Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
03/2013
03/27/2013CN102304265B Extrusion-grade inflaming retarding ACS (acrylonitrile-chlorinated polyethylene-styrene) resin and preparation method thereof
03/27/2013CN102163563B Epoxy resin formulations for underfill applications
03/27/2013CN102131867B Magnetic sheet composition, magnetic sheet, and process for producing magnetic sheet
03/27/2013CN102020758B Low temperature curable epoxy compositions containing phenolic-blocked urea curatives
03/27/2013CN102009509B Manufacturing technology of embedded co-curing high-damping composite and laminate material structure
03/27/2013CN101993575B Composition for anisotropic conductive film
03/27/2013CN101945952B Resin composition and cured film thereof
03/27/2013CN101914242B Ultrahigh molecular weight polypropylene/ultrahigh molecular weight polythene/epoxy resin composite membrane
03/27/2013CN101851387B Thermosetting resin composition and cured product thereof
03/27/2013CN101836522B Magnetic sheet
03/26/2013US8404339 Prepreg containing epoxy resin with improved flexural properties
03/21/2013WO2013040202A1 Epoxy resin composition and epoxy polymer produced using the same
03/21/2013WO2012161490A3 Epoxy resin compound and radiant heat circuit board using the same
03/21/2013US20130072611 Plasticizer and method of preparing the same
03/21/2013US20130072595 Curing of epoxy resin compositions comprising cyclic carbonates using mixtures of amino hardeners and catalysts
03/21/2013DE102011113395A1 New cyclohexylamine compounds useful for the preparation of a hardened product, preferably epoxide resin, which is useful e.g. in electrical equipments and for manufacturing rotor blades for wind turbines
03/20/2013CN102985486A 树脂组合物 Resin composition
03/20/2013CN102985485A Thermosetting resin composition, cured product thereof, active ester resin, semiconductor sealing material, prepreg, printed circuit board, and build-up film
03/20/2013CN102985483A Inorganic-organic hybrid material, optical material using same, and inorganic-organic composite composition
03/20/2013CN102985461A 固化性树脂组合物 The curable resin composition of the
03/20/2013CN102979097A Weaving sleeve pipe type fiber reinforce plastic (FRP) rib and preparation method thereof
03/20/2013CN102977620A Modified asphalt composite
03/20/2013CN102977603A High temperature resistance high heat conduction PPS/PPO alloy and preparation method thereof
03/20/2013CN102977573A Refractory fiber material
03/20/2013CN102977571A Novel bulk molding compound and preparation method thereof
03/20/2013CN102977557A Room temperature curing epoxy resin composition and preparation method thereof
03/20/2013CN102977556A High-performance epoxy resin composition for vacuum infusion molding and preparation method thereof
03/20/2013CN102977555A Light epoxy grouting material as well as preparation method and application thereof
03/20/2013CN102977554A Epoxy/organosilicon co-curing composite material for LED packaging and preparation method
03/20/2013CN102977553A Epoxy/silicone polymer composite material, and preparation method and application thereof
03/20/2013CN102977552A Fiber-enhanced resin matrix composite material and preparation method thereof
03/20/2013CN102977551A Halogen-free resin composition and method for preparing copper-clad plate from the halogen-free resin composition
03/20/2013CN102977545A Halogen-free fire retardation and ammonia release-free phenol formaldehyde fiber reinforced plastic material
03/20/2013CN102977540A Method for preparing organic polymer matrix composite material and LED (Light-Emitting Diode) radiator
03/20/2013CN102977387A Thermoset resin fibres used in composite materials
03/20/2013CN102977340A A curable epoxy resin composition having a mixed catalyst system and laminates made therefrom
03/20/2013CN102977337A C-grade modified bismaleimide glass fiber reinforced mould plastic
03/20/2013CN102977336A Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
03/20/2013CN102352089B Vegetable fiber reinforced biomass resin lamellar material and preparation method thereof
03/20/2013CN102234407B Flame-retardant acrylonitrile-butadiene-styrene resin composition and preparation method thereof
03/20/2013CN101938120B Production method of moisture-proof high-tightness surge protective device
03/19/2013US8399577 Curable epoxy resin composition
03/19/2013CA2660875C Thermosetting resin composition, and prepreg, laminated board for wiring board and printed wiring board using the same
03/19/2013CA2526461C Process for producing modified epoxy resin
03/14/2013WO2013036502A1 Epoxy formulations and processes for fabrication of relief patterns on low surface energy substrates
03/14/2013WO2013035685A1 Conductive resin composition and cured object using same
03/14/2013WO2013035681A1 Embedding resin composition for electron microscope, and method for observing sample on electron microscope using said composition
03/14/2013WO2013035542A1 Resin composition for sealing optical semiconductor, and optical semiconductor device using same
03/14/2013US20130065987 Thermal conductive sheet and producing method thereof
03/14/2013US20130065040 Preparations for producing reinforcing fibers for use in concrete utilizing polychloroprene dispersions
03/14/2013US20130064658 Compressor case lining
03/13/2013EP2566922A1 1c epoxy resin composition with reduced toxicity
03/13/2013EP2566908A2 Potting for electronic components
03/13/2013CN102971367A Method for producing porous thermosetting resin sheet and composite separation membrane using same
03/13/2013CN102971354A Potting for electronic components
03/13/2013CN102966018A Temperature-controllable paving material
03/13/2013CN102964858A High-performance asphalt composition
03/13/2013CN102964856A Preparation method of bio-based solubilizing and toughening agent-modified epoxy asphalt material
03/13/2013CN102964854A Road asphalt modifier
03/13/2013CN102964853A Additive for enhancing road asphalt ductility
03/13/2013CN102964781A Production method of epoxy resin electronic potting material
03/13/2013CN102964780A Epoxy resin composition for vacuum introduction formation of fibre reinforced composite material and preparation method of epoxy resin composition
03/13/2013CN102964779A Energy-saving epoxy resin glass fiber reinforced plastic for buildings
03/13/2013CN102964778A Preparation method of ionic liquid-epoxy resin composite material
03/13/2013CN102964777A Phosphorus-containing and halogen-free flame retardant resin adhesive as well as preparation method and application thereof
03/13/2013CN102964776A Packaging resin composition
03/13/2013CN102964775A Thermosetting resin composition and use thereof
03/13/2013CN102964774A Manufacturing method of soft magnetic alloy composite material
03/13/2013CN102964731A High-strength PVC (Polyvinyl Chloride) pipe
03/13/2013CN102964729A Heat-resistant and high pressure-resistant PVC (Polyvinyl Chloride) tube
03/13/2013CN102964728A High anti-impact PVC (Polyvinyl Chloride) pipe
03/13/2013CN102964693A High-efficiency flame retardant composition
03/13/2013CN102964650A Modified nonpolar rubber and preparation method thereof
03/13/2013CN102964649A Manufacturing method for car damping materials
03/13/2013CN102964567A Epoxy resin curing agent
03/13/2013CN102617985B Hybrid reinforced epoxy resin-based piezoelectric damping composite material and preparation method thereof
03/13/2013CN102417666B Low pressure power steering tube rubber composition with chlorinated polyethylene rubber as main component
03/13/2013CN102408677B SiC/epoxy resin composite material and method for manufacturing pump components with it
03/13/2013CN102382282B Flexible curing agent applicable to electronic packaging material and synthesis method thereof
03/13/2013CN102174244B Insulating water-proof epoxy resin composition, adhesive tape and preparation methods thereof
03/13/2013CN102079810B Synthesis and application of light-cured polyurethane-acrylic acid-epoxy resin adhesive
03/13/2013CN102010574B Flame-retardant molding compositions
03/13/2013CN101864151B Flame retardant resin composition for highly peel-strenghthened printed circuit board, printed circuit board using the same and manufacturing method thereof
03/13/2013CN101688051B Epoxy resin-forming liquid preparation containing inorganic particle
03/12/2013US8394493 a mixture of elastomers, film forming resins, epoxy resins, hardeners, silane coupling agents, fillers and phenolic resins, having tensile strength, heat and moisture resistance
03/12/2013CA2509087C Castor oil/epoxidized soybean oil based elastomeric compositions
03/07/2013WO2013033147A1 Coating compositions for food and beverage containers
03/07/2013WO2013032238A2 Epoxy resin compound and radiant heat circuit board using the same
03/07/2013WO2013031593A1 Resin composition for sealing electrical and electronic parts, method for producing sealed electrical and electronic parts, and sealed electrical and electronic parts
03/07/2013WO2013030998A1 Resin composition, resin sheet, resin sheet with metal foil, hardened resin sheet, structure, and semiconductor device for power or light source
03/07/2013WO2013029831A1 Use of hydrophobic epoxide resin system for encapsulation of a instrument transformer
03/07/2013WO2013029295A1 Railway-specific baffle base for elastic bar-type fastener made of modified, thermosetting, ultra-high molecular epoxy resin
03/07/2013WO2012110193A4 Curable polymer materials
03/07/2013US20130059947 Carbon nanotube-reinforced nanocomposites
03/07/2013US20130059945 Curable compositions
03/07/2013US20130059944 Resin composition containing ultrafine silver particles
03/07/2013US20130059090 Resist material for imprinting, pattern formation method, and imprinting apparatus
03/07/2013US20130056686 Curable resin composition, adhesive epoxy resin paste, die-bonding agent, non-conductive paste, adhesive epoxy resin film, non-conductive epoxy resin film, anisotropic conductive paste, and anisotropic conductive film
03/06/2013CN102959007A Thermally conductive reinforcing composition, thermally conductive reinforcing sheet, reinforcing method and reinforcing structure
03/06/2013CN102959006A Epoxy resin composition and semiconductor device
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