Patents
Sitemap › C08 - Organic macromolecular compounds; Their preparation or chemical working-up; Compositions based thereon › C08G - Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds › C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
07/2014
07/02/2014CN103906784A 环氧树脂组合物以及使用该环氧树脂组合物的辐射热电路板 Epoxy resin composition and the epoxy resin composition using radiation heat circuit board
07/02/2014CN103906783A 含硅固化性树脂组合物 Silicon-containing curable resin composition
07/02/2014CN103906782A 环氧树脂、环氧树脂组合物及其固化物 Epoxy resin, epoxy resin composition and cured
07/02/2014CN103898899A 用于长时间稳压化学灌浆的设备、方法及所用化学灌浆液 Equipment for long-regulator chemical grouting, chemical grouting method and the liquid
07/02/2014CN103897350A 一种热固性树脂组合物及使用其制作的半固化片及层压板 A thermosetting resin composition and the use of its production of a prepreg and laminate
07/02/2014CN103897348A 一种改性粘结材料的制备方法 A modified method for preparing the binding material
07/02/2014CN103897347A 一种热固性树脂组合物及使用其制作的预浸料及层压板 A thermosetting resin composition and the use of its production of prepreg and laminates
07/02/2014CN103897344A 用于封装半导体器件的环氧树脂组合物以及使用其封装的半导体器件 The epoxy resin composition for encapsulating a semiconductor device and a semiconductor device using encapsulates
07/02/2014CN103897337A 纳米石墨片增强形状记忆复合材料及其制备方法 Nano-graphite sheet reinforced shape memory composite material and its preparation method
07/02/2014CN103897145A 一种憎水性环氧树脂固化剂及其制备方法 A hydrophobic epoxy curing agent and its preparation method
07/02/2014CN103897144A 一种丙三醇解聚pet制备纳米复合环氧树脂固化剂的方法 One kind of glycerol depolymerization pet nanocomposite epoxy curing agent approach
07/02/2014CN103897143A 环氧树脂、环氧树脂的制造方法及其使用 Method for producing an epoxy resin, an epoxy resin and its use
07/02/2014CN103896983A 季鏻盐、包含季鏻盐用于封装半导体器件的环氧树脂组合物和用该组合物封装的半导体器件 Quaternary phosphonium salts, comprising an epoxy resin composition for encapsulating a quaternary phosphonium salt and a semiconductor device encapsulated with the composition of the semiconductor device
07/02/2014CN103242791B 一种tgbapopp型耐高温粘合剂及其制备方法 One kind tgbapopp-temperature adhesive and its preparation method
07/02/2014CN103242790B 一种耐高温云母带粘合剂及其制备方法 A high temperature mica binder and its preparation method
07/02/2014CN103173175B 一种有机硅改性环氧树脂密封胶及其制备方法 One silicone-modified epoxy sealant and preparation method
07/02/2014CN103122232B 2,2-双[4-(2,4-二氨基苯氧基)苯基]丙烷型耐高温环氧胶粘剂及其制备方法 2,2-bis [4- (2,4-aminophenoxy) phenyl] propane-temperature epoxy adhesive and its preparation method
07/02/2014CN103122231B 1,4-双(2,4-二氨基苯氧基)苯型耐高温环氧胶粘剂及其制备方法 1,4-bis (2,4-aminophenoxy) benzene-temperature epoxy adhesive and its preparation method
07/02/2014CN102994031B 一种环氧类胶黏剂 An epoxy type adhesive
07/02/2014CN102977670B 四季通用型防腐涂料用腰果酚醛酰胺环氧固化剂及其制备方法 Four Seasons general-corrosion coatings with cashew phenolic amide epoxy curing agent and its preparation method
07/02/2014CN102924690B 一种超支化聚醚型环氧树脂用于增韧增强的环氧树脂材料及其制备方法 A hyperbranched polyether epoxy resin material and method for toughening epoxy resin reinforced
07/02/2014CN102838844B 一种植物纤维增强生物质树脂基泡沫板材及其制备方法 A plant biomass fiber-reinforced resin-based foam sheet and its preparation method
07/02/2014CN102786676B 一种含支化结构的聚酯弹性体及其制备方法 Containing a branched structure and a preparation method of a polyester elastomer
07/02/2014CN102731440B 一种衣康酸二缩水甘油酯及其制备方法和应用 One kind of glycidyl itaconate and its preparation method and application
07/02/2014CN102675595B 羟基酰胺型环氧树脂热潜在固化剂及其合成方法 Hydroxy amide-type thermal latent curing agent for epoxy resins and synthetic methods
07/02/2014CN102472928B 液晶滴下工艺用液晶密封剂以及使用了该密封剂的液晶显示单元 The liquid crystal dripping process of the liquid crystal sealant, and the sealant using a liquid crystal display unit
07/02/2014CN101792572B 热固性环氧树脂组合物和半导体器件 The thermosetting epoxy resin composition and a semiconductor device
07/01/2014US8766018 Divinylarene dioxide resins
07/01/2014US8765904 Polyetheramines, compositions including polyetheramines, and methods of making
07/01/2014US8765879 Modified recycled polyester resin and molded article using the same
07/01/2014US8765835 Epdxy resin composition having monocyclic aliphatic hydrocarbon ring
06/2014
06/26/2014WO2014100245A2 Thiol-cured elastomeric epoxy resins
06/26/2014WO2014100242A1 Non-isocyanate sealant for electrical cable joining
06/26/2014WO2014099666A2 Epoxy composition
06/26/2014WO2014099542A1 Low emission epoxy curing agents
06/26/2014WO2014098099A1 Multilayer body, laminate, printed wiring board, method for producing multilayer body, and method for manufacturing laminate
06/26/2014WO2014097720A1 Paint composition and method for forming multilayered coating
06/26/2014WO2014097647A1 Sheet-like epoxy resin composition, method for manufacturing organic el device using same, organic el device and organic el display panel
06/26/2014WO2014096716A1 Catalytic systems for thermosetting resins which are deformable in the thermoset state
06/26/2014WO2014096435A2 Fast cure epoxy resin systems
06/26/2014WO2014095502A1 Insulating layer-forming composition and use thereof
06/26/2014WO2014095139A1 Use of substituted benzyl alcohols in reactive epoxy systems
06/26/2014WO2014062475A3 Toughened, curable epoxy compositions for high temperature applications
06/26/2014WO2014062409A3 Low odor epoxy resin systems based on nadic anhydride-type harneders
06/26/2014US20140179890 Use of epoxidised aryl alkyl phenols as reactive resin diluents
06/26/2014US20140179836 Epoxy compound having alkoxysilyl group, method of preparing the same, composition and cured product comprising the same, and uses thereof
06/26/2014US20140179828 Epoxy resin compositions, methods of making same, and articles thereof
06/26/2014DE102012025256A1 Use of new or known methoxy-ethane compound as comonomer in epoxy resin used as hardenable dental filler material, root canal filling material as insulator material, preferably composite adhesive for filling and/or sealing root canals
06/25/2014EP2746328A1 Epoxy resin compositions using solvated solids
06/25/2014EP2746312A2 Epoxy resin compositions, methods of making same, and articles thereof
06/25/2014EP2746287A1 Quaternary phosphonium salt, epoxy resin composition for encapsulating semiconductor device including the quaternary phosphonium salt and semiconductor device encapsulated with the epoxy resin composition
06/25/2014EP2744843A2 Curable resin compositions
06/25/2014CN103890659A 光可聚合不饱和树脂，含有该光可聚合不饱和树脂的光敏树脂组合物，以及由此制备的光屏蔽间隔和液晶显示器件 A photopolymerizable unsaturated resin containing the photopolymerizable unsaturated resin, a photosensitive resin composition, and a light shielding interval and the thus-prepared liquid crystal display device
06/25/2014CN103890649A 液晶密封剂及使用其的液晶显示单元 The liquid crystal sealing agent in the liquid crystal display unit using
06/25/2014CN103881310A 一种无卤环保热敏电阻用环氧树脂包封材料及应用 Halogen-free epoxy resin encapsulated thermistor environmental protection materials and applications
06/25/2014CN103881307A 超低密度复合材料、树脂组合物预浸料及其制备方法和用途 Ultra-low-density composite prepreg resin composition and its preparation method and use
06/25/2014CN103881305A 环氧树脂组合物 The epoxy resin composition
06/25/2014CN103881304A 具有低有机物挥发性的环氧树脂组合物 The epoxy resin composition having a low volatile organic compounds
06/25/2014CN103881303A 印刷电路基板用树脂组合物和绝缘膜及预浸料坯和印刷电路基板 A printed circuit board, and an insulating film and a resin composition for the prepreg and the printed circuit board
06/25/2014CN103881281A 热固性组合物、固化膜及滤色片 The thermosetting composition, a curing membrane filter
06/25/2014CN103881272A 一种聚氯乙烯用的有机基热稳定剂及其制备方法 One kind of organic-based heat stabilizers used in PVC and its preparation method
06/25/2014CN103881105A 一种改性环氧树脂的制备方法与应用 A preparation method and application of modified epoxy resin
06/25/2014CN103881059A 低介电树脂组合物及其应用 Low dielectric resin composition and its application
06/25/2014CN103881058A 一种高性能的水性环氧固化剂的制备方法 Method for preparing high performance waterborne epoxy curing agent
06/25/2014CN103881057A 基于环氧开环反应的有机－无机杂化多孔整体材料的制备 Preparation of the porous hybrid inorganic bulk material - an epoxy ring-opening reaction of an organic-based
06/25/2014CN103881056A 环氧树脂组合物、其制备方法及其制品 The epoxy resin composition, its preparation and its products
06/25/2014CN103881055A 一种缩水甘油醚改性的水性环氧树脂及其制备方法 An aqueous epoxy resin modified its preparation method ether
06/25/2014CN103012742B 线型酚醛环氧树脂和环氧树脂组合物 Novolac epoxy resin and epoxy resin composition
06/25/2014CN102675601B 用于qfn的低翘曲环氧树脂组合物 Low warpage of the epoxy resin composition for qfn
06/25/2014CN102675596B 一种有机硅环氧树脂固化剂及包含它的环氧固化体系 One silicone containing epoxy curing agent and epoxy curing system which
06/25/2014CN102604075B 一种水介质中制备双端羟基聚苯醚的方法及其产物与应用 The method of preparing an aqueous medium bis terminal hydroxyl groups of the polyphenylene ether and the product with Applications
06/25/2014CN102007158B 经历吸热相变以降低基于环氧树脂的组合物的反应放热量的填料的应用 Undergo an endothermic phase change to reduce the application of heat release based on the reaction of the epoxy resin composition of the filler
06/25/2014CN101679601B 含磷环氧树脂、以该环氧树脂作为必须成分的环氧树脂组合物及其固化物 Phosphorus-containing epoxy resin, an epoxy resin as an essential component in the epoxy resin composition and cured product
06/24/2014US8759422 B-stageable and skip-curable wafer back side coating adhesives
06/24/2014US8759421 Continuous process for preparing nanodispersions using an ultrasonic flow-through heat exchanger
06/24/2014US8758549 One component epoxy resin composition
06/19/2014WO2014093117A1 Modified epoxy resins
06/19/2014WO2014092704A1 Bio-based biocide compositions and methods of preserving therewith
06/19/2014WO2014092404A1 Epoxy resin composition and printed circuit board using same
06/19/2014WO2014092403A1 Epoxy resin composition, and printed circuit board using same
06/19/2014WO2014092402A1 Epoxy resin composition, and printed circuit board using same
06/19/2014WO2014092401A1 Resin composition, and printed circuit board using same
06/19/2014WO2014092095A1 Active-energy-ray-curable composition for forming optical film, optical film, and polarizing plate
06/19/2014WO2014092019A1 Composition, laminate, method for producing laminate, transistor, and method for producing transistor
06/19/2014WO2014091750A1 Curable resin composition, insulating film, prepreg, cured product, composite, and substrate for electronic material
06/19/2014WO2014091052A1 Method for producing polymer materials with structured surfaces, the materials thus produced and the applications thereof
06/19/2014WO2014090382A1 Epoxy-based compound for fastening purposes, us thereof and use of given components
06/19/2014WO2014089934A1 Halogen-free flame-retardant resin composition and use thereof
06/19/2014WO2014066457A3 Ambient cure weatherable coatings
06/19/2014WO2013192297A3 Polyfunctional sulfur-containing epoxies and compositions thereof
06/19/2014US20140171551 Epoxy Resin Compositions Using Solvated Solids
06/18/2014EP2743286A1 Resin composition for resists
06/18/2014EP2742079A1 Liquid methylenedianiline compositions
06/18/2014CN103874718A Method of producing high voltage electrical insulation
06/18/2014CN103874717A Hardeners for epoxy resin coatings
06/18/2014CN103865239A Binding material for roads
06/18/2014CN103865236A Halogen-free flame retardant solid buoyancy material and preparation method thereof
06/18/2014CN103865235A Solid buoyancy material with high impact strength and preparation method thereof
06/18/2014CN103865170A 3D (three dimensional) wide-angle orthographic-projection high-definition optical display screen and manufacturing method thereof
06/18/2014CN103865169A 3D wide-angle rear-projection high-definition optical display screen and manufacturing method thereof
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