Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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02/13/2013 | CN102924870A Low-density halogen-free flame retardant type high-strength composite material as well as preparation method and use thereof |
02/13/2013 | CN102924869A Application of black modified silicon dioxide |
02/13/2013 | CN102924868A Fireproof flame-retardant high polymer material |
02/13/2013 | CN102924865A Cyanate ester resin composition and prepreg prepared from same, laminate and metal foil plated laminate produced by using prepreg |
02/13/2013 | CN102924741A Method for enhancing surface abrasion resistance of liquid molding composite material |
02/13/2013 | CN102924736A Preparation of carbon fiber/ carbon nano tube/ epoxy resin composite material and assisted by freezing and drying |
02/13/2013 | CN102924690A Epoxy resin material used for toughening and reinforcing of hyperbranched polyether type epoxy resin and preparation method thereof |
02/13/2013 | CN102924681A Isocyanate fluorinated polyurethane modified epoxy resin and preparation method thereof |
02/13/2013 | CN102408714B Toughened polyimide laminated board and manufacturing method thereof |
02/13/2013 | CN102276797B Epoxy resin composition with excellent temperature cycle performance and preparation method thereof |
02/13/2013 | CN102276788B Epoxy resin based on gallic acids as well as preparation method and application thereof |
02/13/2013 | CN102040804B 环氧树脂组成物 An epoxy resin composition |
02/13/2013 | CN101945946B Flame-retardant resin composition and coated electrical wire |
02/13/2013 | CN101920587B High-performance fire-retarding epoxy resin composite material and preparation thereof |
02/13/2013 | CN101851388B Liquid resin composition for electronic component and electronic component device |
02/13/2013 | CN101538397B Epoxy resin composition, glue film made of same and preparation method |
02/13/2013 | CN101111560B Amphiphilic block copolymer-toughened epoxy resins |
02/12/2013 | US8372922 One component epoxy resin composition and motor or dynamo using the same |
02/12/2013 | US8372916 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
02/12/2013 | CA2398280C Epoxide polymer surfaces |
02/07/2013 | WO2013020004A1 Glass filled copolymer products for thin wall and high surface gloss articles |
02/07/2013 | WO2013019092A2 Epoxy resin composition with excellent moldability and metal copper clad laminate for printed circuit board including same |
02/07/2013 | WO2013019085A2 Composition for preparing thermosetting resin and cured article thereof, prepreg including cured article, and metal foil laminated plate and printed wiring board employing prepreg |
02/07/2013 | WO2013018847A1 Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and method for producing semiconductor device |
02/07/2013 | WO2013018525A1 Epoxy resin composition for cast molding and electrical device using same |
02/07/2013 | WO2013017471A2 Sizing composition for charges used in thermoplastic polymeric material reinforcement, reinforced polymeric materials and method of manufacture |
02/07/2013 | WO2013016865A1 An oxazolidone ring containing vinyl ester resin and products therefrom |
02/07/2013 | WO2012126391A9 HIGH PERFORMANCE DIE ATTACH ADHESIVES (DAAs) NANOMATERIALS FOR HIGH BRIGHTNESS LED |
02/07/2013 | US20130035411 Thermal expansion control employing platelet fillers |
02/07/2013 | US20130032751 Heat transfer compositions |
02/07/2013 | CA2843659A1 Thermoset resin compositions with increased toughness |
02/06/2013 | EP2554594A1 Sizing composition for charges used in thermoplastic polymeric material reinforcement, reinforced polymeric materials and method of manufacture |
02/06/2013 | EP2554581A1 Prepreg, fiber-reinforced composite material, and method for producing prepreg |
02/06/2013 | EP2554561A1 Epoxy resin composition for prepreg, prepreg, and multilayer printed circuit board |
02/06/2013 | CN102918107A Prepreg, metal-clad laminate, and printed circuit board |
02/06/2013 | CN102918106A Semiconductor-sealing epoxy resin composition and semiconductor device using same |
02/06/2013 | CN102918105A Electroconductive composition, solar battery cell, and method for producing solar battery cell |
02/06/2013 | CN102911502A Cyanate ester resin composition, prepreg manufactured by using cyanate ester resin composition, laminated material and metal-clad laminated material |
02/06/2013 | CN102911501A Resin composition and substrate using same |
02/06/2013 | CN102911487A Glass fiber reinforced polybutylece terephthalate (PBT)/acrylonitrile styrene acrylate (ASA) alloy material and preparation method thereof |
02/06/2013 | CN102911479A High heat conduction epoxy resin composition applicable to fully wrapped devices and preparation method |
02/06/2013 | CN102911478A Epoxy resin composition for optical semiconductor device, lead frame for optical semiconductor device and substrate for optical semiconductor device obtained using the same, and optical semiconductor device |
02/06/2013 | CN102911458A Polyvinyl chloride (PVC) sheet produced by utilizing waste PVC |
02/06/2013 | CN102911404A Formula of plastic with elastic component |
02/06/2013 | CN102391473B Preparation method for anhydride cured epoxy resin/palygorskite nanocomposite material |
02/06/2013 | CN102020831B Composite material for wind power generation blades |
02/06/2013 | CN101787290B Method for preparing polyimide intercalated grafted magnesium hydroxide flame retardant |
02/06/2013 | CN101638519B Resin composition for encapsulating optical semiconductor element |
02/06/2013 | CN101522750B Composite materials with improved performance |
02/06/2013 | CN101263197B 增韧的组合物 Toughened compositions |
01/31/2013 | WO2013015659A2 Epoxy resin compound and radiant heat circuit board using the same |
01/31/2013 | WO2013015577A1 Heat-curable resin composition, and prepreg and metal foil-stacked plate using same |
01/31/2013 | WO2013014077A1 Epoxy composition |
01/31/2013 | WO2012131009A8 Polymeric formulations with chemically adjustable rheology for the manufacture of prepregs and articles made of composite material |
01/31/2013 | US20130030085 One-pack type resin composition for use in backing |
01/31/2013 | US20130030084 Resin composition and resin-molded product |
01/31/2013 | US20130028540 Epoxy resin curing agent, epoxy resin composition, and adhesive agent for lamlinate |
01/31/2013 | US20130026662 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
01/31/2013 | US20130026661 Liquid epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same |
01/31/2013 | US20130026660 Liquid epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same |
01/31/2013 | US20130026648 Film for forming semiconductor protection film, and semiconductor device |
01/30/2013 | EP2550327A2 Epoxy resin composition with reduced toxicity |
01/30/2013 | CN102906934A Photoelectric conversion element using thermosetting sealing agent for photoelectric conversion element |
01/30/2013 | CN102906198A Curable composition, hardened material, and method for using curable composition |
01/30/2013 | CN102906189A Compositions having phosphorus-containing compounds |
01/30/2013 | CN102906188A Environmentally friendly water-based epoxy resin composition and a use therefor |
01/30/2013 | CN102905877A Acid-hardening epoxy thermoset resins and composites that can be hot-processed and recycled |
01/30/2013 | CN102903514A End sealing process for multilayer foil coil of dry-type transformer |
01/30/2013 | CN102899963A Latex composition and paper applying same |
01/30/2013 | CN102898848A Epoxy-modified asphalt material and preparation method thereof |
01/30/2013 | CN102898806A Antistatic polycarbonate/polyester alloy material and preparation method thereof |
01/30/2013 | CN102898803A Wear-resistant engineering plastic |
01/30/2013 | CN102898799A Biobased artificial stone and production process thereof |
01/30/2013 | CN102898787A Print through reduction in long fiber reinforced composites by addition of carbon nanotubes |
01/30/2013 | CN102898786A Epoxy molding compound for packaging tantalum capacitor and manufacturing method for epoxy molding compound |
01/30/2013 | CN102898785A Encapsulation adhesive for smart card, and preparation method thereof |
01/30/2013 | CN102898784A Enhanced environment protection fire retardation ally material |
01/30/2013 | CN102898783A Modified environment protection material |
01/30/2013 | CN102898782A Sealant with high barrier property |
01/30/2013 | CN102898781A Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
01/30/2013 | CN102898780A Heat-conductive electrical insulating polymer and radiating substrate containing heat-conductive electrical insulating polymer |
01/30/2013 | CN102898779A Composite material and method for preparing substrate based on composite material |
01/30/2013 | CN102898679A Method for preparing nitrogen, phosphorus and boron integrated expansion type fire retardant |
01/30/2013 | CN102898622A Epoxy resin for preparing carbon fiber prepreg by using low temperature hot melting method and preparation method |
01/30/2013 | CN102295824B One-part high-performance epoxy resin composition for pultrusion |
01/30/2013 | CN102251904B Cavitation-resistant and energy-saving modification method of water turbine |
01/30/2013 | CN102250470B Dynamic sealant and preparation method thereof |
01/30/2013 | CN102124054B Unsaturated ester resin composition, unsaturated ester-cured product, and manufacturing method therefor |
01/30/2013 | CN102027041B 不粘涂层组合物 Non-stick coating composition |
01/30/2013 | CN101985514B Thermosetting resin composition and preparation method and using method thereof |
01/30/2013 | CN101718150B Composite material tower and manufacturing process thereof |
01/30/2013 | CN101077922B ABS/PC modified alloy |
01/29/2013 | US8362116 Low dielectric resin varnish composition for laminates and the preparation thereof |
01/29/2013 | US8362115 Epoxy resin composition |
01/24/2013 | WO2013012587A2 Semiconductor package resin composition and usage method thereof |
01/24/2013 | WO2013011832A1 Curable epoxy resin composition |
01/24/2013 | WO2013011677A1 Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board |
01/24/2013 | WO2013010788A2 Polyetheramines used as accelerating agents in epoxy systems |
01/24/2013 | WO2012157938A3 Thermosetting resin composition for light reflection, preparation method thereof, reflecting plate for loading photonic semiconductor prepared therefrom, and photonic semiconductor device containing same |
01/24/2013 | WO2012157903A3 Epoxy resin composition for neutron shielding, and method for preparing same |