Patents for B23K 1 - Soldering, e.g. brazing, or unsoldering (16,089)
02/2000
02/16/2000CN1244729A Method and apparatus for isolating wet sensitive plastic ball grid array device
02/16/2000CN1049378C Automatic soldering apparatus
02/10/2000WO2000007418A1 Method for brazing by solder reflow electronic components using pre-deposits of solder alloy and brazing device therefor
02/10/2000WO2000006333A1 Method for brazing by solder reflow electronic components and brazing device therefor
02/10/2000CA2338181A1 Method for brazing by solder reflow electronic components using pre-deposits of solder alloy and brazing device therefor
02/10/2000CA2338157A1 Method for brazing by solder reflow electronic components and brazing device therefor
02/09/2000EP0978342A2 Method and assembly for brazing a stator component of a gas turbine engine
02/09/2000CN1244249A Heat exchanger core based on aluminum and process for producing the same
02/09/2000CN1243777A High-frequency heating and pressurizing technology and equipment for soldering ring and planar parts made of different metals
02/08/2000US6023663 Method and apparatus for inspecting a solder joint using a correlation neural network
02/08/2000US6021940 Method and apparatus for reflow soldering metallic surfaces
02/08/2000US6021939 Method of producing a wear resistant mechanical component
02/03/2000WO1999059758A9 Device for the laser processing of materials
02/03/2000DE19912718C1 Soldering device for flat component group e.g. ball grid array components
02/02/2000EP0976486A1 Method and apparatus for applying flux for use in brazing aluminium material
02/02/2000CN1049013C Solder recovery
02/01/2000US6020076 Joined ceramic structures and a process for the production thereof
02/01/2000US6019856 Solderless aluminum brazing
02/01/2000US6019275 Method and system for introducing flux onto at least one surface of a solder pump
02/01/2000US6019272 Method for attaching a terminal connector to a metallic surface
01/2000
01/27/2000WO2000003829A1 Solder ball placement apparatus
01/27/2000DE19925652A1 Soldering method for manufacture of electronic circuit
01/27/2000DE19832887A1 Setting parameter values for a soldering station, with the target soldering temperature set by entering of a code via a code reader directly connected to the temperature control unit of the soldering tool
01/27/2000CA2341899A1 Solder ball placement apparatus
01/26/2000EP0871542B1 Process for manufacturing a honeycombed body from two different types of sheet metal
01/25/2000US6018144 Method of conveying moieties through an IR conveyor furnace with controlled temperature profile for large area processing multichip modules
01/25/2000US6016668 Method for dissolving a hardened glass solder, method for separating components joined by a glass solder, method for disassembling a fuel cell
01/18/2000US6015966 Circuit board heating apparatus
01/18/2000US6015082 Surfaces coated with thin layers of metals or alloys, compressed and heated above the melting points to form solder joints
01/18/2000CA2191291C Furnace
01/13/2000DE19931287A1 Method and apparatus for wave soldering
01/12/2000CN1241111A Soldering device
01/11/2000US6013381 Lead-tin alloy solder having fluorine deposited on exposed surface by dissociative adsorption
01/11/2000US6012624 Solder apparatus and method
01/11/2000US6012511 Heat exchanger formed by brazing a provisional assembly and method of manufacturing the same with a brazing defect suppressed
01/06/2000WO2000001208A1 Assembly of an electronic component with spring packaging
01/06/2000WO2000000318A1 Methods and apparatus for coating the seams of welded tubes
01/06/2000CA2335519A1 Methods and apparatus for coating the seams of welded tubes
01/05/2000EP0969525A1 thermoelectric module
01/05/2000EP0968787A1 Method and apparatus for connecting communication pipes for heat exchanger
01/05/2000EP0968072A1 Soldering paste for producing geometrical metal structures with precise contours
01/04/2000US6010578 Flux for brazing aluminum members
01/04/2000US6010340 Solder column tip compliancy modification for use in a BGA socket connector
01/04/2000US6010061 Reflow soldering method
01/04/2000US6010058 BGA package using a dummy ball and a repairing method thereof
12/1999
12/30/1999DE19855938C1 Arrangement for detecting melting point of solder for making connections in electronic equipment
12/29/1999EP0967042A2 Portable electric desoldering tool
12/29/1999EP0966337A1 Method and device for heat-treating workpieces with hot steam
12/29/1999EP0859680B1 Method of dissolving a hardened glass solder, method of separating components joined by a glass solder, method of dismantling a fuel cell and device for dismantling a fuel cell
12/29/1999CN1239911A Method and apparatus for connecting communication pipes for heat exchanger
12/28/1999US6007301 Titanium-aluminum alloy turbine rotor; steel rotor shaft
12/28/1999US6006639 Solder placement apparatus and method
12/28/1999US6006430 Aluminum heat exchanger
12/23/1999WO1999065634A1 Method for controlling heat transfer on a work piece during condensation soldering
12/23/1999DE19826417A1 Durchlaufofen Continuous furnace
12/22/1999EP0965408A2 Continuous furnace
12/22/1999EP0921888A4 Portable electric desoldering tool
12/22/1999EP0815713B1 Device for separating components from a substrate, in particular for unsoldering electronic components
12/22/1999CA2273537A1 Portable electric desoldering tool
12/21/1999US6005224 Method of soldering components to at least one carrier
12/21/1999CA2142943C Method of depositing solid substance on a substrate
12/16/1999WO1999064146A1 Method for producing a compact catalytic reactor
12/15/1999EP0964608A2 Method for laser soldering
12/15/1999EP0906633B1 Switching contact system for a low voltage power switch with flexible conductors
12/15/1999CN1047462C Process for bonding contact layer and metal contact base,and suitable contact layer
12/12/1999CA2274339A1 Method for laser soldering
12/09/1999WO1999063795A1 Method for producing wirings having solder bumps
12/09/1999WO1999063588A1 Method for remelting solder layers
12/09/1999DE19825102A1 Verfahren zur Herstellung eines kompakten katalytischen Reaktors A method for producing a compact catalytic reactor
12/08/1999CN1237874A Soldering apparatus, and agent and method for separating solder and solder oxides
12/07/1999US5998758 Laser soldering head in an automatic soldering installation
12/07/1999US5998228 Method of testing semiconductor
12/07/1999US5998041 Joining layer is composed mainly of nickel, and the joining layer contains beryllium as an activating component.
12/07/1999US5996219 Method for embedding electric or optical components in high-temperature metals
12/02/1999WO1999061195A1 Cobalt-chromium-palladium-based brazing alloys
12/02/1999DE19826520C1 Verfahren zum Steuern der Wärmeübertragung auf ein Werkstück beim Dampfphasenlöten A method of controlling heat transfer to a work piece during vapor phase soldering
12/02/1999DE19823635A1 Fabrication of radiator for bathrooms
12/02/1999DE19823527A1 Fluxless reflow soldering of electronic components to substrates
12/02/1999CA2333630A1 Cobalt-chromium-palladium-based brazing alloys
12/01/1999EP0960681A1 Reflow method and reflow device
12/01/1999EP0960680A2 Method for manufactoring heads of pressed metal plate radiator elements
12/01/1999EP0801599B1 Heat exchanger and method for the manufacturing thereof
11/1999
11/30/1999US5993500 Flux management system
11/30/1999US5992729 Tacking processes and systems for soldering
11/25/1999WO1999060323A1 Aluminum alloy composition, article and method of use
11/25/1999WO1999059768A1 Light-beam welding device
11/25/1999WO1999059758A2 Device for the laser processing of materials
11/25/1999DE19919957A1 Apparatus for soldering items e.g. printed circuit boards by the reflow process
11/25/1999DE19823447A1 Filling sub-mm cavities in circuit board coating with solder
11/25/1999DE19823000A1 Method of soldering an arrangement contg. a honeycomb body in a casing tube
11/24/1999EP0958879A2 Method for brazing aluminum tube assemblies
11/24/1999EP0958089A2 Device for the selective, contactless soldering and unsoldering of components
11/23/1999US5991101 UV-resistant jointing technique for lenses and mounts
11/23/1999US5990560 Method and compositions for achieving a kinetically controlled solder bond
11/18/1999DE19921569A1 Two metal element device for e.g. heat exchanger of motor vehicle
11/17/1999EP0956177A1 Method for determining the wetting force during a soldering process
11/17/1999CN1235371A Die boning apparatus
11/16/1999US5986233 Susceptor heating device for electron beam brazing
11/16/1999US5984166 Process for creating fine and coarse pitch solder deposits on printed ciruit boards
11/16/1999US5984165 Method of bonding a chip part to a substrate using solder bumps