| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 01/24/2013 | US20130023605 Curable compositions |
| 01/24/2013 | US20130023603 Epoxy resin composition with reduced toxicity |
| 01/24/2013 | US20130022818 One-pack epoxy resin composition, and use thereof |
| 01/24/2013 | US20130022780 Thermosetting resin composition, thermosetting resin composition for fiber-reinforced composite material, prepared using the same, and honeycomb sandwich panel |
| 01/23/2013 | CN102888081A Flame-retardant encapsulating material and preparation method thereof |
| 01/23/2013 | CN102888080A Wall decoration material combination, wall decoration material and preparation method |
| 01/23/2013 | CN102888079A Method for manufacturing magneto caloric device |
| 01/23/2013 | CN102888078A Composite material and method for preparing base material from the composite material |
| 01/23/2013 | CN102888072A Styrene mixed recycled material |
| 01/23/2013 | CN102443247B Preparation method of graphene oxide grafted POSS (polyhedral oligomeric silsesquioxane) modified epoxy resin |
| 01/23/2013 | CN102352076B Atomizer based method for preparing thermal neutron scintillator convert screen |
| 01/23/2013 | CN102153725B Preparation and application of high-performance epoxy bitumen material compatibilizer |
| 01/23/2013 | CN102140114B Methyl silicic acid tri(2,3-dichloropropyl) ester compound and preparation method thereof |
| 01/23/2013 | CN102093670B Halogen-free flame retardant epoxy resin composition and copper clad plate prepared from same |
| 01/23/2013 | CN101970525B Curable composition, anisotropic conductive material and connection structure |
| 01/23/2013 | CN101959923B Curable composition and color filter |
| 01/23/2013 | CN101914230B Preparation method of weldable damping adhesive for vehicle vibration-damping plate |
| 01/23/2013 | CN101602881B Thermosetting resin composition and application |
| 01/23/2013 | CN101400719B Phenoxy resin for optical material, resin composition for optical material, resin film for optical material, and optical waveguide using those |
| 01/23/2013 | CN101173086B Curing agent for low temperature cure applications |
| 01/22/2013 | US8357764 Fast curable epoxy compositions containing imidazole- and 1-(aminoalkyl) imidazole-isocyanate adducts |
| 01/22/2013 | US8357482 Organic anti-reflective layer composition containing ring-opened phthalic anhydride and method for preparation thereof |
| 01/22/2013 | CA2526512C Paste form heat-blowing injection composition and method for injecting and soundproofing closed section of automobile body member |
| 01/17/2013 | WO2013009114A2 Epoxy resin compound and radiant heat circuit board using the same |
| 01/17/2013 | WO2013009113A2 Epoxy resin compound and radiant heat circuit board using the same |
| 01/17/2013 | WO2013008841A1 White curable composition for optical semiconductor device, molded object for optical semiconductor device, and optical semiconductor device |
| 01/17/2013 | WO2013008684A1 Resin composition for printed wiring boards |
| 01/17/2013 | WO2013008680A1 Curable epoxy resin composition |
| 01/17/2013 | WO2013007128A1 Reinforced composite and method for recycling the same |
| 01/17/2013 | US20130018128 Process For The Preparation Of Dopo-Derived Compounds And Compositions Thereof |
| 01/17/2013 | US20130017374 Carbon nanotubes nanocomposites for microfabrication applications |
| 01/16/2013 | EP2545121A1 Storage stable water based epoxy-amine curable systems |
| 01/16/2013 | EP2545101A2 Multi-amine functional oligomers and method for producing the same by the reduction of corresponding oximes |
| 01/16/2013 | CN102884131A Epoxy resin composition for circuit boards, prepreg, laminate, resin sheet, laminate for printed wiring boards, printed wiring boards, and semiconductor devices |
| 01/16/2013 | CN102884130A 1C epoxy resin composition with reduced toxicity |
| 01/16/2013 | CN102884100A Epoxy resin compositions having poly(propylene oxide) poiyol as toughening agent |
| 01/16/2013 | CN102875977A Preparation method of flame-retardant phenolic epoxy composite material |
| 01/16/2013 | CN102875976A Hyperbranched polyaniline modified carbon nanotube/thermosetting resin composite material and preparation method thereof |
| 01/16/2013 | CN102875975A Highly-branched-chain polyaniline modified carbon nanotube/thermosetting resin composite material and preparation method thereof |
| 01/16/2013 | CN102875974A Epoxy resin composition for semiconductor sealing and semiconductor device |
| 01/16/2013 | CN102875973A Modified carbon nanotube/thermosetting resin composite and preparation method thereof |
| 01/16/2013 | CN102875972A Flame retardant composite of epoxy resin and preparation method thereof |
| 01/16/2013 | CN102875971A Preparation method for nanometer modified cation epoxy resin and application thereof |
| 01/16/2013 | CN102875970A Blackboard made of environment friendly polymer materials |
| 01/16/2013 | CN102875969A Moisture resistant epoxy resin potting material and its preparation method |
| 01/16/2013 | CN102875968A Flame-retardation enhanced epoxy plastic sheet material and its preparation method |
| 01/16/2013 | CN102875965A Preparation method of flame-retardant conducting composite material |
| 01/16/2013 | CN102875964A Preparation method of flame-retardant phenolic resin molding material |
| 01/16/2013 | CN102875963A Halogen-free flame-retardant epoxy resin-modified phenolic fiberglass reinforced plastic (FRP) material |
| 01/16/2013 | CN102875956A Engineering plastic with high wearing resistance |
| 01/16/2013 | CN102875953A Halogen-free flame retardant ABS (Acrylonitrile Butadiene StyreneAcrylonitrile Butadiene Styrene) material |
| 01/16/2013 | CN102875858A Lip-type seal ring framework material for rotary shaft, as well as preparation method and application of lip-type seal ring framework material |
| 01/16/2013 | CN102873940A Halogen-free low-dielectric constant high-toughness copper foil-coated laminated board |
| 01/16/2013 | CN102382420B High CTI (Comparative Tracking Index) epoxy resin composition for printed circuit copper-clad plate |
| 01/16/2013 | CN102304230B Phosphorus-containing flame retardant with fluorenyl groups and preparation method thereof |
| 01/16/2013 | CN102276960B Lightweight high-strength composite material and preparation method thereof |
| 01/16/2013 | CN102229737B Packaging material for high-blockage organic electronic device |
| 01/16/2013 | CN102146195B Modified carbon fiber enhanced epoxy-resin-based composite rod |
| 01/16/2013 | CN101755008B Curable resin composition and cured product |
| 01/15/2013 | US8354475 Epoxy-phenolic resins co-dispersions |
| 01/15/2013 | US8354467 Underfill formulation and method of increasing an adhesion property of same |
| 01/10/2013 | WO2013003999A1 Adducts as tougheners in thermosettable epoxy systems |
| 01/10/2013 | WO2013003906A1 Resins, resin/fibre composites, methods of use and methods of preparation |
| 01/10/2013 | WO2012110193A3 Curable polymer materials |
| 01/10/2013 | US20130012668 Monofunctional, bifunctional, and multifunctional phosphinated phenols and their derivatives and preparation method thereof |
| 01/10/2013 | US20130012624 Method for producing semiconductor encapsulating resin composition and pulverizing apparatus |
| 01/10/2013 | US20130012623 Methods and manufactures related to encapsulation of silica aerogel powder |
| 01/10/2013 | US20130012621 Thermosetting resin composition, b-stage heat conductive sheet, and power module |
| 01/10/2013 | US20130012618 Resin composition, polymer, cured film and electronic part |
| 01/10/2013 | US20130011682 Resin composition, and prepeg and laminate prepared using the same |
| 01/10/2013 | CA2840999A1 Resins, resin/fibre composites, methods of use and methods of preparation |
| 01/09/2013 | EP2543705A2 Epoxy resin composition for electronic component encapsulation and electronic component device using the same |
| 01/09/2013 | EP2543693A1 Epoxy resin composition for carbon-fiber-reinforced composite material, prepreg, integrated molding, fiber-reinforced composite sheet, and casing for electrical/electronic equipment |
| 01/09/2013 | EP2543687A1 Resin composition, prepreg, and laminated sheet |
| 01/09/2013 | EP2542637A2 Two-component structural adhesive which is impact resistant at room temperature |
| 01/09/2013 | EP2542602A1 Amino group terminated impact strength modifier and use thereof in epoxy resin compositions |
| 01/09/2013 | CN102869507A Composite material for structural applications |
| 01/09/2013 | CN102863807A Epoxy asphalt and preparation method thereof, as well as concrete containing same |
| 01/09/2013 | CN102863802A Inner packaging material for Chinese tradition medicine, and preparation of inner packaging material |
| 01/09/2013 | CN102863779A Preparation method of composite material of interpenetrating polymer network and carbon nanotubes |
| 01/09/2013 | CN102863747A High-temperature-resistance high-strength epoxy foam plastic and preparation method thereof |
| 01/09/2013 | CN102863746A Flame-retardant phenol formaldehyde epoxy composite material |
| 01/09/2013 | CN102863745A Resin adhesive solution and preparation method and method for preparing insulating laminated sheet by adhesive solution |
| 01/09/2013 | CN102863744A High-power packaging epoxy resin composition with good forming performances |
| 01/09/2013 | CN102863743A Epoxy resin composition for electronic component encapsulation and electronic component device using the same |
| 01/09/2013 | CN102863742A 热硬化性树脂组成物及其应用 Thermosetting resin composition and its application |
| 01/09/2013 | CN102863737A Preparation method of halogen-free flame-retardant epoxy-resin-modified phenolic FRP material |
| 01/09/2013 | CN102863736A Flame-retardant phenol formaldehyde resin molding material |
| 01/09/2013 | CN102863714A Multipurpose waterproof sealing material |
| 01/09/2013 | CN102863706A Polystyrene/thermosetting resin syntactic foam and method for preparing same |
| 01/09/2013 | CN102863676A Silver ion plastic board prepared from waste plastic |
| 01/09/2013 | CN102862207A Potato-dregs medium-density fiberboard and preparation method thereof |
| 01/09/2013 | CN102382314B Preparation method and application of modified organic silicon resin |
| 01/09/2013 | CN102250355B Fluorine- and epoxide group-containing polysiloxane, and preparation method and application thereof |
| 01/09/2013 | CN102241869B Composition, formed body prepared therefrom and preparation method of formed body |
| 01/09/2013 | CN102070909B 阳离子改性沥青及其制备方法 Cation-modified asphalt and its preparation method |
| 01/09/2013 | CN102061060B High-reliability intelligent-card encapsulating glue and preparation method thereof |
| 01/09/2013 | CN101679599B Catalyst for curing epoxides |
| 01/09/2013 | CN101560226B Novel phosphorus series compound as well as preparation method and application thereof |
| 01/09/2013 | CN101522792B Epoxy resin molding material for sealing and electronic component device |