Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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06/19/2013 | CN101914264B Electric-insulation heat-conduction epoxy resin composite material and preparation method thereof |
06/19/2013 | CN101698739B Carbon fiber composite core composition and method for preparing carbon fiber composite core |
06/19/2013 | CN101516992B Comb-like polyether alkanolamine in ink and paint |
06/18/2013 | US8466238 Latent curing agents, epoxy resin compositions containing the same, sealing materials, and organic EL displays |
06/18/2013 | US8466216 Low odor binders curable at room temperature |
06/18/2013 | US8465837 Epoxy resin composition, prepreg, laminate board, multilayer printed wiring board, semiconductor device, insulating resin sheet, and process for manufacturing multilayer printed wiring board |
06/18/2013 | US8465666 Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition |
06/13/2013 | WO2013084819A1 Resin composition, prepreg, and laminate |
06/13/2013 | WO2013083564A1 Compositions containing a vinyl ester resin that can be used to obtain materials having an optimised performance, and materials obtained from said compositions |
06/13/2013 | WO2013083062A1 Epoxy-modified polyphenylene oxide resin, resin composition and applications thereof |
06/13/2013 | WO2013019092A3 Epoxy resin composition with excellent moldability and metal copper clad laminate for printed circuit board including same |
06/13/2013 | WO2013019085A3 Composition for preparing thermosetting resin and cured article thereof, prepreg including cured article, and metal foil laminated plate and printed wiring board employing prepreg |
06/13/2013 | WO2013017843A3 Thermoset resin compositions with increased toughness |
06/13/2013 | WO2013009113A3 Epoxy resin compound and radiant heat circuit board using the same |
06/13/2013 | US20130150504 Blends of polyphenylene ether sulfone and silicone polyester carbonate |
06/13/2013 | US20130150485 Cathodic electrocoating compositions |
06/13/2013 | US20130150471 Catalyzed epoxy-carboxylic acid spray foams and methods of using same |
06/13/2013 | US20130146344 Insulating resin composition for printed circuit board and printed circuit board including the same |
06/13/2013 | CA2798797A1 Catalyzed epoxy-carboxylic acid spray foams and methods of using same |
06/12/2013 | EP2602289A2 Epoxy resin composition for electronic parts encapsulation and electronic parts-equipped device using the same |
06/12/2013 | EP2602288A1 Liquid composition, and resistor film, resistor element and circuit board using same |
06/12/2013 | CN103154131A Improving solvent resistance of epoxy resins toughened with polyethersulfone |
06/12/2013 | CN103154130A Radiation curable composition |
06/12/2013 | CN103154129A Epoxy composite |
06/12/2013 | CN103154072A 固化性环氧树脂组合物 Curable epoxy resin composition |
06/12/2013 | CN103148138A Friction and/or sliding liner |
06/12/2013 | CN103146205A High-performance epoxy asphalt composite material capable of enabling roads to be rapidly open to traffic and preparation method thereof |
06/12/2013 | CN103146197A Method for preparing lyophobic heat conduction material with micro-nano core-shell structure |
06/12/2013 | CN103146150A Novel epoxy resin curing agent |
06/12/2013 | CN103146149A Curing agent composition, and preparation method and application thereof |
06/12/2013 | CN103146148A Halogen-free flame retardant epoxy resin composition and dry type transformer poured by same |
06/12/2013 | CN103146147A Toughened epoxy resin/glass fiber prepreg and preparation method |
06/12/2013 | CN103146146A Epoxy nanocomposite with controllable phase structure and based on polyhedral oligomeric silsesquioxanes (POSS) |
06/12/2013 | CN103146145A Environment-friendly material for motor vehicles |
06/12/2013 | CN103146144A Material for internal decoration of automobiles |
06/12/2013 | CN103146143A Automobile interior decoration environmental-friendly alloy material |
06/12/2013 | CN103146142A Composite vibration insulator for electrostatic deduster and preparation method thereof |
06/12/2013 | CN103146141A Low dielectric constant polyhedral oligomeric silsesquioxane (POSS)/ epoxy resin hybrid material and preparation method |
06/12/2013 | CN103146140A Dispersion method for carbon nanotubes in epoxy resin |
06/12/2013 | CN103146139A Epoxy resin composition for electronic parts encapsulation and electronic parts-equipped device using the same |
06/12/2013 | CN103146138A Epoxy resin composition, and prepreg and metal-clad laminate using the same |
06/12/2013 | CN103146024A Porous graphene/polymer composite structure and preparation method and application thereof |
06/12/2013 | CN103145949A Cristalline epoxy resin |
06/12/2013 | CN103145924A Insulating impregnating resin for drawing groove wedge and its curing method |
06/12/2013 | CN102516714B Preparation method of nano epoxy resin composite material |
06/12/2013 | CN102516642B Automobile support and manufacturing method thereof |
06/12/2013 | CN102504494B Single-component epoxy resin potting compound and preparation method thereof |
06/12/2013 | CN102476459B Manufacturing method of dielectric substrate and metamaterial |
06/12/2013 | CN102337005B Resin composition, method of its composition, and cured formulation |
06/12/2013 | CN102304273B Thermosetting epoxy resin composition and epoxy fiberglass cloth-based copper clad laminate prepared from same |
06/12/2013 | CN102304271B Thermosetting epoxy resin composition and epoxy fiberglass cloth-based copper clad laminate prepared from same |
06/12/2013 | CN102286191B High-temperature-resistant insulating composite material sheet and preparation method thereof |
06/12/2013 | CN102070874B High-permeability and high-strength epoxy grouting material, preparation method thereof and application thereof |
06/12/2013 | CN101921427B Functional high-polymer decorative composite material and preparation method thereof |
06/12/2013 | CN101880407B Method for preparing modified epoxy soybean oil for electronic grade product copper clad laminate |
06/12/2013 | CN101759981B Scale-free low-volatility polycarbonate compound |
06/12/2013 | CN101367982B Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device |
06/11/2013 | US8461275 Curing agents and process for their manufacture |
06/11/2013 | US8461231 Rapid dry fiberglass stain |
06/06/2013 | WO2013082396A1 Epoxy curative composition and compositions therefrom |
06/06/2013 | WO2013081061A1 Aggregated boron nitride particles, composition containing said particles, and three-dimensional integrated circuit having layer comprising said composition |
06/06/2013 | WO2013080732A1 One-pack type epoxy resin composition |
06/06/2013 | WO2013080708A1 Resin composition, resin composition sheet, semiconductor device and method for manufacturing same |
06/06/2013 | WO2013080654A1 Resin composition for fixing, rotor, automobile, and method for manufacturing rotor |
06/06/2013 | WO2013079563A1 Dual cure system |
06/06/2013 | WO2013032238A9 Epoxy resin compound and radiant heat circuit board using the same |
06/06/2013 | US20130143363 Adhesive composition for semiconductor and adhesive film comprising the same |
06/06/2013 | US20130143046 Epoxy resin composition, and prepreg and metal-clad laminate using the same |
06/06/2013 | CA2857154A1 Agglomerated boron nitride particles, composition containing said particles, and three-dimensional integrated circuit having layer comprising said composition |
06/06/2013 | CA2857026A1 Epoxy curative composition and compositions therefrom |
06/06/2013 | CA2856956A1 Dual cure system |
06/05/2013 | EP2599812A1 Curing resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material |
06/05/2013 | EP2598573A1 Curable compositions |
06/05/2013 | CN103140543A Polybutylene terephthalate resin film |
06/05/2013 | CN103140538A Thermosetting resin composition, thermosetting products thereof, phenol resin, epoxy resin, and semiconductor sealing material |
06/05/2013 | CN103140537A Resin composition, cured resin product, wiring board, and manufacturing method for wiring board |
06/05/2013 | CN103140533A Epoxy resin compositions |
06/05/2013 | CN103131211A Carbon nano tube-lithium titanium doped nickel oxide compound and preparation method thereof |
06/05/2013 | CN103131181A Toughened cyanate resin and preparation method thereof |
06/05/2013 | CN103131136A Formula and preparation method of high-molecular LED (Light Emitting Diode) radiation material |
06/05/2013 | CN103131135A Laminated magnetic conductive plate raw material composition and production method for manufacturing laminated magnetic conductive plate |
06/05/2013 | CN103131134A Photosensitive synthetic stone raw material composition and production method of photosensitive synthetic stone |
06/05/2013 | CN103131133A Hot solidification type component used for filling printed circuit board |
06/05/2013 | CN103131132A Hot solidification type component used for filling printed circuit board punched hole |
06/05/2013 | CN103131131A Halogen-free resin composition and copper clad laminate and printed circuit board applying the same |
06/05/2013 | CN103131130A Epoxy resin composition and low dielectric constant insulating material employing same |
06/05/2013 | CN103131008A Bismaleimide prepolymer and synthesis method thereof |
06/05/2013 | CN103131007A Thermosetting resin composition and laminated plate and circuit board employing same |
06/05/2013 | CN103130983A Environment-friendly plate material compounded by organic silicon modified epoxy resin and waste circuit board non-metallic powder |
06/05/2013 | CN103130964A Solvent-free impregnating resin for low voltage motor and medium voltage motor and solidification method |
06/05/2013 | CN103130948A Room temperature crosslinkage and curable styrene-acrylate emulsion, and its preparation method |
06/05/2013 | CN102516592B Preparation method of waste plastic composite material modified by waste circuit board non-metal powder |
06/05/2013 | CN102516591B Preparation method of modified wood-plastic composite filled with waste circuit board nonmetal powder |
06/05/2013 | CN102516532B Preparation method for amination polyphenyl ether |
06/05/2013 | CN102504482B Preparation method of rigid nanoparticle interlayer modified liquid-state molded composite material |
06/05/2013 | CN102408726B Aqueous resin dispersion |
06/05/2013 | CN102408675B Epoxy resin crack filling material and preparation method thereof |
06/05/2013 | CN102286139B Toughened epoxy resin composition containing dicyclopentadiene ester ring structure |
06/05/2013 | CN101993581B Cleaning-free activated resinous composition and method for surface mounting using the same |
06/05/2013 | CN101962436B High-temperature-resistant modified polyfunctional epoxy matrix resin for advanced composite material and preparation thereof |