Patents for B24B 1 - Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes (7,565)
02/2007
02/08/2007WO2006039413A3 Cmp pade dresser with oriented particles and associated methods
02/08/2007US20070032177 Wafer processing apparatus and wafer processing method using the same
02/08/2007US20070032175 Polishing cloth, polishing cloth processing method, and substrate manufacturing method using same
02/08/2007US20070032174 Polishing apparatus
02/08/2007US20070032173 Method of finishing cutting elements
02/08/2007US20070032172 Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods
02/08/2007US20070032171 Methods and systems for conditioning planarizing pads used in planarizing susbstrates
02/08/2007DE102005036779A1 Flat glass substrates treatment comprises removing material on at least one side by polishing
02/08/2007CA2617091A1 Grinding media and methods associated with the same
02/07/2007CN1910011A Chemical mechanical planarization process control utilizing in-situ conditioning process
02/07/2007CN1299336C Grinding process for back of wafer
02/07/2007CN1299335C Method and pad for polishing wafer
02/07/2007CN1298509C Multi-position micro-hole machining method and apparatus
02/06/2007US7172497 Fabrication of semiconductor interconnect structures
02/06/2007US7172491 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
02/01/2007US20070026771 Edge buster series round blade sharpener and the edge tracker sharpener
02/01/2007US20070026770 Abrasive agglomerate polishing method
01/2007
01/31/2007CN1905989A Polishing method and polishing film used in such polishing method
01/31/2007CN1297370C Chamfer processing method for rectangular plate
01/30/2007US7169028 Flexible finishing shoe
01/30/2007US7169026 End face polishing apparatus
01/30/2007US7169023 Method and apparatus for manufacturing hourglass worm rolling die
01/30/2007US7169022 Method and apparatus for creating a groove in a collector ring of an electrical device
01/30/2007US7169019 Method of monitoring surface status and life of pad by detecting temperature of polishing interface during chemical mechanical process
01/30/2007US7169017 Polishing pad having a window with reduced surface roughness
01/25/2007US20070021041 Dressing method in vertical duplex-head surface grinding machine
01/25/2007US20070021039 Glass etching
01/25/2007US20070021038 Cmp apparatus and process sequence method
01/23/2007US7166018 Apparatus and method for feeding slurry
01/23/2007US7166017 Slurry for CMP, polishing method and method of manufacturing semiconductor device
01/23/2007US7166015 Apparatus and method for controlling fluid material composition on a polishing pad
01/23/2007US7166013 Polishing apparatus and method for producing semiconductors using the apparatus
01/23/2007US7165317 Electrode extension sheet for use in a lapping apparatus
01/18/2007WO2007008822A2 Enhanced end effector arm arrangement for cmp pad conditioning
01/18/2007WO2007007683A1 Substrate, and method and device for polishing same
01/18/2007US20070015446 Systems and methods for removing microfeature workpiece surface defects
01/18/2007US20070015445 Sharpening guidelines for blades
01/18/2007US20070015442 Method and apparatus for measuring abrasion amount and pad friction force of polishing pad using thickness change of slurry film
01/18/2007DE19882111B4 Verwendung einer Vorrichtung zur Herstellung eines reproduzierbaren Oberflächenfinish einer Testoberfläche Use of a device for producing a reproducible surface finishing of a test surface
01/17/2007EP1742765A1 Backup shoe for microfinishing and methods
01/17/2007CN1895916A Jade Chinese-traditional painting and its production
01/17/2007CN1295762C Process for grinding metal layer
01/17/2007CN1295758C CMP sizing material, polishing method and method for manufacturing semiconductor device
01/16/2007USRE39471 Apparatus for and method for polishing workpiece
01/16/2007US7163448 Chemical/mechanical polishing method for STI
01/16/2007US7163447 Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces
01/16/2007US7163445 Apparatus and method for fabricating liquid crystal display panel
01/16/2007US7163442 Method of making micro titer plates and micro titer plates made thereby
01/16/2007US7163440 Apparatus and method for polishing a fiber optic connector
01/16/2007US7163439 Methods and systems for conditioning planarizing pads used in planarizing substrates
01/16/2007US7163438 Zone polishing using variable slurry solid content
01/16/2007US7163435 Real time monitoring of CMP pad conditioning process
01/11/2007US20070010181 Independent edge control for CMP carriers
01/11/2007US20070010176 Fixed abrasive pad having different real contact areas and fabrication method thereof
01/11/2007US20070010175 Polishing pad and method of producing same
01/11/2007US20070010173 Apparatus for forming microscopic recesses on a cylindrical bore surface and method of forming the microscopic recesses on the cylindrical bore surface by using the apparatus
01/11/2007US20070010172 Enhanced end effector arm arrangement for CMP pad conditioning
01/11/2007US20070010168 Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
01/11/2007US20070010167 Method and apparatus for reconditioning digital discs
01/11/2007US20070010098 Use of CMP for aluminum mirror and solar cell fabrication
01/11/2007US20070006682 Mold knife preservation system and method
01/10/2007CN2855636Y Grinding machine with micro-feeding and quick drawing-back device
01/10/2007CN1891397A Gecko-type electromagnetic electric-driving machine product series
01/10/2007CN1294629C Silicon semiconductor crystal wafers and manufacturing method for multiple semiconductor crystal wafers
01/09/2007US7160181 Polishing pad of CMP equipment for polishing a semiconductor wafer
01/09/2007US7160179 Methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
01/09/2007US7160178 In situ activation of a three-dimensional fixed abrasive article
01/09/2007US7160177 Method and device for the high-precision machining of the surface of an object, especially for polishing and lapping semiconductor substrates
01/09/2007US7160176 Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate
01/04/2007WO2007001700A2 Polishing pad comprising magnetically sensitive particles and method for the use thereof
01/04/2007WO2007001699A1 Tranparent microporous materials for cmp
01/04/2007US20070004323 Polishing composition and polishing method
01/04/2007US20070004322 Polishing composition and polishing method
01/04/2007US20070004319 Tire uniformity machine grinding assembly
01/04/2007US20070004318 Free curved surface precision machining tool
01/04/2007US20070000392 Roller shaft for a vegetable peeler
01/03/2007EP1568074A4 Carrier head for chemical mechanical polishing apparatus
01/03/2007EP1450945B1 Method and apparatus for increasing and modulating the yield shear stress of electrorheological fluids
01/02/2007US7156975 Polishing method and electropolishing apparatus
01/02/2007US7156724 Method and apparatus for forming a dynamic magnetic seal using magnetorheological fluid
01/02/2007US7156722 Platen structure of polishing apparatus for processing semiconductor wafer and method for exchanging polishing pad affixed to the same
01/02/2007US7156721 Polishing pad with flow modifying groove network
12/2006
12/28/2006WO2006137453A1 Grinding device using ultrasonic vibration
12/28/2006US20060292969 Dressing tool, dressing device, dressing method, processing device and semiconductor device producing method
12/28/2006US20060292968 Apparatus and method for manufacturing magnetic head slider and polishing device
12/27/2006CN2850821Y Dry sand dust-absorbing flatform
12/27/2006CN1886232A Method of abrading a workpiece
12/27/2006CN1292460C Slurry for CMP, polishing method and method of manufacturing semiconductor device
12/26/2006US7153410 Alternating current, direct current power sources; switches
12/26/2006US7153335 Tunable composition and method for chemical-mechanical planarization with aspartic acid/tolyltriazole
12/26/2006US7153197 Method for achieving uniform CU CMP polishing
12/26/2006US7153196 Method of polishing using a polishing agent
12/26/2006US7153195 Methods and apparatus for selectively removing conductive material from a microelectronic substrate
12/26/2006US7153194 Workpiece grinding method which achieves a constant stock removal rate
12/26/2006US7153193 System and apparatus for selectively sensing and removing asperities from hard disk drive media utilizing active thermally controlled flying heights
12/26/2006US7153192 Method for selectively sensing and removing asperities from hard disk drive media utilizing active thermally controlled flying heights
12/26/2006US7153191 Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods
12/26/2006US7153185 Substrate edge detection
12/26/2006US7153183 Method and apparatus for lapping gears
12/21/2006WO2006134234A2 Method for grinding a variable crown roll
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