolloidale Gasrusssuspension Aqueous, colloidal gas black suspension
09/07/2005CN1665848A Polymerizing hydrogels including modifying compounds to comprise low amount of residual monomers and by-products and to optimize material properties
09/07/2005CN1665703A Soundproofing floor covering and method for the production thereof
09/07/2005CN1665680A Digital color-design composite for use in laminated glass
09/07/2005CN1665549A Absorbent binder desiccant composition and articles incorporating it
09/07/2005CN1664260A The construction structure protection sheet object and its protection method
09/07/2005CN1664001A Aqueous nanocomposite dispersions: processes, compositions, and uses thereof
09/06/2005US6939936 Iodine/iodide-containing hot melt coatable adhesive, methods and uses therefor
09/01/2005US20050191456 Adhesive sheet roll for wafer processing
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