Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
05/2013
05/01/2013CN102181091B Adhesive and modified EVA (ethylene vinyl acetute) foaming composite for automobiles
05/01/2013CN102153877B Graphene composite material and preparation method thereof
05/01/2013CN102146194B Conductive resin composition and chip-type electronic component
05/01/2013CN102127289B Halogen-free flame-retardant epoxy resin composition, and adhesive film and copper-clad plate prepared from same
05/01/2013CN102115600B Thermosetting resin composition, prepreg and laminated board
05/01/2013CN101508844B Resin composition, prepreg and their uses
04/2013
04/30/2013US8431655 Curatives for epoxy compositions
04/30/2013US8431654 Epoxy resin composition
04/30/2013US8431224 Resin composition for forming insulating layer of printed wiring board
04/30/2013US8431223 Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications
04/25/2013WO2013059238A1 Making epoxidized esters from epoxidized natural fats and oils
04/25/2013WO2013058324A1 Sealant for liquid crystal dropping process, vertical-conduction material, and liquid crystal display element
04/25/2013WO2013056426A1 Halogen-free low-dielectric resin composition, and prepreg and copper foil laminate made by using same
04/25/2013WO2013056419A1 Epoxy resin composition and high frequency electronic-circuit substrate manufactured by using the same
04/25/2013WO2013056411A1 Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same
04/25/2013WO2013032238A3 Epoxy resin compound and radiant heat circuit board using the same
04/25/2013US20130100210 Sealant, inkjet recording head using sealant, and method for manufacturing the same
04/25/2013US20130099396 Wafer backside coating process with pulsed uv light source
04/25/2013CA2852091A1 Making epoxidized esters from epoxidized natural fats and oils
04/24/2013EP2584002A1 Acrylic rubber composition, vulcanizate, hose part, and sealing part
04/24/2013EP2582744A1 Accelerator solution and process for curing curable resins
04/24/2013EP2582740A1 Use of cyclic carbonates in epoxy resin compositions
04/24/2013CN103068917A Curable epoxy resin composition and photosemiconductor device using same
04/24/2013CN103068916A Heat-curable resin filler
04/24/2013CN103068877A Latent curing agent composition and one-part curable epoxy resin composition
04/24/2013CN103068875A Resin composition, molded object and substrate material both obtained from the resin composition, and circuit board including the substrate material
04/24/2013CN103062516A Polymer alloy composite cement water supply pipe and manufacture method thereof
04/24/2013CN103059567A Fire-retarding hexagonal boron nitride/thermosetting resin composite material and preparation method thereof
04/24/2013CN103059566A Resin composition for printed circuit board and printed circuit board including the same
04/24/2013CN103059521A A flame-retardant polyester compound and a preparation method thereof
04/24/2013CN103059517A Environmentally-friendly copper-clad plate glue solution, copper-clad plate and preparation method thereof
04/24/2013CN103059516A Fast-cure epoxy powder composition
04/24/2013CN103059515A 乙烯基酯树脂改性的环氧灌封胶及其制备方法 Vinyl ester resin-modified epoxy potting and its preparation method
04/24/2013CN103059514A Preparation method of magnetic lyophoby type carbon nano tube base nanochannel damping plate and damper
04/24/2013CN103059513A Castable for manufacturing high-voltage motor nano composite main insulation
04/24/2013CN103059512A Resin protective sizing agent and preparation method thereof
04/24/2013CN103059511A Epoxy-based composite dielectric material and preparation method thereof
04/24/2013CN103059510A Compositions useful for preparing composites and composites produced therewith
04/24/2013CN103059509A Liquid acrylonitrile butadiene rubber-modified polymer matrixself-lubricating material
04/24/2013CN103059339A 9,10-dihydro-9-oxa-10-phosphenanthrene-10-oxide (DOPO) group phosphorus-nitrogen flame retardant and preparation method and application thereof
04/24/2013CN103059328A Preparation method of non-conductive thin film
04/24/2013CN103059267A Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof
04/24/2013CN103059266A Preparation method of phosphorus-containing cresol novolac epoxy resin
04/24/2013CN103059264A A phosphorus-containing diglycidyl ether, a preparation method thereof and a flame-retardant cured epoxy resin containing the same
04/24/2013CN103057214A Environment-friendly glue solution for LED full-color display, copper clad laminate and preparation method thereof
04/24/2013CN103057213A Environment-friendly copper clad laminate for LED monochrome display, glue solution and preparation method
04/24/2013CN102516718B Resin composition and metal-based copper-clad plate using resin composition as heat conducting insulation layer
04/24/2013CN102250448B Epoxy resin/carbon nanotube high-strength lightweight composite material, and preparation method thereof
04/24/2013CN102197070B Epoxide-based structural foam having improved tenacity
04/24/2013CN102190778B Epoxy resin latent curing agent with coupling property
04/24/2013CN101952364B Microencapsulated silane coupling agent
04/24/2013CN101528797B Derivatized solid epoxy resin and uses thereof
04/23/2013US8425747 Cathodic electrodeposition coatings containing polymethylene urea
04/18/2013WO2013056021A1 Composite metal surface
04/18/2013WO2013017471A3 Sizing composition for charges used in thermoplastic polymeric material reinforcement, reinforced polymeric materials and method of manufacture
04/18/2013WO2013012587A3 Semiconductor package resin composition and usage method thereof
04/18/2013WO2013009113A9 Epoxy resin compound and radiant heat circuit board using the same
04/18/2013US20130096234 Color indicating epoxy resins and methods thereof
04/18/2013US20130096233 Epoxy resin composition for prepreg, prepreg, and multilayer printed circuit board
04/18/2013US20130096232 Curable epoxy resin compositions and composites made therefrom
04/17/2013EP2580287A2 Anticrater agent for electrocoating composition
04/17/2013EP2414444B1 Direct overmolding
04/17/2013CN103052687A Functional particle, group of functional particles, filler, resin composition for electronic part, electronic part, and semiconductor device
04/17/2013CN103052682A Liquid composition, and resistor film, resistor element and circuit board using same
04/17/2013CN103052681A Hardener for epoxy resins
04/17/2013CN103052667A Curing resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material
04/17/2013CN103044918A Organosilicone resin/epoxy resin hybrid materials for packaging light emitting diodes
04/17/2013CN103044870A Resin composition and resin molded article
04/17/2013CN103044860A Composite foam heat insulating material and preparation method thereof
04/17/2013CN103044859A Waterproof insulation epoxy resin composition, adhesive tape and preparation method thereof
04/17/2013CN103044858A Thermosetting resin composition, preparation method and use thereof
04/17/2013CN103044857A Epoxy resin silica sol, epoxy resin organic-inorganic nano hybrid material and preparation method thereof
04/17/2013CN103044856A Waterborne epoxy resin curing agent and preparation method thereof
04/17/2013CN103044855A Preparation method of high-thermal-conductivity insulating layer material for high-power LED encapsulation
04/17/2013CN103044796A Epoxy resin-reinforced polystyrene halogen-free flame-retardant material and preparation method thereof
04/17/2013CN103044780A 3D wide-angle orthographic-projection high-definition optical display screen and fabrication method
04/17/2013CN103044772A Resin glass fiber formula and resin glass fiber type tile prepared by same
04/17/2013CN103044722A High-strength rubber impeller
04/17/2013CN103044708A High-efficiency N/P flame retardant, as well as preparation method and application thereof
04/17/2013CN103044705A Thermosetting epoxy resin under microwave condition and degradation method of composite material of thermosetting epoxy resin in ionic liquid
04/17/2013CN103044672A Preparation method of thermotropic polyester liquid crystal for toughening epoxy resin
04/17/2013CN102585290B Method for preparing melamine cyanurate with large particle size and wide distribution
04/17/2013CN102382320B Method for preparing carbon nanotube grafted glass fiber multiscale reinforcement reinforced epoxy resin composite
04/17/2013CN102286190B Halogen-free resin composition and copper clad plate prepared from composition
04/17/2013CN102272228B Metal stabilizers for epoxy resins
04/17/2013CN102264838B 固化性组合物 The curable composition
04/17/2013CN102076735B Epoxy resin composition and prepreg using same
04/16/2013US8420745 Thermally curable solder resist composition
04/16/2013US8420717 Polyol functionalized water soluble carbon nanostructures
04/16/2013CA2538753C Method and composition for recovering hydrocarbon fluids from a subterranean reservoir
04/11/2013WO2013051497A1 Epoxy resin composition, and method for producing same
04/11/2013WO2013051227A1 Resin composition, insulation body for build-up purposes which comprises said composition, and prepreg produced using said composition
04/11/2013US20130090413 Water-dispersible epoxy resin, water-based epoxy resin composition and cured product thereof
04/11/2013US20130089743 Resin composition, prepreg, and laminated sheet
04/11/2013US20130088542 Epoxy resin composition
04/10/2013EP2578632A1 Prepreg, metal-clad laminate, and printed circuit board
04/10/2013EP2578631A1 Resin composition, and prepreg and laminated sheet using same
04/10/2013EP2578630A1 Epoxy resin composition and its preparing method
04/10/2013EP2576193A1 Acid-hardening epoxy thermoset resins and composites that can be hot-processed and recycled
04/10/2013CN103038286A Coating having improved hydrolytic resistance
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