| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 09/18/2014 | US20140275446 Hardeners for epoxy resins, which comprise aromatic amino groups |
| 09/18/2014 | US20140275343 Epoxy resin adducts and thermosets thereof |
| 09/18/2014 | US20140275342 Epoxy resin compositions, methods of making same, and articles thereof |
| 09/18/2014 | US20140275336 Low-density molding compound |
| 09/18/2014 | US20140275311 New polymers derived from renewably resourced lysinol |
| 09/17/2014 | EP2778185A2 Epoxy resin compositions, methods of making same, and articles thereof |
| 09/17/2014 | EP2776490A2 Hardeners for epoxy resin coatings |
| 09/17/2014 | EP2776489A1 Hardeners for epoxy resins, which comprise aromatic amino groups |
| 09/17/2014 | EP2776488A1 Hardeners for epoxy resin coatings |
| 09/17/2014 | EP2776487A1 Structural adhesive and bonding application thereof |
| 09/17/2014 | EP2776486A1 Hardeners for epoxy resins, which comprise pyridinyl groups |
| 09/17/2014 | EP2776485A1 Curable compositions |
| 09/16/2014 | US8835599 Segmented degradable polymers and conjugates made therefrom |
| 09/16/2014 | US8835572 Aluminum chelate latent curing agent |
| 09/16/2014 | US8835348 Alkoxylation processes and catalysts therefor |
| 09/16/2014 | US8835050 Anode substrate |
| 09/16/2014 | US8834971 Process for continuous preparation of a prepolymer based on phenolic resins, oxazolines and epoxides |
| 09/12/2014 | WO2014136897A1 Photosensitive resin composition, dry film using same, printed wiring board, and method for producing printed wiring board |
| 09/12/2014 | WO2014136773A1 Epoxy resin composition, cured product, heat radiating material, and electronic member |
| 09/12/2014 | WO2014136693A1 Polycarboxylic acid composition, curing agent composition for epoxy resins, and epoxy resin composition and cured product thereof |
| 09/12/2014 | WO2014136667A1 Sealing agent for liquid crystal dropping methods, vertically conducting material, and liquid crystal display element |
| 09/12/2014 | WO2014136657A1 Curable epoxy resin composition for impregnation use |
| 09/12/2014 | WO2014135268A1 Method for producing a pipe |
| 09/11/2014 | US20140256909 Curable compositions |
| 09/11/2014 | US20140256856 Liquid epoxy resin formulations |
| 09/10/2014 | EP2774939A1 Two-pack type epoxy resin composition for fiber-reinforced composite materials, and fiber-reinforced composite material |
| 09/10/2014 | EP2774938A1 Resin composition, prepreg, and laminated sheet |
| 09/10/2014 | EP2773682A1 Liquid epoxy resin formulations |
| 09/09/2014 | US8829212 Method of separating solid salt from epoxy resin solutions |
| 09/09/2014 | US8829123 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
| 09/09/2014 | US8829122 Polyurethane polymer based on an amphiphilic block copolymer and its use as impact modifier |
| 09/09/2014 | US8828806 Dam composition for use with multilayer semiconductor package underfill material, and fabrication of multilayer semiconductor package using the same |
| 09/09/2014 | US8828500 Photocurable resin composition for sealing organic EL device |
| 09/09/2014 | US8828268 Use of molecules having associative groups as hardeners for thermosetting resins |
| 09/09/2014 | US8828267 Use of a stereoisomer mixture of diaminomethylcyclohexane as a hardener for epoxy resins |
| 09/09/2014 | CA2776210C Method for producing fibre-reinforced composite material, and heat-resistant mold material and heat-resistant structural material using the fiber-reinforced composite material |
| 09/04/2014 | WO2014133992A2 Anhydride accelerators for epoxy resin systems |
| 09/04/2014 | WO2014131780A1 Composition and method of making water borne epoxy hardener for use in two-component epoxy self levelling compounds with long pot life, fast cure and low shrinkage characteristics |
| 09/04/2014 | WO2014131674A2 Amine composition |
| 09/03/2014 | EP2772505A1 Photocurable resin composition and novel siloxane compound |
| 09/02/2014 | US8822634 Copolymer comprising anthracene and benzoselenadiazole, preparing method and uses thereof |
| 08/28/2014 | WO2014100245A3 Thiol-cured elastomeric epoxy resins |
| 08/28/2014 | US20140243456 Anhydride Accelerators for Epoxy Resin Systems |
| 08/27/2014 | EP2770024A1 Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same |
| 08/27/2014 | EP2770005A1 Epoxy resin composition and high frequency electronic-circuit substrate manufactured by using the same |
| 08/27/2014 | EP2768856A1 Peg conjugates of exenatide |
| 08/26/2014 | US8816038 Aromatic ether polymer, method for producing the same, and polymer composition |
| 08/26/2014 | US8815400 Epoxy resin composition, die attach method using same, and semiconductor device containing cured product thereof |
| 08/26/2014 | US8815066 Coating composition with phosphorous-containing resins and organometallic compounds |
| 08/21/2014 | WO2014126717A1 Compositions useful for preparing composites and composites produced therewith |
| 08/21/2014 | WO2014126626A1 Phenolic epoxy compounds |
| 08/21/2014 | WO2014126366A1 Epoxy resin composition and light-emitting apparatus using the same |
| 08/21/2014 | WO2014125044A1 Fire retardant epoxy resin formulations and their use |
| 08/21/2014 | US20140235811 Raw materials and methods of manufacturing bio-based epoxy resins |
| 08/20/2014 | EP2768031A1 Light-emitting device, method for manufacturing same, molded body and sealing member |
| 08/20/2014 | EP2767552A1 Composition and film comprising same |
| 08/19/2014 | US8809488 Carboxylated polymers of intrinsic microporosity (PIMs) with tunable gas transport properties |
| 08/19/2014 | US8809470 Polymerizable composition |
| 08/19/2014 | US8809467 Organic layer composition and liquid crystal display using the same |
| 08/19/2014 | US8809422 Epoxy resin curing indicator composition |
| 08/14/2014 | WO2014100239A3 Non-isocyanate sealant for glass sealing |
| 08/14/2014 | WO2014100238A3 Phase-segmented non-isocyanate elastomers |
| 08/14/2014 | WO2014096435A3 Fast cure epoxy resin systems |
| 08/13/2014 | EP2765162A1 Curable composition having high fracture strength |
| 08/13/2014 | EP2765148A1 Coatings based on epoxy and a method for their preparation and their uses |
| 08/13/2014 | EP2764033A1 Epoxy resin compositions, containing a 2-oxo-[1,3]dioxolane derivative |
| 08/13/2014 | CN103987754A 固化性树脂组合物 The curable resin composition of the |
| 08/13/2014 | CN103987753A 树脂组合物、预浸料和层叠板 The resin composition, prepreg and laminated plate |
| 08/13/2014 | CN103987752A 环氧树脂混合物、环氧树脂组合物、预浸料及它们的固化物 The mixture of epoxy resin, the epoxy resin composition, a prepreg cured product thereof |
| 08/13/2014 | CN103987751A 复合结构用表面膜以及其制造方法 Table mask and a manufacturing method of composite structures |
| 08/13/2014 | CN103980708A 用于集成电路的无卤阻燃热固性树脂组合物、半固化片及层压板 Halogen-free flame retardant for an integrated circuit thermosetting resin composition, a prepreg and laminate |
| 08/13/2014 | CN103980704A 用于高频高速基板的无卤树脂组合物、半固化片及层压板 Halogen-free resin composition for a high throughput rate of the substrate, a prepreg and laminates |
| 08/13/2014 | CN103980669A 环氧树脂板的制备方法 Preparation of epoxy board |
| 08/13/2014 | CN103980667A 集成电路用热固性树脂组合物、半固化片及层压板 IC with a thermosetting resin composition, a prepreg and laminate |
| 08/13/2014 | CN103980666A 一种适用于rtm工艺的高韧性环氧树脂组合物及制备方法 One for rtm process high toughness epoxy resin composition and preparation methods |
| 08/13/2014 | CN103980665A 一种水溶性抗菌复合材料及其制备方法 A water-soluble antibacterial composite material and its preparation method |
| 08/13/2014 | CN103980472A 含芴的环氧丙烯酸酯低聚物及其制备方法和应用 Epoxy acrylate oligomer and its preparation method and application fluorene |
| 08/13/2014 | CN103980464A 一种大分子环氧树脂固化剂及其制备方法 Macromolecules epoxy curing agent and its preparation method |
| 08/13/2014 | CN103980463A 一种环氧树脂无溶剂低温固化剂及其制备方法与应用 An epoxy resin solvent-free low temperature curing agent and its preparation method and application |
| 08/13/2014 | CN103980462A 一种制备低水解氯溴化环氧树脂的方法 A method of low brominated epoxy resin prepared by the hydrolysis of chlorine |
| 08/13/2014 | CN103980231A 一种五氟苯基环氧丙烷的合成方法 A method of synthesizing pentafluorophenyl propylene oxide |
| 08/13/2014 | CN103980103A 酚化合物、环氧树脂、环氧树脂组合物、预浸料及它们的固化物 Phenolic compounds, epoxy resins, the epoxy resin composition, a prepreg cured product thereof |
| 08/13/2014 | CN103146330B 2,2-双[4-(2,4-二氨基苯氧基)苯基]六氟丙烷型耐高温环氧胶粘剂及其制备方法 2,2-bis [4- (2,4-aminophenoxy) phenyl] hexafluoropropane-temperature epoxy adhesive and its preparation method |
| 08/13/2014 | CN103059798B 改性环氧树脂改性醇溶性聚氨酯胶黏剂的制备方法 Preparation of modified epoxy-modified polyurethane adhesive alcohol |
| 08/13/2014 | CN102822236B 聚酰胺固化剂组合物 Polyamide curing agent composition |
| 08/13/2014 | CN102741313B 环氧树脂固化组合物和包含其的环氧树脂体系 And a cured epoxy resin composition comprising an epoxy resin system which |
| 08/13/2014 | CN102695739B 可固化环氧树脂组合物 The curable epoxy resin composition |
| 08/13/2014 | CN102574982B 新硫基化合物及其制备方法 The new sulfur compounds and methods |
| 08/13/2014 | CN102348736B 半导体封装用树脂组合物和半导体装置 The resin composition for semiconductor encapsulation and a semiconductor device |
| 08/12/2014 | US8803159 Light-emitting device and method for manufacturing same |
| 08/12/2014 | US8802792 Partially hydrogenated bisphenol-A-based polymers as substitutes for bisphenol-A-based polymers |
| 08/12/2014 | CA2654017C Assembly of prepregs for producing structures, for example ones which deploy through inflation |
| 08/07/2014 | WO2014117351A1 An epoxy resin composition,and its applications |
| 08/07/2014 | WO2014072308A3 Aqueous dispersions of a multifunctional primary amine, process for its preparation, and use therof |
| 08/07/2014 | WO2014066456A3 Adduct curing agents |
| 08/07/2014 | WO2014064200A3 Epoxy resins crosslinkable at room temperature |
| 08/07/2014 | WO2013190260A3 Polyphosphazenes |
| 08/07/2014 | WO2013188255A3 Low-viscosity phenolic diglycidyl ethers for epoxy coating applications |
| 08/07/2014 | US20140221582 Hydroxyphenyl Phosphine Oxide Mixtures and Their Use as Flame Retardants for Epoxy Resins |
| 08/06/2014 | EP2762512A1 Reaction accelerator for a copolymerization, electrical insulation tape, electrical insulation body and consolidation body |