| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 06/05/2013 | CN101920597B Liquid discharge head and method for manufacturing the same |
| 06/04/2013 | US8455594 Phosphorous flame retardant and application thereof to polymer |
| 06/04/2013 | US8455573 Curable composition comprising imidazolium monocarboxylate salt |
| 05/30/2013 | WO2013077218A1 Resin composition for optical semiconductor sealing material |
| 05/30/2013 | WO2013076934A1 Polyethylene terephthalate resin composition and molded articles using same |
| 05/30/2013 | WO2013075938A1 Curable polyisocyanate composition comprising an epoxy resin |
| 05/30/2013 | WO2013075806A2 Epoxy compositions |
| 05/30/2013 | WO2013075805A2 Epoxy compositions |
| 05/30/2013 | WO2013043363A3 Epoxy-functional resin compositions |
| 05/30/2013 | US20130137797 Polyester compositions and insert-molded articles made therefrom |
| 05/30/2013 | US20130136926 Method for producing composition for injection molding and composition for injection molding |
| 05/30/2013 | CA2854689A1 Curable polyisocyanate composition comprising an epoxy resin |
| 05/29/2013 | CN103122125A Resin mixture containing carbon nano tube for carbon fiber wet process winding and preparation method thereof |
| 05/29/2013 | CN103122124A Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| 05/29/2013 | CN103122075A High heat-conducting thin graphene-based composite material, as well as preparation method and application thereof |
| 05/29/2013 | CN102515626B High heat-conductivity epoxy casting material for dry power transformer and preparation method thereof |
| 05/29/2013 | CN102492175B Microcapsule flame-retardant adsorption resin and preparation method thereof, and flame-retardant composite material |
| 05/29/2013 | CN102337013B 改性环氧树脂板 Modified epoxy board |
| 05/29/2013 | CN102229700B Epoxy resin nanometer montmorillonite composite material and preparation method thereof |
| 05/29/2013 | CN102219983B Stiffener film substrate combination, preparation method of stiffener film substrate combination, stiffener film and steel plate composite material |
| 05/29/2013 | CN102177187B Epoxy resins and composite materials with improved burn properties |
| 05/29/2013 | CN102127324B Preparation method of modified graphene oxide and preparation method of composite material containing modified graphene oxide |
| 05/29/2013 | CN102101934B Reinforcing rubber sheet base composition, reinforcing rubber sheet base and steel plate composite material |
| 05/28/2013 | US8450451 Epoxy resin curing agent for enhanced wear resistance and weatherability of cured materials |
| 05/28/2013 | US8450434 Microcomposite with improved acoustic impedance |
| 05/28/2013 | US8450433 Resin composition for manufacturing marble chips, method for manufacturing marble chips, and artificial marble made from marble chips |
| 05/28/2013 | CA2708427C Epoxy-phenolic resins co-dispersions |
| 05/28/2013 | CA2532198C A metal-polyamide/polyethylene-metal laminate |
| 05/23/2013 | WO2013073606A1 Silane-containing composition, curable resin composition, and sealing material |
| 05/23/2013 | WO2013042894A3 Epoxy resin composition, adhesive sheet using same, circuit board including same, and method for manufacturing same |
| 05/23/2013 | WO2012161490A9 Epoxy resin compound and radiant heat circuit board using the same |
| 05/23/2013 | US20130131285 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
| 05/23/2013 | US20130128435 Composition, composition being for end-face sealing display devices and consisting of the composition, display devices, and process for producing same |
| 05/23/2013 | US20130126073 Internal mold release |
| 05/22/2013 | EP2594596A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| 05/22/2013 | EP2593251A1 Free radical initiator compositions containing t-butyl hydroperoxide and their use |
| 05/22/2013 | CN103119079A 三聚氰胺环氧树脂单体及树脂组合物 Melamine monomers and epoxy resin composition |
| 05/22/2013 | CN103115226A External fixing support of 200 DEG C direct burial heat-supply pipeline for preventing heat bridge transfer |
| 05/22/2013 | CN103115224A Slide support seat of 350 DEG C heat-supply overhead pipeline for preventing heat bridge transfer |
| 05/22/2013 | CN103115223A External fixing support of 350 DEG C direct burial heat-supply pipeline for preventing heat bridge transfer |
| 05/22/2013 | CN103115222A Double-sided baffle fixed support of 150 DEG C overhead heat-supply pipeline for preventing heat bridge transfer |
| 05/22/2013 | CN103115221A High-strength and heat-insulation novolac epoxy resin composition board |
| 05/22/2013 | CN103114526A Steel bridge deck pavement cold mixing maintenance material and manufacturing method thereof |
| 05/22/2013 | CN103113752A High-performance epoxy resin asphalt warm mixing agent and preparation method thereof |
| 05/22/2013 | CN103113743A Resin matrix of composite material and preparation method thereof |
| 05/22/2013 | CN103113718A High-strength thermal insulating novolac epoxy resin composition |
| 05/22/2013 | CN103113717A Preparation method of ceramic pipe network carrier in damage self-restoration of resin-base composite material |
| 05/22/2013 | CN103113716A Preparation method of dimer acid modified epoxy resin toughened carbon fiber prepreg |
| 05/22/2013 | CN103113715A Preparation method of composite material of epoxy resin and closed-cell foamed aluminum |
| 05/22/2013 | CN103113714A Epoxy pre-impregnated glass cloth belt for manufacturing nano-composite major insulation of high-voltage motor |
| 05/22/2013 | CN103113713A High-strength thermal insulating epoxy resin composition |
| 05/22/2013 | CN103113712A Preparation method and application of modified nano-silicon dioxide toughened epoxy resin |
| 05/22/2013 | CN103113711A Preparation method for low-dielectric halogen-free flame retardant glass fiber pre-impregnation material |
| 05/22/2013 | CN103113710A Method for preparing epoxy resin prepreg capable of being cured at normal temperature |
| 05/22/2013 | CN103113648A Method for manufacturing environment-friendly board by using waste PCB (Printed Circuit Board) |
| 05/22/2013 | CN103113580A Preparation method of coaxial cable structure MWCNT/Fe3O4/ZnO/PANI microwave absorbant |
| 05/22/2013 | CN103113526A Solvent-less impregnating resin for high-voltage motor and curing method |
| 05/22/2013 | CN102070876B Epoxy resin base polynary conductive composite material with ultra-low threshold value and preparation method thereof |
| 05/22/2013 | CN101818068B Phosphoro-silicate hybrid-containing composite fire retardant and preparation method thereof |
| 05/21/2013 | US8445605 Halogen-free flame retardant resin composition, and, prepreg, laminate, and laminate for printed circuit made therefrom |
| 05/21/2013 | US8445590 Compositions useful for preparing composites and composites produced therewith |
| 05/16/2013 | WO2013071122A2 Curable compositions |
| 05/16/2013 | WO2013070478A1 Bimodal toughening agents for thermosettable epoxy resin compositions |
| 05/16/2013 | WO2013069479A1 Resin composition, and prepreg and laminated sheet each produced using same |
| 05/16/2013 | WO2013068502A2 Hardeners for epoxy resin coatings |
| 05/16/2013 | WO2013068501A1 Hardeners for epoxy resin coatings |
| 05/16/2013 | WO2013068437A2 P-n-compounds as flame retardants |
| 05/16/2013 | WO2013067703A1 Polymers with carboxylic ammonium groups as latent catalysts for epoxy curing applications |
| 05/16/2013 | WO2013009114A3 Epoxy resin compound and radiant heat circuit board using the same |
| 05/16/2013 | US20130123401 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
| 05/16/2013 | US20130122308 Resin composition and uses of the same |
| 05/16/2013 | US20130121948 Association product of amino functional hydrophobic polymers with hydrophilic polymers containing acid groups, methods of preparation, and applications for employing the same |
| 05/16/2013 | US20130118787 Epoxy resin composition for forming printed circuit board, printed circuit board manufactured therefrom, and method for manufacturing the printed circuit board |
| 05/16/2013 | DE102011118760A1 Verwendung von N,N'(-Dimethyl)-Uronen sowie Verfahren zur Härtung von Epoxidharz-Zusammensetzungen Use of N, N '(- dimethyl) -Uronen as well as methods for the curing of epoxy resin compositions |
| 05/16/2013 | DE102011118501A1 Alkyl- oder Dialkyl-Semicarbazone als Härter für Epoxidharze Alkyl or dialkyl semicarbazones as curing agents for epoxy resins |
| 05/16/2013 | DE102011118490A1 Halogen-free flame-resistant epoxy resin composition useful for manufacturing moldings and/or composite materials including foils, comprises a hardener component for crosslinking the epoxy resin and a phosphorus-containing flame retardant |
| 05/16/2013 | CA2854944A1 Hardeners for epoxy resin coatings |
| 05/15/2013 | EP2592100A1 Curing agent for epoxy resin coatings |
| 05/15/2013 | CN103104790A External fixing frame arranged on 150 DEG C direct burial heat supply pipeline and used for preventing heat bridge from transferring heat |
| 05/15/2013 | CN103104788A Double-faced baffle fixing support arranged on 350 DEG C overhead heat supply pipeline and used for preventing heat bridge from transferring heat |
| 05/15/2013 | CN103104787A Single face baffle fixing support arranged on 150 DEG C overhead heat supply pipeline and used for preventing heat bridge from transferring heat |
| 05/15/2013 | CN103104785A Inner fixing knot arranged on 200 DEG C direct burial heat supply pipeline and used for preventing heat bridge from transferring heat |
| 05/15/2013 | CN103104784A Sliding support arranged on 150 DEG C heat supply overhead pipeline and used for preventing heat bridge from transferring heat |
| 05/15/2013 | CN103104783A Double-faced baffle fixing support arranged on 200 DEG C overhead heat supply pipeline and used for preventing heat bridge from transferring heat |
| 05/15/2013 | CN103102687A One-component room curing sealing material and preparation method thereof |
| 05/15/2013 | CN103102644A Self-leveling clean plastic and preparation method thereof |
| 05/15/2013 | CN103102643A Thermosetting epoxy resin composition and optical semiconductor device |
| 05/15/2013 | CN103102484A Crosslinkable polyphenyl ether resin, preparation method and use thereof |
| 05/15/2013 | CN103102471A Phosphorus-containing phenolic resin and the producing method, phenolic resin composition and cured product thereof |
| 05/15/2013 | CN103102470A Flame-retardant epoxy resin, epoxy resin composition containing the epoxy resin as essential component and cured product thereof |
| 05/15/2013 | CN103101252A Method for manufacturing CEM (Composite Epoxy Material Grade)-3 copper-clad plate with high dielectric constant and low loss |
| 05/15/2013 | CN102532606B Modified aluminum nitride filled epoxy resin composite material |
| 05/15/2013 | CN102179981B Wear-resisting high-molecular composite material |
| 05/15/2013 | CN101528604B Alumina powder, process for producing the same, and use thereof |
| 05/14/2013 | US8440781 Epdxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epdoxy resin |
| 05/14/2013 | US8440771 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
| 05/14/2013 | CA2592305C Fire-retardant low-density epoxy composition |
| 05/10/2013 | WO2013065758A1 Resin composition, and resin sheet, prepreg, laminate, metal substrate, printed circuit board and power semiconductor device using same |
| 05/10/2013 | WO2013065694A1 Resin composition, prepreg, and laminated sheet |
| 05/10/2013 | WO2013065448A1 Conductive composition, and conductive film and conductive laminate using same |