Patents for B23K 1 - Soldering, e.g. brazing, or unsoldering (16,089)
08/2000
08/23/2000EP1029625A2 Muffle convection brazing and annealing system and method
08/23/2000EP1028929A1 Metal-aluminium-nitride assembly with rare earth nitride present in the interface to ensure heat transfer
08/23/2000EP0827437B1 Nickel-chronium-based brazing alloys
08/23/2000CN1264330A Ratchet mechanism with laminated parts and method of making same
08/23/2000CN1055647C Valve, in particular expansion valve for refrigerating systems, and method for manufacture thereof
08/22/2000US6107596 Method for producing a welded-brazed combustion chamber
08/22/2000US6106960 Joined articles, corrosion-resistant joining materials and process for producing joined articles
08/22/2000US6106281 Method of reducing the flow of gas needed for a chamber with controlled temperature and controlled composition of gas
08/22/2000US6105850 Aluminum brazing method which avoids waste water
08/22/2000US6105848 Wire bonding method, wire bonding apparatus and semiconductor device produced by the same
08/22/2000US6105847 Nozzle structure of repair apparatus for semiconductor package
08/22/2000CA2204308C Ultrasonic vibration soldering apparatus and resonator used therein
08/16/2000CN1262978A Method for fixing swivel pin and its device and muffetee consisting of articulated chain link
08/15/2000US6103967 Thermoelectric module and method of manufacturing the same
08/15/2000US6102273 Die bonding apparatus
08/10/2000WO2000045987A1 Brazing composite material and brazed structure
08/10/2000DE19934760A1 Verfahren zur Bindung von Silicumnitrid an Kohlenstoffstahl A process for the binding of silicon nitride to carbon steel
08/09/2000EP1025947A2 Method for producing a welded-brazed construction
08/09/2000EP1024919A1 R
08/08/2000US6100496 Method and apparatus for bonding using brazing material
08/03/2000WO2000045106A1 Manifold for heat exchanger
08/03/2000WO2000044522A1 Metal foil connection and solder grain fraction for metal foil connection
08/03/2000DE19903184A1 Metallfolienverbindung und Metallfolien-Lotkornfraktion für Metallfolien Metal foil compound and metal foil Lotkornfraktion for metal films
08/03/2000CA2359233A1 Manifold for heat exchanger
08/02/2000EP1024337A1 Heat exchanger
08/02/2000EP1023964A1 Method and apparatus for fixing a joint shaft, strap band composed of articulated links manufactured by this apparatus
08/02/2000EP1023821A1 Method for connecting surface mount components to a substrate
08/02/2000EP1023137A1 Improving fillet forming of brazeable aluminum articles
08/02/2000EP1023136A1 Flux management system
08/01/2000US6095406 Process for the production of a honeycomb body from two differently constructed kinds of sheet metal layers
08/01/2000US6095405 Method for soldering integrated circuits
08/01/2000US6095403 Circuit board component retention
07/2000
07/27/2000WO2000043156A1 Method and apparatus for dispensing material in a printer
07/27/2000DE19903957A1 Solder removal from a circuit board, especially after desoldering of defective ball grid array, flip-chip and chip-scale package components, comprises molten solder displacement from solder regions using a slide or stamp element
07/27/2000DE19901623A1 Verfahren und Vorrichtung zur thermischen Verbindung von Anschlußflächen zweier Substrate Method and apparatus for the thermal connection of connecting surfaces of two substrates
07/27/2000DE19850595A1 Verfahren zum Laserlöten und zur Temperaturüberwachung von Halbleiterchips sowie nach diesem Verfahren hergestellte Chipkarte A method of laser soldering and for monitoring the temperature of the semiconductor chip produced by this method as well as smart card
07/27/2000CA2359953A1 Method and apparatus for dispensing material in a printer
07/26/2000EP1021268A1 Process of using an active solder alloy
07/25/2000US6093904 Apparatus and method for surface treatment, and apparatus and method for wire bonding using the surface treatment apparatus
07/25/2000US6092714 Method of utilizing a plasma gas mixture containing argon and CF4 to clean and coat a conductor
07/25/2000US6092556 Multi-wall tube
07/20/2000WO2000042464A1 Method for constructing an optoelectronic assembly
07/20/2000WO2000041834A1 Method and device for thermally connecting the contact surfaces of two substrates
07/19/2000EP0907452B1 Process for cooling soldered objects
07/18/2000US6091044 System for monitoring and controlling a welding/brazing operation
07/18/2000US6089445 Method and device for dry fluxing of metallic surfaces before soldering or tinning
07/18/2000US6089442 Electrode connection method
07/18/2000CA2259043A1 Apparatus and method for non-destructive, low stress removal of soldered electronic components
07/18/2000CA2041018C Ultrasonic rotary horn
07/13/2000WO2000040343A1 Apparatus and method for applying flux to a substrate
07/13/2000WO2000029352A3 Method for joining ceramic to metal
07/13/2000DE19937730C1 High temperature latent heat storage device, especially for use in space, comprises graphite or ceramic container brazed to lid by a gold- or copper-based active brazing material
07/13/2000CA2258403A1 Printed circuit board header attachment station
07/11/2000US6087596 Solder joints for printed circuit boards having intermediate metallic member
07/11/2000CA2176441C Infrared shield for capacitors
07/06/2000WO2000038875A1 Brazing composition and method for brazing parts made of alumina-based materials with said composition
07/06/2000WO2000038874A1 Method for partially or completely coating the surfaces of components produced from aluminum or its alloys with solders, fluxing agents or binders for brazing
07/06/2000DE19859735A1 Verfahren zur partiellen oder vollständigen Beschichtung der Oberflächen von Bauteilen aus Aluminium und seinen Legierungen mit Lot, Fluß- und Bindemittel zur Hartverlötung Method for partial or complete coating of the surfaces of components made of aluminum and its alloys with solder, flux and binding agent for brazing
07/05/2000EP1016488A2 Heating apparatus for a welding operation
07/05/2000EP1015159A1 Solder ball placement apparatus
07/05/2000CN1259067A Method for producing a metallic honeycomb element by means of a gas permeable soldering foil
07/04/2000US6084224 In-situ closed loop temperature control for induction tempering
07/04/2000US6084214 Reflow solder convection oven multi-port blower subassembly
07/04/2000US6083848 Removing solder from integrated circuits for failure analysis
07/04/2000US6082608 Solder bonding/debonding nozzle insert
07/04/2000US6082607 Soldering method and apparatus
07/04/2000US6082606 Method and machine for wave soldering or tinning
07/04/2000US6082447 Heat exchanger member and baffle installation method therefor
06/2000
06/28/2000CN1053804C Metallic evacuated double-walled vessel and production method therefor
06/27/2000US6081052 Rotor for rotating machine, process for producing the same, and magnet unit
06/27/2000US6080956 Fiber optic light beam heating apparatus with adjustable lens position
06/27/2000CA2137980C Metal surface dry fluxing method and device for use before brazing or tinning
06/22/2000WO2000008684A9 High performance flip chip package
06/20/2000US6078020 Apparatus and method for manufacturing semiconductor device
06/20/2000US6076726 Pad-on-via assembly technique
06/15/2000WO2000034001A1 Microwave brazing process and brazing composition for tsp diamond
06/15/2000WO2000033998A1 Assembling tubes by coring
06/15/2000WO2000033997A1 Honeycomb structure, method of forming a honeycomb structure and method of joining aluminium or aluminium alloy bodies
06/14/2000EP1008675A1 Copper pretreatment for tin solder alloy deposition
06/14/2000EP1008414A2 Solder ball connections and assembly process
06/14/2000EP1007919A1 Method and apparatus for improved temperature control in rapid thermal processing (rtp) systems
06/14/2000EP1007285A1 Ratchet mechanism with laminated parts and method of making same
06/13/2000US6074604 Brazing material for stainless steel
06/13/2000US6074500 Method for producing a metal component made up of two partial elements
06/13/2000US6074203 Method for supplying gas to a chamber and method for regulating the content of a given element in the atmosphere of such a chamber
06/13/2000US6073832 Soldering method and apparatus
06/07/2000CN1053314C Appts. for cleaning and drying printed circuit boards
06/07/2000CN1053128C Process of two layer lead soldered tube
06/06/2000US6070788 Method of soldering terminal faces, as well as a method of manufacturing a solder alloy
06/06/2000US6070321 Solder disc connection
06/02/2000WO2000020154A9 Method and apparatus for placing solder balls on a substrate
05/2000
05/31/2000EP1004390A1 Method of making a braze sheet
05/31/2000EP1004386A1 Brazed assembly and method of making same
05/31/2000EP1003622A1 Assembling electroconductive parts by electric current heating
05/31/2000EP0877908B1 Plate fin heat exchanger
05/30/2000US6068175 System for replacing a first area array component connected to an interconnect board
05/25/2000WO2000029801A1 Baffle for heat exchanger and installation method thereof
05/25/2000WO2000029800A1 Heat exchanger mounting bracket with integrated inlet/outlet block and locating sleeve
05/25/2000WO2000029352A2 Method for joining ceramic to metal
05/24/2000EP1002612A1 Kinetically controlled solder bonding